公开(公告)号：US5390844A

公开(公告)日：1995-02-21

申请号：US96700

申请日：1993-07-23

申请人： Thomas H. Distefano ,  Igor Y. Khandros ,  Gaetan Mathiew ,  Jason Sweis ,  John Grange ,  Gary W. Grube

发明人： Thomas H. Distefano ,  Igor Y. Khandros ,  Gaetan Mathiew ,  Jason Sweis ,  John Grange ,  Gary W. Grube

IPC分类号： H01L21/60 ,  B23K20/02 ,  B23K20/10 ,  H01L21/00 ,  H01L21/603 ,  H05K3/32

CPC分类号： H01L21/67138 ,  B23K20/025 ,  B23K20/106 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01082

摘要： A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.

摘要翻译： 用于将内部引线键合到半导体芯片的接合工具被布置成捕获和对准沿多个方向中的任一个延伸的细长引线部分，优选地在两个相互正交的方向中的任一个方向上对准。 因此，即使在多个方向上引线延伸的情况下，该工具也可以应用于将所有引线对齐并将其结合到芯片上而不转动工具或芯片。

公开(公告)号：US06388340B2

公开(公告)日：2002-05-14

申请号：US09950132

申请日：2001-09-10

申请人： Thomas H. Distefano

发明人： Thomas H. Distefano

IPC分类号： H01L2328

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor chip package, and a method of making such a package, including a flexible dielectric element with a plurality of electrically conductive terminals, an expander ring connected to the flexible dielectric element, a semiconductor chip disposed with a central opening in the expander ring, and fan-in and fan-out leads connecting the terminals to contacts on the semiconductor chip. The package also has an elastomer encapsulant disposed in the gap between the expander ring and the semiconductor chip. The size of the gap is controlled to minimize the pressure exerted on the leads by the elastomer as it expands and contracts in response to changes in temperature. The semiconductor chip and expander ring may also be connected to a heat sink or thermal spreader with a compliant adhesive.

公开(公告)号：US06354485B1

公开(公告)日：2002-03-12

申请号：US09385324

申请日：1999-08-30

申请人： Thomas H. Distefano

发明人： Thomas H. Distefano

IPC分类号： B23K3102

CPC分类号： H01L23/3121 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05664

摘要： A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts overlying the front face of the chip. The flange bonding contacts are coplanar with the chip bonding contacts, or can be brought into coplanar alignment by flexure of the cap. The package can be surface-mounted to a circuit board by placing the package onto pads of solder paste, and then heating the assembly to melt the solder paste in order to join the bonding contacts on the chip and on the flange to corresponding contacts on the circuit board.

摘要翻译： 热增强半导体封装包括金属板盖，其具有设置有用于可靠地附接到电路板的焊接触点的柔性凸缘。 封装组件还包括具有面向前的接触轴承前表面的半导体芯片，以及覆盖在芯片前表面上的芯片接合触点。 凸缘接合触点与芯片接合触点共面，或者可以通过盖的挠曲而被共同对准。 通过将封装放置在焊膏垫上，将封装表面安装到电路板上，然后加热组件以熔化焊膏，以便将芯片上的接合触点和法兰上的接合触点连接到 电路板。

公开(公告)号：US06329224B1

公开(公告)日：2001-12-11

申请号：US09067698

申请日：1998-04-28

申请人： Tan Nguyen ,  Craig S. Mitchell ,  Thomas H. Distefano

发明人： Tan Nguyen ,  Craig S. Mitchell ,  Thomas H. Distefano

IPC分类号： H01L2144

CPC分类号： H01L21/565 ,  H01L21/56 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00

摘要： Microelectronic assemblies are encapsulated using disposable frames. The microelectronic assemblies are disposed within an aperture defined by a frame. The aperture is covered by top and bottom sealing layers so that the frame and sealing layers define an enclosed space encompassing the assemblies. The encapsulant is injected into this closed space. The frame is then separated from the encapsulation fixture and held in a curing oven. After cure, the frame is cut apart and the individual assemblies are severed from one another. Because the frame need not be held in the encapsulation fixture during curing, the process achieves a high throughput.

