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    Package carrier and manufacturing method thereof
    41.
    发明授权
    Package carrier and manufacturing method thereof 有权
    包装载体及其制造方法

    公开(公告)号：US08704101B2

    公开(公告)日：2014-04-22

    申请号：US13539505

    申请日：2012-07-02

    Applicant: Shih-Hao Sun

    Inventor： Shih-Hao Sun

    IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H01L23/3677 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5389 ,  H01L25/16 ,  H01L25/167 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09581 ,  H05K2201/10416 ,  H05K2203/1469 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: In a manufacturing method of a package carrier, a substrate having an upper surface, a lower surface, and an opening communicating the two surfaces is provided. An electronic device is disposed inside the opening. A first insulation layer and a superimposed first metal layer are laminated on the upper surface; a second insulation layer and a superimposed second metal layer are laminated on the lower surface. The opening is filled with the first and second insulation layers. First blind holes, second blind holes, and a heat-dissipation channel are formed. A third metal layer is formed on the first and second blind holes and an inner wall of the heat-dissipation channel. A heat-conducting device is disposed inside the heat-dissipation channel and fixed into the heat-dissipation channel via an insulation material. The first and second metal layers are patterned to form a first patterned metal layer and a second patterned metal layer.

    Abstract translation: 在包装载体的制造方法中，提供具有上表面，下表面和连通两个表面的开口的基板。 电子设备设置在开口内。 第一绝缘层和叠置的第一金属层层叠在上表面上; 第二绝缘层和叠加的第二金属层层叠在下表面上。 开口填充有第一和第二绝缘层。 形成第一盲孔，第二盲孔和散热通道。 在第一和第二盲孔和散热通道的内壁上形成第三金属层。 导热装置设置在散热通道的内部并通过绝缘材料固定到散热通道中。 图案化第一和第二金属层以形成第一图案化金属层和第二图案化金属层。

    BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOF
    43.
    发明申请
    BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOF 审中-公开
    板分离装置及其操作方法

    公开(公告)号：US20130319620A1

    公开(公告)日：2013-12-05

    申请号：US13592344

    申请日：2012-08-23

    Applicant: Chung W. Ho ,  Shu-Ming Leu

    Inventor： Chung W. Ho ,  Shu-Ming Leu

    IPC: B32B38/10

    CPC classification number: H01L21/56 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2203/082 ,  Y10T156/1168 ,  Y10T156/19 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A board separation apparatus and an operating method thereof are provided. The board separation apparatus includes a board separation machine and a composite board constituted of a plurality of circuit boards and carrier panels. The board separation machine includes a frame, first and second suction devices, and a linkage. The second suction device is positioned above the first suction device, and the composite board is placed in between the suction devices. The linkage connects the driving mechanism and second suction device. A separable interface layer is located in the composite board. When the suction devices are powered up to stick to the top and the bottom surfaces of the composite board, the linkage is pushed by the driving mechanism, so that the second suction device can move in relation to the first suction device, and one of the circuit board is separated from another one of the carrier panels.

    Abstract translation: 提供了一种板分离装置及其操作方法。 板分离装置包括板分离机和由多个电路板和载体板构成的复合板。 板分离机包括框架，第一和第二抽吸装置以及连杆。 第二抽吸装置位于第一抽吸装置的上方，并且复合板被放置在抽吸装置之间。 联动装置连接驱动机构和第二抽吸装置。 可分离的界面层位于复合板中。 当吸引装置通电以粘附到复合板的顶表面和底表面时，联动装置被驱动机构推动，使得第二抽吸装置可以相对于第一抽吸装置移动，并且其中一个 电路板与另一个承载板分离。

    METHOD OF MANUFACTURING PACKAGE STRUCTURE
    44.
    发明申请
    METHOD OF MANUFACTURING PACKAGE STRUCTURE 有权
    制造包装结构的方法

