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    Method and device for semiconductor testing using electrically conductive adhesives
    43.
    发明授权
    Method and device for semiconductor testing using electrically conductive adhesives 失效
    使用导电胶粘剂进行半导体测试的方法和装置

    公开(公告)号：US06559666B2

    公开(公告)日：2003-05-06

    申请号：US09875246

    申请日：2001-06-06

    Applicant: William E. Bernier ,  Michael A. Gaynes ,  Wayne J. Howell ,  Mark V. Pierson ,  Ajit K. Trivedi ,  Charles G. Woychik

    Inventor： William E. Bernier ,  Michael A. Gaynes ,  Wayne J. Howell ,  Mark V. Pierson ,  Ajit K. Trivedi ,  Charles G. Woychik

    IPC: G01R3102

    CPC classification number: G01R31/2886 ,  H01L2224/45144 ,  H01L2224/81385 ,  H01L2224/83101 ,  H05K3/321 ,  H01L2924/00

    Abstract: A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.

    Abstract translation: 一种用于测试和燃烧半导体电路的方法和装置。 该方法和装置允许通过使用导电粘合剂（ECA）将晶片临时附接到测试基板来测试整个晶片。 ECA符合晶片和测试基板的接触点的共平面偏差，同时在每个点提供质量电连接。 ECA材料可以沉积在晶片触点或衬底焊盘上。 此外，ECA可以沉积在C4凸点或锡盖铅基上。 该方法和装置的变化包括用ECA填充非导电插入件的通孔。 可以通过在测试焊盘上形成导电枝晶而增加电连接，同时将ECA沉积在晶片触点上。 为了进一步增强电连接，可以对ECA材料进行等离子体蚀刻以除去其一些聚合物基质并使一面上的导电颗粒暴露，然后用钯镀覆。 在镀钯的ECA与铝焊盘，钯涂覆的铝焊盘或甚至C4焊料凸块接触之后，在钯处理的ECA凸块上形成导电枝晶。

    Dockable interface airlock between process enclosure and interprocess transfer container
    49.
    发明授权
    Dockable interface airlock between process enclosure and interprocess transfer container 失效
    过程外壳和过程间转移容器之间的可对接界面气闸

    公开(公告)号：US5451131A

    公开(公告)日：1995-09-19

    申请号：US901041

    申请日：1992-06-19

    Applicant: Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

    Inventor： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

    IPC: H01L21/02 ,  F24F7/06 ,  H01L21/00 ,  H01L21/677 ,  B65G1/00 ,  B23B29/24 ,  B65G65/34 ,  C23C14/00

    CPC classification number: H01L21/67236 ,  H01L21/67126 ,  H01L21/67772 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14 ,  Y10T29/53191

    Abstract: Disclosed is a manufacturing system having isolated islands of "clean room" environment connected by inter-process transfer containers for transfering in-process workpieces. The system has airlock transfer ports between the process enclosures and the inter-process transfer containers. The make and break airlock transfer ports have facing sealable doors in the process enclosure and the transfer container. These doors are in air sealable facing recesses of the process enclosure and the transfer container. At least one peripheral gasket surrounds the recesses and the pair of doors. This provides a substantially clean room environment in the airlock. The sealable door in the interprocess transfer container is fabricated of a ferromagnetic material and is seated on a ferromagnetic gasket, while the sealable door in the process enclosure has a controllable electromagnetic clamp. After establishment of an airtight seal between the two recesses, the doors are opened by activating the electromagnetic clamp in the process enclosure door to pull the ferromagnetic door in the interprocess transfer container away from the ferromagnetic gasket. The results in the simultaneous opening of the of the process enclosure door and the ferromagnetic interprocess transfer container door, while avoiding contamination inside either of the containers.