摘要翻译： 微电子组件使用一次性框架进行封装。 微电子组件设置在由框架限定的孔内。 孔被顶部和底部密封层覆盖，使得框架和密封层限定包围组件的封闭空间。 将密封剂注入该封闭空间。 然后将框架与封装固定装置分离并固定在固化炉中。 固化后，将框架切开，并将各个组件彼此切断。 因为在固化期间框架不需要保持在封装夹具中，所以该工艺实现了高的生产量。

公开(公告)号：US06247228B1

公开(公告)日：2001-06-19

申请号：US08989305

申请日：1997-12-12

申请人： Thomas H. Distefano ,  Joseph Fjelstad

发明人： Thomas H. Distefano ,  Joseph Fjelstad

IPC分类号： H05K336

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

公开(公告)号：US06218215B1

公开(公告)日：2001-04-17

申请号：US09520357

申请日：2000-03-07

申请人： Thomas H. Distefano ,  Craig S. Mitchell

发明人： Thomas H. Distefano ,  Craig S. Mitchell

IPC分类号： H01L2144

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of making a semiconductor chip package by attaching a chip to a dielectric layer; placing the dielectric layer and chip into a mold; disposing a thixotropic composition that has bee sheared to reduced its viscosity into the mold and curing the thixotropic composition after the chip and dielectric layer have been removed from the mold. A method of making a semiconductor chip package without using a mold by disposing a sheared thixotropic composition between a semiconductor chip and a dielectric layer and then curing the thixotropic composition to form a cured encapsulant. A method of making a semiconductor chip package without using a mold during the curing step and without the need to use a thixotropic composition by placing a semiconductor chip attached to a dielectric layer into a mold and disposing a liquid composition between the chip and the dielectric layer, forming a cured skin on the liquid composition, removing the work-piece from the mold and then completely the cure of the liquid composition.

摘要翻译： 一种通过将芯片附着到电介质层来制造半导体芯片封装的方法; 将介电层和芯片放置在模具中; 在将芯片和电介质层从模具中除去之后，设置具有剪切力的触变组合物以将其粘度降低到模具中并固化触变组合物。一种制备半导体芯片封装而不使用模具的方法是通过设置剪切的触变 在半导体芯片和电介质层之间的组成，然后固化触变组合物以形成固化的密封剂。一种在固化步骤期间不使用模具制造半导体芯片封装的方法，并且不需要通过将半导体芯片 将电介质层附着到模具中并在芯片和电介质层之间设置液体组合物，在液体组合物上形成固化的皮肤，从模具中除去工件，然后完全固化液体组合物。

公开(公告)号：US6133627A

公开(公告)日：2000-10-17

申请号：US984615

申请日：1997-12-03

申请人： Igor Y. Khandros ,  Thomas H. Distefano

发明人： Igor Y. Khandros ,  Thomas H. Distefano

IPC分类号： H01L21/60 ,  H01L21/822 ,  H01L21/98 ,  H01L23/13 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/58 ,  H01L25/16 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L21/6836 ,  H01L21/822 ,  H01L22/32 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/50 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K2201/10378

摘要： A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.

摘要翻译： 在其顶表面的中心区域上具有触点的半导体芯片设置有覆盖在顶表面的中心部分上的电介质元件。 电介质元件具有面向芯片的第一表面和背离芯片的第二表面，包围中心触点的孔和限定孔的边缘。 中心接触引线从芯片上的中心触点延伸到介质元件上的中心端子。 电介质元件上的端子可以使用通常用于电气装置的表面安装（例如焊接）的技术连接到基板。 引线，优选地介电元件是柔性的，使得端子可相对于芯片上的触点移动，以补偿芯片和基板的不同的热膨胀。 电介质元件可以设置有设置在端子和芯片之间的柔性层。 整个组件紧凑。

