公开(公告)号：US07201497B2

公开(公告)日：2007-04-10

申请号：US10891722

申请日：2004-07-15

申请人： Stanton Earl Weaver, Jr. ,  Thomas Elliot Stecher

发明人： Stanton Earl Weaver, Jr. ,  Thomas Elliot Stecher

IPC分类号： F21V7/00

CPC分类号： H05K1/181 ,  F21K9/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02292 ,  H01S5/4025 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/2054 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.

摘要翻译： 发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。 印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。 焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

公开(公告)号：US07095110B2

公开(公告)日：2006-08-22

申请号：US10851273

申请日：2004-05-21

申请人： Mehmet Arik ,  Stanton Earl Weaver, Jr. ,  Charles Becker

发明人： Mehmet Arik ,  Stanton Earl Weaver, Jr. ,  Charles Becker

IPC分类号： H01L23/10

CPC分类号： F21V29/51 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

摘要翻译： 发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路 （34,134,234,360,362,460,462），与发光二极管芯片连接。 热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。 热管还包括设置在密封体积中的传热流体（26,226,326,426）。

公开(公告)号：US07053425B2

公开(公告)日：2006-05-30

申请号：US10706767

申请日：2003-11-12

申请人： Peter Micah Sandvik ,  Vinayak Tilak ,  Jesse Tucker ,  Stanton Earl Weaver ,  David Mulford Shaddock ,  Jonathan Lloyd Male ,  John Patrick Lemmon ,  Mark Allen Woodmansee ,  Venkatesan Manivannan ,  Deborah Ann Haitko

发明人： Peter Micah Sandvik ,  Vinayak Tilak ,  Jesse Tucker ,  Stanton Earl Weaver ,  David Mulford Shaddock ,  Jonathan Lloyd Male ,  John Patrick Lemmon ,  Mark Allen Woodmansee ,  Venkatesan Manivannan ,  Deborah Ann Haitko

IPC分类号： H01L31/312 ,  G01N27/12

CPC分类号： G01N27/4141 ,  G01N33/0037 ,  Y02A50/245

摘要： A gas sensor device including a semiconductor substrate; one or more catalytic gate-electrodes deposited on a surface of the semiconductor substrate; one or more ohmic contacts deposited on the surface of the semiconductor substrate and a passivation layer deposited on at least a portion of the surface; wherein the semiconductor substrate includes a material selected from the group consisting of silicon carbide, diamond, Group III nitrides, alloys of Group III nitrides, zinc oxide, and any combinations thereof.

摘要翻译： 一种气体传感器装置，包括半导体衬底; 沉积在半导体衬底的表面上的一个或多个催化栅电极; 沉积在半导体衬底的表面上的一个或多个欧姆接触层和沉积在该表面的至少一部分上的钝化层; 其中所述半导体衬底包括选自碳化硅，金刚石，III族氮化物，III族氮化物的合金，氧化锌及其任何组合的材料。

公开(公告)号：US06921929B2

公开(公告)日：2005-07-26

申请号：US10609040

申请日：2003-06-27

申请人： Steven Francis LeBoeuf ,  Donald Joseph Buckley, Jr. ,  Stanton Earl Weaver

发明人： Steven Francis LeBoeuf ,  Donald Joseph Buckley, Jr. ,  Stanton Earl Weaver

IPC分类号： H01L33/50 ,  H01J29/24 ,  H01J1/62 ,  H01L29/24

CPC分类号： H01L33/502 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K2201/10106

摘要： A lens and encapsulant made of an amorphous fluoropolymer for a light-emitting diode (LED) or diode laser, such as an ultraviolet (UV) LED (UVLED). A semiconductor diode die (114) is formed by growing a diode (110) on a substrate layer (115) such as sapphire. The diode die (114) is flipped so that it emits light (160, 365) through the face (150) of the layer (115). An amorphous fluoropolymer encapsulant encapsulates the emitting face of the diode die (114), and may be shaped as a lens to form an integral encapsulant/lens. Or, a lens (230, 340) of amorphous fluoropolymer may be joined to the encapsulant (220). Additional joined or separate lenses (350) may also be used. The encapsulant/lens is transmissive to UV light as well as infrared light. Encapsulating methods are also provided.

