公开(公告)号：US07613372B2

公开(公告)日：2009-11-03

申请号：US11870404

申请日：2007-10-10

Applicant: Xin Simon Luo ,  Pei Chuang Chen ,  Leming Wang ,  Zhijie Wang

Inventor： Xin Simon Luo ,  Pei Chuang Chen ,  Leming Wang ,  Zhijie Wang

IPC: G02B6/32

CPC classification number: G02B6/4204 ,  G02B6/32 ,  G02B6/4212

Abstract: A coupling apparatus includes a lens disposed between a port, such as a photodetector, and a light source, such as a fiber. The lens is aligned such that light emitted from the light source is focused by the lens onto the port. Between the lens and light source and/or lens and port, a low contrast medium is disposed to reduce reflection that could degrade signal strength.

Abstract translation: 耦合装置包括设置在诸如光电检测器的端口和诸如光纤的光源之间的透镜。 镜头对齐，使得从光源发射的光被透镜聚焦到端口上。 在透镜和光源和/或透镜和端口之间，设置低对比度介质以减少可能降低信号强度的反射。

公开(公告)号：US09397066B2

公开(公告)日：2016-07-19

申请号：US14693881

申请日：2015-04-23

Applicant: Zhijie Wang ,  Zhigang Bai ,  Huchang Zhang

Inventor： Zhijie Wang ,  Zhigang Bai ,  Huchang Zhang

IPC: B23K31/02 ,  H01L23/00 ,  B23K31/12 ,  B23K37/047 ,  B23K20/00

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K31/12 ,  B23K37/047 ,  B65H51/18 ,  B65H2701/36 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2224/78631 ,  H01L2224/789 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.

Abstract translation: 接合丝馈送系统具有线张紧单元，其具有具有线入口孔和线出口孔的腔室。 电线入口和出口孔具有与腔室的中心轴线对准的中心。 定位夹具以接收从线出口孔提供的接合线。 夹具具有至少两个可相对于彼此移动的夹爪，并布置成夹持线以将线的中心轴线与腔室的中心轴线对准。 夹爪也可以沿着导线的中心轴线移动，以便将线材拉过线材拉紧单元。

公开(公告)号：US09214413B2

公开(公告)日：2015-12-15

申请号：US14551069

申请日：2014-11-23

Applicant: Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

Inventor： Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

IPC: H01L21/50 ,  H01L23/495 ,  H01L21/56 ,  H01L23/373 ,  H01L23/42

CPC classification number: H01L23/49503 ,  H01L21/56 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49568 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.

Abstract translation: 通过提供包括具有活性表面的半导体管芯和具有附接的导热衬底的相对安装表面的管芯组件来封装半导体管芯。 模具组件安装在引线框架模具标记的第一表面上，使得导热基板夹在模具标记和半导体管芯之间。 管芯的接合焊盘与接合线电连接以引导框架引线指。 然后，模制化合物封装半导体管芯，接合线和导热衬底。 模具标记的第二表面通过模具化合物暴露。

公开(公告)号：US20150343510A1

公开(公告)日：2015-12-03

申请号：US14763585

申请日：2013-01-29

Applicant: Zhijie WANG ,  MingJen YU ,  TungYang HU ,  Kevin L. MASSARO ,  Chun-Pu CHEN ,  Dimitre MEHANDJIYSKY ,  HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhijie Wang ,  Ming-Jen Yu ,  Tung-Yang Hu ,  Kevin L. Massaro ,  Chun-Pu Chen ,  Dimitre D. Mehandjiysky

IPC: B21D5/16 ,  B21D53/00

CPC classification number: B21D5/16 ,  B21D53/00 ,  G06F1/1616 ,  G06F1/1656

Abstract: Bending members having slanted faces to engage folded edge portions of a housing panel, wherein the relative sliding movement between the folded edge portions and the bending members cause bending of each of the folded edge portions to an inwardly slanted angle.