    公开(公告)号：US20130260512A1

    公开(公告)日：2013-10-03

    申请号：US13906355

    申请日：2013-05-31

    Applicant: Shih-Hao Sun

    Inventor： Shih-Hao Sun

    IPC: H01L21/56

    CPC classification number: H01L21/56 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A manufacturing method of a package structure is provided. A seed layer is formed on a upper surface of a metal substrate. A patterned dry film layer is formed on a lower surface of the metal substrate and the seed layer. A portion of the seed layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate a circuit layer on the portion of the seed layer exposed by the patterned dry film layer. A chip is bonded to and electrically connected to the circuit layer. A molding compound is formed on the metal substrate. The molding compound encapsulates the chip, the circuit layer and the portion of the seed layer. A portion of the metal substrate and a portion of the seed layer are removed so as to expose a portion of the molding compound.

    Abstract translation: 提供一种封装结构的制造方法。 种子层形成在金属基板的上表面上。 在金属基板的下表面和种子层上形成图案化的干膜层。 种子层的一部分被图案化的干膜层曝光。 图案化的干膜层用作电镀掩模，以在由图案化的干膜层暴露的种子层的部分上电镀电路层。 芯片被接合并电连接到电路层。 在金属基材上形成模塑料。 模塑料封装芯片，电路层和种子层的部分。 去除金属基材的一部分和种子层的一部分，以暴露部分模塑料。

    STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE
    46.
    发明申请
    STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE 审中-公开
    散热基板的结构与工艺

    公开(公告)号：US20130043016A1

    公开(公告)日：2013-02-21

    申请号：US13293130

    申请日：2011-11-10

    Applicant: Tzu-Shih Shen

    Inventor： Tzu-Shih Shen

    IPC: F28F7/00 ,  B21D53/02

    CPC classification number: H01L33/64 ,  F28D2021/0029 ,  F28F13/00 ,  F28F21/085 ,  H01L21/4878 ,  H01L23/13 ,  H01L23/142 ,  H01L2224/48091 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: Structure of a heat dissipation substrate including a metal substrate, a first insulating material, a second insulating material, a first patterned conductive layer and a second patterned conductive layer is provided. The metal substrate has an upper surface and a lower surface opposite to each other, a plurality of first recesses located on the upper surface and a plurality of second recesses located on the lower surface. The first insulating material is provided to fill into the first recesses. The second insulating material is provided to fill into the second recesses. The first patterned conductive layer is disposed on the upper surface of the metal substrate and a portion of the first insulating material. The second patterned conductive layer is disposed on the lower surface of the metal substrate and a portion of the second insulating material.

    Abstract translation: 提供了包括金属基板，第一绝缘材料，第二绝缘材料，第一图案化导电层和第二图案化导电层的散热基板的结构。 金属基板具有彼此相对的上表面和下表面，位于上表面上的多个第一凹部和位于下表面上的多个第二凹部。 提供第一绝缘材料以填充到第一凹部中。 第二绝缘材料被设置成填充到第二凹部中。 第一图案化导电层设置在金属基板的上表面和第一绝缘材料的一部分上。 第二图案化导电层设置在金属基板的下表面和第二绝缘材料的一部分上。

    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    47.
    发明申请
    PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
    包装结构及其制造方法

    公开(公告)号：US20120293977A1

    公开(公告)日：2012-11-22

    申请号：US13288972

    申请日：2011-11-04

    Applicant: Shih-Hao Sun

    Inventor： Shih-Hao Sun

    IPC: H05K7/00 ,  H05K13/00

    CPC classification number: H05K13/00 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/12041 ,  H01L2924/15788 ,  H05K1/0207 ,  H05K1/185 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49146 ,  H01L2924/00

    Abstract: A manufacturing method of a package structure is provided. A substrate having an upper surface and a lower surface opposite to each other and an opening communicating the surfaces is provided. An electronic device is configured in the opening. An adhesive layer and a patterned metal layer located on the adhesive layer are laminated on the lower surface and expose a bottom surface of the electronic device. A heat-dissipating column is formed on the bottom surface exposed by the adhesive layer and the patterned metal layer and connects the patterned metal layer and the bottom surface. A first and a second laminated structures are laminated on the upper surface of the substrate and the patterned metal layer, respectively. The first laminated structure covers the upper surface of the substrate and a top surface of the electronic device. The second laminated structure covers the heat-dissipating column and the patterned metal layer.

