利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

46 条记录 (耗时 0.03 秒)

    Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use
    31.
    发明授权
    Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use 有权
    无卤素三嗪，双马来酰亚胺/环氧聚合物，由其制成的用于电路板和树脂涂覆制品的预浸料，以及使用

    公开(公告)号：US06534179B2

    公开(公告)日：2003-03-18

    申请号：US09818458

    申请日：2001-03-27

    申请人： Robert Maynard Japp ,  Konstantinos I. Papathomas ,  Mark D. Poliks

    发明人： Robert Maynard Japp ,  Konstantinos I. Papathomas ,  Mark D. Poliks

    IPC分类号： B32B2704

    CPC分类号： B32B15/08 ,  B32B27/281 ,  B32B27/38 ,  B32B2457/08 ,  C08G59/304 ,  C08G59/3254 ,  C08L63/00 ,  C08L79/04 ,  C08L79/085 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/2938 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/20

    摘要： A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

    摘要翻译： 描述了一种无卤介电树脂混合物用于微孔和其它类似应用。 树脂混合物含有氰酸酯单体或预聚物，双马来酰亚胺，环氧树脂和选自次膦酸酐，膦酸和二卤化物和膦酸半酯的阻燃化合物。 阻燃剂的存在量，其中基于树脂混合物的重量，元素磷含量为约2重量％至约20重量％。 树脂混合物还可以包括一种或多种着色剂，荧光剂和UV吸收剂。 还描述了基于与无机或有机增强剂的树脂混合物的预浸料，以及由预浸料制成的电路板和芯片载体。 同样包括用于微孔激光应用的树脂涂层制品。

    EMBEDDED THIN FILMS
    33.
    发明申请
    EMBEDDED THIN FILMS 有权
    嵌入式薄膜

    公开(公告)号：US20090301770A1

    公开(公告)日：2009-12-10

    申请号：US12482202

    申请日：2009-06-10

    申请人： Junghyun Cho ,  Bahgat Sammakia ,  Mark D. Poliks ,  Roy Magnuson ,  Biplab Kumar Roy

    发明人： Junghyun Cho ,  Bahgat Sammakia ,  Mark D. Poliks ,  Roy Magnuson ,  Biplab Kumar Roy

    IPC分类号： H05K1/09 ,  C25D7/12

    CPC分类号： H05K3/0011 ,  C25D5/48 ,  C25D9/08 ,  C25D21/12 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/162 ,  H05K1/167 ,  H05K3/184 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2203/092 ,  H05K2203/135 ,  H05K2203/163

    摘要： A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.

    摘要翻译： 一种在导电性基板上形成膜的方法，其特征在于，将具有导电性部分的基板浸渍在包含所述膜的金属离子陶瓷前体和过氧化物的溶液中; 对导电部分相对于溶液中的对电极施加电压电位，足以保护导电部分免受溶液的腐蚀，并且驱动在衬底上形成膜，控制溶液的pH，同时限制生产 的氢气通过电解接近导电部分的溶液; 并且保持电压电位足够的持续时间以在导电部分上产生膜。 可以在膜上形成电极以产生电气装置。 该膜可以是例如绝缘，电介质，电阻，半导体，磁性或铁磁性的。

    Low CTE power and ground planes
    36.
    发明授权
    Low CTE power and ground planes 有权
    低CTE电源和接地层

    公开(公告)号：US06329603B1

    公开(公告)日：2001-12-11

    申请号：US09288051

    申请日：1999-04-07

    申请人： Robert M. Japp ,  Mark D. Poliks

    发明人： Robert M. Japp ,  Mark D. Poliks

    IPC分类号： H05K103

    CPC分类号： H05K3/4641 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09309 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

    摘要： Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz, polyethylene, and liquid crystal polymer fibers) with low CTEs are metallized to provide a resultant conductive material with a low CTE. Such fibers may be metallized in their individual state and then formed into a fabric, or these materials may be formed into a fabric and then metallized or a combination of both metallizations may be used. In addition, a graphite or carbon sheet may be metallized on one or both sides to provide a material that has a low CTE and high conductivity. These metallized, low CTE power and ground planes may be laminated with other planes/cores into a composite, or laminated into a core which is then laminated with other planes/cores into a composite. The resultant composite may be used for printed circuit boards (PCBs) or PCBs used as laminate chip carriers.

    摘要翻译： 公开了具有低热膨胀系数（CTE）并且用于电力和接地平面的导电材料。 具有低CTE的纤维材料（例如碳，石墨，玻璃，石英，聚乙烯和液晶聚合物纤维）被金属化以提供具有低CTE的所得导电材料。 这样的纤维可以以其单独状态进行金属化，然后形成织物，或者这些材料可以形成织物，然后金属化，或者可以使用两种金属化的组合。 此外，石墨或碳片可以在一侧或两侧金属化，以提供具有低CTE和高导电性的材料。 这些金属化的低CTE功率和接地层可以与其它平面/芯层压成复合材料，或者层压成芯，然后将其与其它平面/芯层叠合成复合材料。 所得的复合材料可用于印刷电路板（PCB）或用作层压芯片载体的PCB。

    Porous power and ground planes for reduced PCB delamination and better reliability
    38.
    发明授权
    Porous power and ground planes for reduced PCB delamination and better reliability 失效
    多功能电源和接地平面可降低PCB分层和更好的可靠性

    公开(公告)号：US06944946B2

    公开(公告)日：2005-09-20

    申请号：US10430989

    申请日：2003-05-06

    申请人： Robert M. Japp ,  Mark D. Poliks

    发明人： Robert M. Japp ,  Mark D. Poliks

    IPC分类号： H05K1/02 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01K3/10

    CPC分类号： H05K3/38 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0769 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2203/1131 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1052 ,  Y10T428/24273 ,  Y10T428/24917

    摘要： Power and ground planes that are used in Printed Circuit Boards (PCBs) and that comprise porous, conductive materials are disclosed. Using porous power and ground plane materials in PCBs allows liquids (e.g., water and/or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets porous by forming an array of holes in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.

    摘要翻译： 公开了在印刷电路板（PCB）中使用并且包含多孔导电材料的电源和接地层。 在PCB中使用多孔电源和接地平面材料可以使液体（例如水和/或其他溶剂）通过电源和接地层，从而减少由阴极/阳极细丝引起的PCB（或PCBs用作层压芯片载体）的故障 绝缘子的生长和分层。 适用于PCB的多孔导电材料可以通过使用金属涂布的有机布（例如聚酯或液晶聚合物）或织物（例如由碳/石墨或玻璃纤维制成的那些）形成，使用金属丝网代替金属 使用烧结金属，或者通过在金属板中形成孔阵列来制造多孔的金属片。 织物和网可以编织或随机。 如果在金属板中形成孔阵列，则可以形成这样的阵列，而不需要使用常规PCB组装方法执行的附加处理步骤。