摘要翻译： 由用于发光二极管（LED）或二极管激光器（例如紫外线（UV）LED（UVLED））的无定形含氟聚合物制成的透镜和密封剂。 通过在诸如蓝宝石的衬底层（115）上生长二极管（110）来形成半导体二极管管芯（114）。 二极管管芯（114）被翻转，使得它通过层（115）的面（150）发光（160,365）。 无定形氟聚合物密封剂封装二极管管芯（114）的发射面，并且可以被成形为透镜以形成整体的密封剂/透镜。 或者，可以将无定形含氟聚合物的透镜（230,340）接合到密封剂（220）。 还可以使用附加的连接或分开的透镜（350）。 密封剂/透镜对于紫外线以及红外光是透射的。 还提供封装方法。

公开(公告)号：US5866952A

公开(公告)日：1999-02-02

申请号：US565269

申请日：1995-11-30

申请人： Robert John Wojnarowski ,  Thomas Bent Gorczyca ,  Stanton Earl Weaver, Jr.

发明人： Robert John Wojnarowski ,  Thomas Bent Gorczyca ,  Stanton Earl Weaver, Jr.

IPC分类号： H01L25/18 ,  H01L21/98 ,  H01L23/538 ,  H01L25/04 ,  H01L23/29

CPC分类号： H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/295 ,  H01L23/4334 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/75 ,  H01L24/76 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2224/75315 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511

摘要： A high density interconnected multi-chip module is provided with a stress-reducing compliant material disposed around the chips prior to molding a polymeric substrate around the chips. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A compliant material is deposited around the chips, and then a mold form is positioned around the chips. Polymeric substrate molding material is added within the mold form, and then the substrate molding material is hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and faces of the chips. A thermal plug may be affixed to the backside of a chip prior to the addition of substrate molding material.

摘要翻译： 高密度互连多芯片模块在模制聚合物基片周围的芯片之前设置有围绕芯片布置的减小应力的材料。 具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。 围绕芯片沉积顺应性材料，然后将模具形式定位在芯片周围。 在模具形式中加入聚合物基材模塑材料，然后将基材模塑材料硬化。 具有与预定接触焊盘对准的通路并具有穿过通孔延伸的电导体的通孔的电介质层位于硬化的基板模制材料和芯片的表面上。 在添加基底模制材料之前，可以将热塞固定到芯片的背面。

公开(公告)号：US08780559B2

公开(公告)日：2014-07-15

申请号：US13340309

申请日：2011-12-29

申请人： Stanton Earl Weaver, Jr. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

发明人： Stanton Earl Weaver, Jr. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.

摘要翻译： 这里描述了一种电气设备。 电气设备包括壳体，其包括限定空腔的内表面，联接到壳体并沿着第一平面定向的散热器，以及定位在壳体空腔内并沿着第二平面定向的至少一个电气部件， 与第一架飞机不同。 热交换组件耦合到电气部件和散热器，用于调节电气部件的温度。 热交换组件包括蒸发器部分，冷凝器部分和在蒸发器部分和冷凝器部分之间延伸的输送部分，用于在蒸发器部分和冷凝器部分之间引导工作流体。 热交换组件构造成沿着相对于输送部分定向的至少一个弯曲轴线弯曲。

公开(公告)号：US20140043764A1

公开(公告)日：2014-02-13

申请号：US13568667

申请日：2012-08-07

申请人： Stanton Earl Weaver ,  Hendrik Pieter Jacobus De Bock

发明人： Stanton Earl Weaver ,  Hendrik Pieter Jacobus De Bock

IPC分类号： H05K7/20 ,  B23P15/26 ,  F28F27/00

CPC分类号： B23P15/26 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit element positioned on its first surface. At least one micro-channel is defined in the second surface of the die. The integrated circuit device includes a cooling substrate attached to the second surface of the die. At least one fluid routing channel is defined in the cooling substrate. The at least one fluid routing channel is connected to the at least one micro-channel defined in the die. Additionally, the cooling substrate has at least one valve positioned within the at least one fluid routing channel. The at least one valve is configured to autonomously regulate a flow rate of a cooling fluid flowing through the at least one fluid routing channel.

摘要翻译： 提供集成电路装置。 集成电路器件包括具有第一表面和与第一表面相对的第二表面的管芯。 模具具有至少一个位于其第一表面上的电路元件。 在模具的第二表面中限定至少一个微通道。 集成电路装置包括附接到模具的第二表面的冷却基板。 在冷却衬底中限定至少一个流体路线通道。 所述至少一个流体路由通道连接到在所述管芯中限定的所述至少一个微通道。 另外，冷却基板具有位于至少一个流体路由通道内的至少一个阀。 所述至少一个阀被配置为自主地调节流过所述至少一个流体路由通道的冷却流体的流量。

公开(公告)号：US08506105B2

公开(公告)日：2013-08-13

申请号：US13212565

申请日：2011-08-18

申请人： Rajdeep Sharma ,  Stanton Earl Weaver, Jr. ,  Glenn Howard Kuenzler ,  Mehmet Arik ,  Gary Robert Allen ,  Jeffrey Marc Nall