    Abstract translation: 提供一种封装结构的制造方法。 提供具有彼此相对的上表面和下表面的基板以及连通表面的开口。 电子设备配置在开口中。 位于粘合剂层上的粘合剂层和图案化的金属层层压在下表面上并暴露电子器件的底表面。 在由粘合层和图案化金属层露出的底面上形成散热柱，并连接图案化的金属层和底面。 第一和第二层压结构分别层叠在基板的上表面和图案化的金属层上。 第一层压结构覆盖基板的上表面和电子设备的顶表面。 第二层压结构覆盖散热柱和图案化的金属层。

    MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
    49.
    发明申请
    MANUFACTURING METHOD OF CIRCUIT SUBSTRATE 审中-公开
    电路基板的制造方法

    公开(公告)号：US20120279630A1

    公开(公告)日：2012-11-08

    申请号：US13552654

    申请日：2012-07-19

    Applicant: Chih-Hong Chuang ,  Tzu-Wei Huang

    Inventor： Chih-Hong Chuang ,  Tzu-Wei Huang

    IPC: H01B13/34

    CPC classification number: H05K3/427 ,  H05K3/0097 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49156

    Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.

    Abstract translation: 电路基板的制造方法包括以下步骤。 两个金属层的周边结合形成密封区域。 至少形成通过密封区域的通孔。 在两个金属层上形成两个绝缘层。 在两个绝缘层上形成两个导电层。 将两个绝缘层和两个导电层层压到彼此接合的两个金属层上，其中金属层嵌入在两个绝缘层之间，并且两个绝缘层填充到通孔中。 两个金属层的密封区域被分离以形成两个分开的电路基板。 因此，可以在以下步骤中操作较薄的衬底，例如图案化工艺或电镀工艺。 此外，该方法可以扩展为制造具有奇数层或偶数层的电路基板。

    THERMAL CONDUCTIVITY SUBSTRATE AND MANUFACTURING METHOD THEREOF
    50.
    发明申请
    THERMAL CONDUCTIVITY SUBSTRATE AND MANUFACTURING METHOD THEREOF 审中-公开
    热导率基板及其制造方法

    公开(公告)号：US20120070684A1

    公开(公告)日：2012-03-22

    申请号：US13046785

    申请日：2011-03-14

    Applicant: Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chien-Hung Wu

    Inventor： Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chien-Hung Wu

    IPC: B32B15/04 ,  B32B38/00 ,  C25D5/16 ,  B32B37/00

    CPC classification number: C25D5/16 ,  B32B15/08 ,  B32B37/02 ,  B32B2307/302 ,  B32B2457/08 ,  C25D5/10 ,  H01L2924/0002 ,  H05K1/05 ,  H05K3/421 ,  H05K2201/0338 ,  Y10T428/12535 ,  H01L2924/00

    Abstract: A thermal conductivity substrate including a metal substrate, a metal layer, an insulating layer, a plurality of conductive structures, a first conductive layer and a second conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The insulating layer is disposed on the metal layer. The conductive structures are embedded in the insulating layer and connected to a portion of the metal layer. The first conductive layer is disposed on the insulating layer. The second conductive layer is disposed on the first conductive layer and the conductive structures. The second conductive layer is electrically connected to a portion of the metal layer through the conductive structures. The second conductive layer and the conductive structures are integrally formed.

    Abstract translation: 提供了包括金属基板，金属层，绝缘层，多个导电结构，第一导电层和第二导电层的导热性基板。 金属层设置在金属基板上，完全覆盖金属基板。 绝缘层设置在金属层上。 导电结构嵌入在绝缘层中并连接到金属层的一部分。 第一导电层设置在绝缘层上。 第二导电层设置在第一导电层和导电结构上。 第二导电层通过导电结构电连接到金属层的一部分。 第二导电层和导电结构整体形成。

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