公开(公告)号：US20050250304A1

公开(公告)日：2005-11-10

申请号：US10642092

申请日：2003-08-15

申请人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

发明人： Harry Hedler ,  Roland Irsigler ,  Thorsten Meyer ,  Barbara Vasquez

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166

摘要： A method for fabricating an integrated circuit connection region includes application of a dielectric to an integrated circuit with a connection region, application of a corrodible metalization layer to the dielectric, application of a protection device to the metalization layer, and removal of the protection device in a region around the connection region.

摘要翻译： 一种用于制造集成电路连接区域的方法包括将电介质施加到具有连接区域的集成电路，向电介质施加可腐蚀金属化层，向金属化层施加保护装置，以及将保护装置移除到 连接区域周围的区域。

公开(公告)号：US06905954B2

公开(公告)日：2005-06-14

申请号：US10634242

申请日：2003-08-05

申请人： Harry Hedler ,  Thorsten Meyer ,  Barbara Vasquez

发明人： Harry Hedler ,  Thorsten Meyer ,  Barbara Vasquez

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L23/498 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a method for producing a semiconductor device, with the steps of: applying an interconnect level (11, 12) to a semiconductor substrate (10); structuring the interconnect level (12); and applying a solder layer (13) on the structured interconnect level (11, 12) in such a way that the solder layer (13) assumes the structure of the interconnect level (11, 12). The present invention likewise provides such a semiconductor device.

摘要翻译： 本发明提供了一种制造半导体器件的方法，其特征在于包括：向半导体衬底（10）施加互连电平（11,12）。 构造互连级别（12）; 以及将所述焊料层（13）施加在所述结构化互连层（11,12）上，使得所述焊料层（13）呈现所述互连层（11,12）的结构。 本发明同样提供了这种半导体器件。

公开(公告)号：US06861291B2

公开(公告)日：2005-03-01

申请号：US10135273

申请日：2002-04-30

申请人： Harry Hedler ,  Barbara Vasquez ,  Roland Irsigler

发明人： Harry Hedler ,  Barbara Vasquez ,  Roland Irsigler

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A contact connection between a semiconductor chip and a substrate has a conductive adhesive extending between each contact of the chip and the substrate. The conductive adhesive includes a matrix component, a filler component, a hardener component and at least one decomposable component so that after curing at a curing temperature T1, the adhesive can be decomposed either by applying thermal energy at a temperature T2>T1 or by radiation so that the two contact surfaces can be separated smoothly. After separation the purposes of replacing a defective semiconductor chip, a second chip can be mechanically connected by applying the adhesive and curing it.

摘要翻译： 半导体芯片和基板之间的接触连接具有在芯片的每个接触件和基板之间延伸的导电粘合剂。 导电粘合剂包括基质组分，填料组分，硬化剂组分和至少一种可分解​​组分，使得在固化温度T1固化后，粘合剂可以通过在温度T2> T1或辐射下施加热能来分解 使得两个接触表面可以平滑地分离。 分离后更换有缺陷的半导体芯片的目的，可以通过施加粘合剂并固化第二芯片来机械地连接第二芯片。

公开(公告)号：US06852931B2

公开(公告)日：2005-02-08

申请号：US10105467

申请日：2002-03-26

申请人： Harry Hedler ,  Jörg Zapf

发明人： Harry Hedler ,  Jörg Zapf

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H05K3/28 ,  H05K1/16

CPC分类号： B23P19/00 ,  H01L23/3185 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13008 ,  H01L2224/131 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83907 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19043 ,  H05K1/16 ,  H05K3/284 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/53178 ,  H01L2224/29099 ,  H01L2924/00014

摘要： A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board with external contacts. The printed circuit board is electrically coupled to the electronic device. At least the metallic surfaces of the configuration are covered by a plasma-polymerized polymer layer.

公开(公告)号：US06851598B2

公开(公告)日：2005-02-08

申请号：US10205081

申请日：2002-07-25

申请人： Uta Gebauer ,  Harry Hedler ,  Jürgen Högerl ,  Volker Strutz

发明人： Uta Gebauer ,  Harry Hedler ,  Jürgen Högerl ,  Volker Strutz

IPC分类号： B23K1/00 ,  H01L21/60 ,  H05K3/32 ,  B23K31/00 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/10135 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/325 ,  H05K2201/09781 ,  H05K2201/2036 ,  H01L2924/00

摘要： An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

摘要翻译： 描述了具有至少一个半导体芯片和布线层的电子部件。 布线层具有在空间方向x，y和z上具有低机械强度的弹性接触元件，其可以电连接到印刷电路板的相应接触端子区域。 半导体芯片或布线层另外具有至少两个用于机械连接到印刷电路板的间隔件。 还描述了用于制造电子部件的方法。

公开(公告)号：US06756540B2

公开(公告)日：2004-06-29

申请号：US10155337

申请日：2002-05-24

申请人： Harry Hedler ,  Barbara Vasquez

发明人： Harry Hedler ,  Barbara Vasquez

IPC分类号： H01R909

CPC分类号： H01L24/98 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L24/91 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14505 ,  H01L2224/16237 ,  H01L2224/17517 ,  H01L2224/29019 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81899 ,  H01L2224/81901 ,  H01L2224/81903 ,  H01L2224/83898 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/72

摘要： An integrated circuit (chip) with attachment elements for attaching of the chip on a carrier, the attachment elements being designed in a way such that they can enter into a releasable connection with corresponding attachment elements formed on the carrier. To keep the package size of the chips as small as possible, the attachment elements are arranged directly on the unpackaged chip.