发明人： Rajdeep Sharma ,  Stanton Earl Weaver, Jr. ,  Glenn Howard Kuenzler ,  Mehmet Arik ,  Gary Robert Allen ,  Jeffrey Marc Nall

IPC分类号： F21V33/00

CPC分类号： F21V29/02 ,  F04B43/046 ,  F21K9/232 ,  F21K9/64 ,  F21V3/02 ,  F21V7/041 ,  F21V7/05 ,  F21V7/22 ,  F21V13/02 ,  F21V13/04 ,  F21V17/12 ,  F21V29/505 ,  F21V29/506 ,  F21V29/63 ,  F21V29/77 ,  F21V29/83 ,  F21Y2115/10

摘要： An apparatus is provided including at least one electronic component. The apparatus also includes an enclosure enclosing the at least one electronic component. The enclosure includes at least one wall defined by a membrane. The apparatus further includes a piezoelectric actuator that is fixed at a first end and rigidly attached to the membrane at a second end. Application of alternating current to the piezoelectric actuator generates a pulsating mechanical deformation of the membrane.

摘要翻译： 提供了包括至少一个电子部件的装置。 该装置还包括封闭至少一个电子部件的外壳。 外壳包括由膜限定的至少一个壁。 该装置还包括压电致动器，该压电致动器固定在第一端并且在第二端处刚性地附接到膜。 将交流电应用于压电致动器产生膜的脉动机械变形。

公开(公告)号：US20130168050A1

公开(公告)日：2013-07-04

申请号：US13340058

申请日：2011-12-29

申请人： Shakti Singh Chauhan ,  Stanton Earl Weaver, JR. ,  Tao Deng ,  Christopher Michael Eastman ,  Wenwu Zhang

发明人： Shakti Singh Chauhan ,  Stanton Earl Weaver, JR. ,  Tao Deng ,  Christopher Michael Eastman ,  Wenwu Zhang

IPC分类号： F28D15/02 ,  B21D53/02

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.

摘要翻译： 本文描述了用于冷却电气部件的热交换组件。 热组件包括壳体，其包括蒸发器部分，冷凝器部分和沿着纵向轴线在蒸发器部分和冷凝器部分之间延伸的输送部分。 壳体被构造成沿着相对于传送部分定向的弯曲轴线弯曲。 壳体还包括至少一个侧壁，其包括在蒸发器部分和冷凝器部分之间延伸的至少一个流体室，以在蒸发器部分和冷凝器部分之间引导工作流体。 多个流体通道限定在内表面内以将液体流体从冷凝器部分引导到蒸发器部分。 至少一个蒸汽通道限定在内表面内，以将气态流体从蒸发器部分引导到冷凝器部分。

公开(公告)号：US20130079667A1

公开(公告)日：2013-03-28

申请号：US13247107

申请日：2011-09-28

申请人： Ertugrul Berkcan ,  Stanton Earl Weaver ,  Shankar Chandrasekaran ,  Nannan Chen

发明人： Ertugrul Berkcan ,  Stanton Earl Weaver ,  Shankar Chandrasekaran ,  Nannan Chen

IPC分类号： A61M16/00 ,  A61B7/00 ,  G06F19/00 ,  B23P11/00 ,  G01F1/00 ,  G01F1/34

CPC分类号： G01F1/3272 ,  A61B5/087 ,  A61B5/0878 ,  A61B5/7235 ,  A61B2562/028 ,  A61M16/0051 ,  A61M16/0069 ,  A61M16/021 ,  A61M16/16 ,  A61M2016/0027 ,  A61M2016/0039 ,  G01F1/3245 ,  G01F1/3254 ,  G01F1/329 ,  G01F1/72 ,  Y10T29/49826

摘要： A flow sensor assembly, snore detection assembly, and methods for fabricating the same. The flow sensor assembly includes a flow conduit for fluid flow, a flow disrupter for imparting a disturbance to the fluid flow, a first sensor responsive to the disturbance of the fluid flow and configured to generate signals responsive to the disturbance of the fluid flow, and a processor for determining a flow rate for the fluid flow through the flow conduit based on a first algorithm determining an amplitude of the fluid flow in a first flow regime and a second algorithm determining a frequency of the fluid flow in a second flow regime.

摘要翻译： 流量传感器组件，打鼾检测组件及其制造方法。 流量传感器组件包括用于流体流动的流动管道，用于对流体流动产生干扰的流动扰流器，响应于流体流动干扰并被配置为产生响应于流体流动扰动的信号的第一传感器，以及 基于确定第一流动状态中的流体流动的振幅的第一算法和确定第二流动状态中的流体流动频率的第二算法，确定流过流道的流体流量的处理器。