公开(公告)号：US06700072B2

公开(公告)日：2004-03-02

申请号：US09779117

申请日：2001-02-08

申请人： Thomas H. Distefano ,  Joseph Fjelstad

发明人： Thomas H. Distefano ,  Joseph Fjelstad

IPC分类号： H05K103

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

摘要翻译： 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件从中心导体延伸，并且具有适于从中心导体径向向内收缩的外围部分，以响应由在所接合的电路板上限定中心孔的接触垫施加的力。 因此，当电路板被内插件压缩时，触头径向向内收缩并且擦拭穿过焊盘。 擦拭动作有助于通过摩擦焊接将接触件接合到焊盘，或者通过接触件本身承载的导电接合材料。

公开(公告)号：US06458628B1

公开(公告)日：2002-10-01

申请号：US09712635

申请日：2000-11-14

申请人： Thomas H. Distefano ,  Craig S. Mitchell

发明人： Thomas H. Distefano ,  Craig S. Mitchell

IPC分类号： H01L2144

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of making a semiconductor chip package by attaching a chip to a dielectric layer; placing the dielectric layer and chip into a mold; disposing a thixotropic composition that has been sheared to reduce its viscosity into the mold and curing the thixotropic composition after the chip and dielectric layer have been removed from the mold. A method of making a semiconductor chip package without using a mold by disposing a sheared thixotropic composition between a semiconductor chip and a dielectric layer and then curing the thixotropic composition to form a cured encapsulant. A method of making a semiconductor chip package without using a mold during the curing step and without the need to use a thixotropic composition by placing a semiconductor chip attached to a dielectric layer into a mold and disposing a liquid composition between the chip and the dielectric layer, forming a cured skin on the liquid composition, removing the work-piece from the mold and then complete the cure of the liquid composition.

摘要翻译： 一种通过将芯片附着到电介质层来制造半导体芯片封装的方法; 将介电层和芯片放置在模具中; 设置已经剪切以将其粘度降低到模具中并在芯片和电介质层已经从模具中去除之后固化触变组合物的触变组合物。 一种通过在半导体芯片和电介质层之间设置剪切的触变组合物然后固化触变组合物以形成固化的密封剂来制造半导体芯片封装而不使用模具的方法。 一种在固化步骤中不使用模具制造半导体芯片封装的方法，并且不需要通过将附着到电介质层的半导体芯片放置在模具中并且在芯片和电介质层之间设置液体组合物来使用触变组合物 在液体组合物上形成固化的皮肤，从模具中取出工件，然后完成液体组合物的固化。

公开(公告)号：US06309915B1

公开(公告)日：2001-10-30

申请号：US09245224

申请日：1999-02-05

申请人： Thomas H. Distefano

发明人： Thomas H. Distefano

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00

摘要： A method of making a semiconductor chip assembly, including providing a dielectric element with a plurality of electrically conductive terminals, disposing an expander ring over the dielectric element so that a semiconductor chip on the dielectric layer is disposed in a central opening in the expander ring, and disposing an encapsulant in the gap between the expander ring and the semiconductor chip. The size of the gap is controlled to minimize the pressure exerted on the leads by the elastomer as it expands and contracts in response to changes in temperature. The semiconductor chip and expander ring may also be connected to a heat sink or thermal spreader with a compliant adhesive.

摘要翻译： 一种制造半导体芯片组件的方法，包括提供具有多个导电端子的介质元件，在所述电介质元件上设置扩展器环，使得所述电介质层上的半导体芯片设置在所述扩展器环中的中心开口中， 以及在所述扩展器环和所述半导体芯片之间的间隙中设置密封剂。 间隙的尺寸被控制以使由弹性体施加在引线上的压力最小化，因为它随着温度的变化而膨胀和收缩。 半导体芯片和扩展器环也可以通过柔性粘合剂连接到散热器或散热器。