    Abstract translation: 公开了一种具有通过过程间转移容器连接的隔离岛“洁净室”环境的制造系统，用于转移过程中的工件。 该系统在进程外壳和进程间转移容器之间具有气闸传送端口。 制造和拆卸气闸传输端口在处理外壳和转移容器中具有面对的可密封的门。 这些门在处理外壳和转移容器的空气密封面对的凹部中。 至少一个外围垫圈围绕凹槽和一对门。 这在气闸中提供了基本洁净的房间环境。 处理间转移容器中的可密封的门由铁磁材料制成并且位于铁磁性垫圈上，而过程外壳中的可密封的门具有可控的电磁夹。 在两个凹口之间建立密封密封之后，通过启动过程外壳门中的电磁夹具来打开门，以将处理间转移容器中的铁磁门拉离铁磁垫圈。 结果是同时打开过程外壳门和铁磁过程转移容器门，同时避免了任何一个容器内的污染。

    Vacuum loading chuck and fixture for flexible printed circuit panels
    50.
    发明授权
    Vacuum loading chuck and fixture for flexible printed circuit panels 失效
    用于柔性印刷电路板的真空加载卡盘和夹具

    公开(公告)号：US5395198A

    公开(公告)日：1995-03-07

    申请号：US901640

    申请日：1992-06-19

    Applicant: Thomas P. Duffy ,  Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

    Inventor： Thomas P. Duffy ,  Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

    IPC: B23P21/00 ,  B25H3/02 ,  B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H01L21/683 ,  H05K3/00 ,  B65G49/06 ,  B65H1/00 ,  C23C16/00

    CPC classification number: H01L21/67236 ,  H01L21/67126 ,  H01L21/67363 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67772

    Abstract: Disclosed is a system for handling large area, in-process, circuit panel layers. The circuit panel layers are thin and flimsy, and require rigid support for certain processing steps. The system includes a peripheral frame fixture for surrounding and supporting the in process circuit panel layer, and a a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The peripheral frame fixture includes a bottom plate having a central opening to expose the circuit panel layer, a top frame having a corresponding central opening to expose the opposite surface of the circuit panel layer, and a compressive apparatus, as screws, bolts, or the like, for applying a z axis compressive force to the bottom plate, the top frame, and a panel layer therebetween. Optionally, the fixture may include alignment pins or fiducials for aligning the bottom plate, a panel layer, and the top frame, and a robotic interface for a robotic arm to grasp and transfer the peripheral frame fixture. The system also includes a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The loading chuck includes a peripheral edge for receiving the bottom plate of the peripheral frame fixture. This provides co-planarity of the in-process circuit panel layer, the bottom plate of the peripheral frame fixture, and the vacuum table. The vacuum table is within the area bounded by the peripheral edge of the loading chuck and the peripheral frame of the peripheral frame fixture, and is coplanar with them. The vacuum table includes slidable bearing surfaces, with vacuum apertures for drawing a vacuum to hold the panel in place, and slide actuators for moving the slidable bearing surfaces to apply x-y axis tension to a panel on the bearing surfaces.

    Abstract translation: 公开了一种用于处理大面积，在制程中的电路板层的系统。 电路板层薄而脆弱，并且对于某些加工步骤需要刚性支撑。 该系统包括用于围绕和支撑过程电路板层的外围框架固定装置，以及用于将工艺中电路板层安装在周边框架固定装置中的装载卡盘。 外围框架固定装置包括具有中央开口以暴露电路板层的底板，具有相应中心开口以露出电路板层的相对表面的顶部框架，以及压缩装置，如螺钉，螺栓或 用于将z轴压缩力施加到底板，顶部框架以及它们之间的面板层。 可选地，固定装置可以包括用于对准底板，面板层和顶部框架的对准销或基准，以及用于机器人臂来抓握和传送外围框架固定装置的机器人界面。 该系统还包括用于将工艺中电路板层安装在外围框架固定装置中的装载卡盘。 装载卡盘包括用于接收外围框架固定装置的底板的外围边缘。 这提供了工艺电路板层，外围框架固定装置的底板和真空工作台的共面性。 真空工作台位于由装载卡盘周边边缘和外围框架固定装置的外围框架所限定的区域内，与它们共面。 真空工作台包括可滑动的支承表面，具有用于拉伸真空以将面板保持在适当位置的真空孔，以及用于移动可滑动的支承表面以将x-y轴张力施加到支承表面上的面板的致动器。

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