COMPACT LED PACKAGE WITH REFLECTIVITY LAYER
    53.
    发明申请
    COMPACT LED PACKAGE WITH REFLECTIVITY LAYER 有权
    具有反射层的紧凑型LED封装

    公开(公告)号:US20140291715A1

    公开(公告)日:2014-10-02

    申请号:US14183218

    申请日:2014-02-18

    Applicant: CREE, INC.

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The packages can also comprise reflective layers to minimize losses due to light absorption, which in turn can increase the overall package emission efficiency.

    Abstract translation: 公开了紧凑且有效地发光的LED封装,并且可以包括具有弯曲和平坦表面的密封剂。 封装可以包括具有一个或多个LED的基座,并且在具有多个LED的基座中,每个LED可以发射与其它LED相同或不同的波长的光。 可以在至少一些LED和底座上包括毯子转换材料层。 密封剂可以位于基座上,至少一些LED上,其中每个平面表面是垂直的并且与底座的边缘中的一个对准。 封装还可以包括反射层,以最小化由光吸收引起的损耗,这进而可以增加整个封装的发射效率。

    Enhanced Luminous Flux Semiconductor Light Emitting Devices Including Red Phosphors that Exhibit Good Color Rendering Properties and Related Red Phosphors
    55.
    发明申请
    Enhanced Luminous Flux Semiconductor Light Emitting Devices Including Red Phosphors that Exhibit Good Color Rendering Properties and Related Red Phosphors 审中-公开
    增强的光通量半导体发光器件,包括具有良好显色性能的红色荧光体和相关的红色荧光粉

    公开(公告)号:US20140167601A1

    公开(公告)日:2014-06-19

    申请号:US13719645

    申请日:2012-12-19

    Applicant: Cree, Inc.

    Abstract: Light emitting devices include an LED that emits light having a dominant wavelength in the blue color range and a recipient luminophoric medium that is configured to down-convert at least some of the light emitted by the LED. In these devices, the recipient luminophoric medium may include at least a green phosphor that down-converts the radiation emitted by the LED to radiation having a peak wavelength that is between about 525 nanometers and about 545 nanometers, a yellow phosphor that down-converts the radiation emitted by the LED to radiation having a peak wavelength that is between about 550 nanometers and about 570 nanometers, and a red (Ca1-x-ySrxEu2+y)SiAlN3 phosphor. The red (Ca1-x-ySrxEu2+y)SiAlN3 phosphor may have a europium content of at least 0.025.

    Abstract translation: 发光装置包括发射蓝色区域中的主波长的光的LED和被配置为对由LED发射的至少一些光进行下变频的接收器发光体。 在这些装置中,受体发光介质可以包括至少一个绿色磷光体,其将由LED发射的辐射下转换成具有在约525纳米至约545纳米之间的峰值波长的辐射,黄色磷光体将 由LED发射的辐射具有在约550纳米至约570纳米之间的峰值波长的辐射,以及红色(Ca1-x-ySrxEu2 + y)SiAlN3荧光体。 红色(Ca1-x-ySrxEu2 + y)SiAlN3荧光体的铕含量可以至少为0.025。

    LIGHT EMITTING DEVICES HAVING CURRENT REDUCING STRUCTURES
    56.
    发明申请
    LIGHT EMITTING DEVICES HAVING CURRENT REDUCING STRUCTURES 有权
    具有减少电流结构的发光装置

    公开(公告)号:US20130292639A1

    公开(公告)日:2013-11-07

    申请号:US13856928

    申请日:2013-04-04

    Applicant: Cree, Inc.

    Abstract: A light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer and an active region between the p-type semiconductor layer and the n-type semiconductor layer. A bond pad is provided on one of the p-type semiconductor layer or the n-type semiconductor layer, opposite the active region, the bond pad being electrically connected to the one of the p-type semiconductor layer or the n-type semiconductor layer. A conductive finger extends from and is electrically connected to the bond pad. A reduced conductivity region is provided in the light emitting device that is aligned with the conductive finger. A reflector may also be provided between the bond pad and the reduced conductivity region. A reduced conductivity region may also be provided in the light emitting device that is not aligned with the bond pad.

    Abstract translation: 发光器件包括p型半导体层,n型半导体层和p型半导体层和n型半导体层之间的有源区。 在与有源区相对的p型半导体层或n型半导体层之一上设置接合焊盘,所述接合焊盘与p型半导体层或n型半导体层中的一者电连接 。 导电指状物从接合焊盘延伸并与其电连接。 在与导电指状物对准的发光器件中设置降低的导电性区域。 还可以在接合焊盘和减小的导电区域之间设置反射器。 还可以在不与接合焊盘对准的发光器件中提供降低的导电性区域。

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