Abstract translation: 具有倾斜面的弯曲构件接合壳体面板的折叠边缘部分，其中折叠边缘部分和弯曲构件之间的相对滑动运动导致每个折叠边缘部分弯曲成向内倾斜的角度。

公开(公告)号：US20150028468A1

公开(公告)日：2015-01-29

申请号：US14277061

申请日：2014-05-14

Applicant: Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

Inventor： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC: H01L23/08 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

Abstract translation: 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。

公开(公告)号：US20120326288A1

公开(公告)日：2012-12-27

申请号：US13489462

申请日：2012-06-06

Applicant: Meiquan Huang ,  Hejin Liu ,  Zhijie Wang ,  Dehong Ye ,  Hanmin Zhang

Inventor： Meiquan Huang ,  Hejin Liu ,  Zhijie Wang ,  Dehong Ye ,  Hanmin Zhang

IPC: H01L21/56 ,  H01L23/495

CPC classification number: H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00

Abstract: A method of assembling a semiconductor device includes providing a conductive lead frame panel and selectively half-etching a top side of the lead frame panel to provide a pin pads. A flip chip die is attached and electrically connected to the pin pads and then the lead frame panel and die are encapsulated with molding compound. A second selective half etching step is performed on a backside of the lead frame panel to form a plurality of separate input/output pins. The side walls of each input/output pin include arcuate surfaces in cross-section.

Abstract translation: 一种组装半导体器件的方法包括：提供导电引线框架面板，并选择性地半导体蚀刻引线框架面板的顶侧以提供引脚焊盘。 连接倒装芯片并电连接到引脚焊盘，然后将引线框架板和模具用模塑料封装。 在引线框板的背面执行第二选择性半蚀刻步骤，以形成多个单独的输入/输出引脚。 每个输入/输出销的侧壁包括横截面的弧形表面。

公开(公告)号：US07931186B2

公开(公告)日：2011-04-26

申请号：US12093403

申请日：2007-03-13

Applicant: Michael T. Deley ,  Peter M. Lister ,  Deepak Sood ,  Zhijie Wang

Inventor： Michael T. Deley ,  Peter M. Lister ,  Deepak Sood ,  Zhijie Wang

IPC: B23K31/00 ,  B23K11/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78901 ,  H01L2224/85121 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  Y10S228/904 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/05556 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract translation: 提供了一种教导用于引线键合操作的眼点的方法。 该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或 （b）与半导体器件相关的预定数据。 教学步骤包括相对于彼此定义每个形状的位置。

公开(公告)号：US07888186B2

公开(公告)日：2011-02-15

申请号：US12499788

申请日：2009-07-08

Applicant: Zhigang Bai ,  Weimin Chen ,  Zhijie Wang

Inventor： Zhigang Bai ,  Weimin Chen ,  Zhijie Wang

IPC: H01L21/00

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15331 ,  H01L2924/181 ,  Y10T29/41 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for assembling a stackable semiconductor package includes providing a substrate having a first surface and a second surface. The first surface includes bond pads and one or more die pads. Conductive bumps are formed on the bond pads and one or more semiconductor dies are attached to the one or more die pads. The first surface of the substrate, the semiconductor dies and the conductive bumps are placed in a side-gate molding cast and a mold material is supplied to the first surface of the substrate to form a stackable semiconductor package. Similarly formed semiconductor packages may be stacked, one on another to form a stacked semiconductor package.

Abstract translation: 一种用于组装可堆叠半导体封装的方法包括提供具有第一表面和第二表面的衬底。 第一表面包括接合焊盘和一个或多个管芯焊盘。 导电凸块形成在接合焊盘上，并且一个或多个半导体管芯附接到一个或多个管芯焊盘。 将基板的第一表面，半导体管芯和导电凸块放置在侧浇口模铸件中，并将模具材料供应到基板的第一表面以形成可堆叠的半导体封装。 类似地形成的半导体封装可以彼此层叠以形成堆叠的半导体封装。

公开(公告)号：US07523848B2

公开(公告)日：2009-04-28

申请号：US11148540

申请日：2005-06-09

Applicant: David T. Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

Inventor： David T. Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

IPC: B23K31/02 ,  G01B11/00

CPC classification number: B23K20/007 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/14

Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Abstract translation: 提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。 该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。 所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。 设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。

公开(公告)号：US20050284914A1

公开(公告)日：2005-12-29

申请号：US11148540

申请日：2005-06-09

Applicant: David Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

Inventor： David Beatson ,  Deepak Sood ,  Norman Lucas ,  Zhijie Wang

IPC: B23K20/00 ,  B23K20/10 ,  B23K31/02 ,  B23K31/12 ,  B23K37/00

CPC classification number: B23K20/007 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/14

Abstract: A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Abstract translation: 提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。 该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。 所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。 设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。