摘要翻译： 具有用于将芯片附接到载体上的附接元件的集成电路（芯片），附接元件被设计成使得它们能够进入与形成在载体上的相应附接元件的可释放连接。 为了保持芯片的封装尺寸尽可能小，连接元件直接布置在未封装的芯片上。

公开(公告)号：US06664176B2

公开(公告)日：2003-12-16

申请号：US09944796

申请日：2001-08-31

申请人： Harry Hedler ,  Thorsten Meyer ,  Stefan Ruckmich ,  Barbara Vasquez

发明人： Harry Hedler ,  Thorsten Meyer ,  Stefan Ruckmich ,  Barbara Vasquez

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19043

摘要： A method for forming printed re-routing for wafer level packaging, especially chip size packaging. The method includes forming a contact layer on a semiconductor die, printing a conductive redistribution structure on the contact layer, and etching the contact layer of the die by using the conductive redistribution structure as a self-aligning mask.

摘要翻译： 用于形成用于晶片级封装的印刷重新布线的方法，特别是芯片尺寸封装。 该方法包括在半导体管芯上形成接触层，在接触层上印刷导电再分布结构，并通过使用导电再分布结构作为自对准掩模来蚀刻管芯的接触层。

公开(公告)号：US06638870B2

公开(公告)日：2003-10-28

申请号：US10044136

申请日：2002-01-10

申请人： Axel Brintzinger ,  Barbara Vasquez ,  Harry Hedler

发明人： Axel Brintzinger ,  Barbara Vasquez ,  Harry Hedler

IPC分类号： H01L21311

CPC分类号： H01L24/10 ,  H01L22/34 ,  H01L24/13 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A method for fabricating a structure on an integrated circuit (IC) wafer, includes providing a material onto a surface of the wafer and shaping the material to have a shape corresponding to the structure. The method can also include removing a remaining portion of the material, depositing a seed layer onto the wafer and the material, and depositing a photoresist on the wafer. In addition, the method can include depositing a metal layer on top of the seed layer, removing the photoresist, etching the seed layer, and etching the material. The resulting structure is usable as a compression stop, a compliant element or a rerouting layer or a combination thereof.

摘要翻译： 一种用于在集成电路（IC）晶片上制造结构的方法，包括在晶片的表面上提供材料并使材料成形以具有与该结构相对应的形状。 该方法还可以包括去除材料的剩余部分，将晶种层沉积到晶片和材料上，以及在晶片上沉积光致抗蚀剂。 此外，该方法可以包括在种子层的顶部上沉积金属层，去除光致抗蚀剂，蚀刻种子层和蚀刻材料。 所得到的结构可用作压缩止挡，柔性元件或重路由层或其组合。

公开(公告)号：US06555415B2

公开(公告)日：2003-04-29

申请号：US10022606

申请日：2001-12-17

申请人： Harry Hedler

发明人： Harry Hedler

IPC分类号： H01L2148

CPC分类号： H01L24/10 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/96 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/19 ,  H01L2224/81193 ,  H01L2224/81899 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H01R13/03 ,  H01R13/2414 ,  H05K3/325 ,  H01L2924/00

摘要： An electronic configuration has a first surface with electrical contacts for electrical bonding. The configuration includes at least one flexible elevation made of an insulating material that is arranged on the first surface. The flexible elevation has at least one recess and the surface of the flexible recess is at least partially covered with an electrically conductive material to form one of the electrical contacts.

公开(公告)号：US08487448B2

公开(公告)日：2013-07-16

申请号：US13195333

申请日：2011-08-01

申请人： Thorsten Meyer ,  Harry Hedler ,  Markus Brunnbauer

发明人： Thorsten Meyer ,  Harry Hedler ,  Markus Brunnbauer

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/92 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for producing chip packages is disclosed. In one embodiment, a plurality of chips is provided. The chips each have first pads. Second connection pads are applied on the wafer, wherein each second pad is electrically connected to a first pad.

摘要翻译： 公开了一种生产芯片封装的方法。 在一个实施例中，提供多个芯片。 每个芯片都有第一个焊盘。 第二连接焊盘被施加在晶片上，其中每个第二焊盘电连接到第一焊盘。