公开(公告)号：US20170219763A1

公开(公告)日：2017-08-03

申请号：US15501119

申请日：2015-08-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Britta Goeoetz ,  Norwin von Malm ,  Dominik Schulten

IPC: F21V8/00 ,  G02F1/1335

CPC classification number: G02B6/0073 ,  G02F1/133603 ,  G02F1/13362 ,  G02F2001/133614 ,  G02F2202/36

Abstract: An optelectonic arrangement and a lighting device are disclosed. In an embodiment the arrangement includes a semiconductor chip for generating radiation and a radiation conversion element located downstream of the semiconductor chip with respect to a radiation direction, wherein the radiation conversion element includes a plurality of conversion bodies each with a longitudinal extension axis, and wherein a spatial orientation of the longitudinal extension axes has a preferred direction.

公开(公告)号：US09653440B2

公开(公告)日：2017-05-16

申请号：US14432302

申请日：2013-10-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Lutz Höppel ,  Norwin von Malm

IPC: H01L33/00 ,  H01L21/00 ,  H01L25/16 ,  H01L33/62 ,  H01L29/861 ,  H01L33/54 ,  H01L33/56 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L25/167 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3157 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L29/861 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/03334 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05147 ,  H01L2224/05647 ,  H01L2224/11002 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/83005 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92143 ,  H01L2224/94 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged, wherein the first surface adjoins a molded body, a first pin and a second pin are embedded in the molded body and electrically conductively connect to the first contact and the second contact, and a protection diode is embedded in the molded body and electrically conductively connect to the first contact and the second contact.

公开(公告)号：US09461218B2

公开(公告)日：2016-10-04

申请号：US14385116

申请日：2013-02-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Illek ,  Matthias Sabathil ,  Alexander Linkov ,  Thomas Bleicher ,  Norwin von Malm ,  Wolfgang Mönch

IPC: H01L33/58 ,  G02F1/1335 ,  H01L33/44 ,  H01L33/54 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/64 ,  F21Y101/02 ,  F21Y105/00 ,  F21V8/00

CPC classification number: H01L33/58 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  G02B6/0015 ,  G02B6/0018 ,  G02B6/0025 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F1/133611 ,  G02F1/133615 ,  G02F2001/133607 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: In at least one embodiment, a surface light source includes one or a more optoelectronic semiconductor chips having a radiation main side for generating a primary radiation. A scattering body is disposed downstream of the radiation main side along a main emission direction of the semiconductor chips. The scatting body is designed for scattering the primary radiation. A main emission direction of the scattering body is oriented obliquely with respect to the main emission direction of the semiconductor chip.

Abstract translation: 在至少一个实施例中，表面光源包括具有用于产生主辐射的辐射主侧的一个或多个光电子半导体芯片。 散射体沿着半导体芯片的主发射方向设置在辐射主侧的下游。 散粒体设计用于散射初级辐射。 散射体的主发射方向相对于半导体芯片的主发射方向倾斜取向。

公开(公告)号：US20160247990A1

公开(公告)日：2016-08-25

申请号：US15030652

申请日：2014-10-27

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Dominik Scholz ,  Norwin von Malm ,  Stefan Illek

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/0095 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method of producing a contact element for an optoelectronic component includes providing an auxiliary carrier with a sacrificial layer arranged on a top side of the auxiliary carrier; providing a carrier structure having a top side and a rear side situated opposite the top side, wherein an insulation layer is arranged at the rear side of the carrier structure; connecting the sacrificial layer to the insulation layer by an electrically conductive connection layer; creating at least one blind hole extending from the top side of the carrier structure as far as the insulation layer; opening the insulation layer in a region of the at least one blind hole; arranging an electrically conductive material in the at least one blind hole; detaching the auxiliary carrier by separating the sacrificial layer; and patterning the electrically conductive connection layer.

Abstract translation: 一种制造用于光电子部件的接触元件的方法包括提供辅助载体，所述辅助载体具有布置在所述辅助载体的顶侧上的牺牲层; 提供具有与顶侧相对的顶侧和后侧的载体结构，其中绝缘层布置在载体结构的后侧; 通过导电连接层将牺牲层连接到绝缘层; 形成至少一个从所述载体结构的顶侧延伸至所述绝缘层的盲孔; 在所述至少一个盲孔的区域中打开所述绝缘层; 在所述至少一个盲孔中布置导电材料; 通过分离牺牲层来分离辅助载体; 并图案化导电连接层。

公开(公告)号：US09324920B2

公开(公告)日：2016-04-26

申请号：US14348519

申请日：2012-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Andreas Ploessl ,  Norwin von Malm ,  Alexander Linkov ,  Lutz Hoeppel ,  Christopher Koelper

IPC: H01L33/48 ,  H01L33/20 ,  H01L33/00 ,  H01L31/02 ,  H01L31/0232 ,  H01L33/50 ,  H01L33/58 ,  H01L33/22

CPC classification number: H01L33/48 ,  H01L31/0232 ,  H01L33/20 ,  H01L33/22 ,  H01L33/486 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip and an optical element. A connecting layer includes a transparent oxide arranged between the semiconductor chip and the optical element. The connecting layer directly adjoins the semiconductor chip and the optical element and fixes the optical element on the semiconductor chip. A method for fabricating an optoelectronic semiconductor component is furthermore specified.

Abstract translation: 光电子半导体部件包括光电半导体芯片和光学元件。 连接层包括布置在半导体芯片和光学元件之间的透明氧化物。 连接层直接邻接半导体芯片和光学元件，并将光学元件固定在半导体芯片上。 此外还规定了制造光电子半导体部件的方法。

公开(公告)号：US20160027765A1

公开(公告)日：2016-01-28

申请号：US14773830

申请日：2014-03-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm ,  Alexander Martin

IPC: H01L25/16 ,  H01L33/50 ,  H01L27/15 ,  H01L29/786 ,  H01L23/538

CPC classification number: H01L25/167 ,  H01L23/5386 ,  H01L27/156 ,  H01L29/78672 ,  H01L33/382 ,  H01L33/405 ,  H01L33/44 ,  H01L33/505 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A display device includes at least one semiconductor body, which has a semiconductor layer sequence, which has an active region provided for producing radiation and forms a plurality of pixels. The device also includes a driver circuit that has a plurality of switches, which are each provided for controlling at least one pixel. A first metallization layer and/or the second metallization layer are electroconductively connected to at least one of the pixels. The first metallization layer and the second metallization layer are arranged overlapping one another in such a manner that, in a plan view onto the display device, the driver circuit is covered with at least one of the metallization layers at every point which overlaps with one of the pixels or is arranged between two adjacent pixels.

Abstract translation: 显示装置包括至少一个具有半导体层序列的半导体本体，半导体层序列具有提供用于产生辐射并形成多个像素的有源区域。 该装置还包括具有多个开关的驱动器电路，每个开关被设置用于控制至少一个像素。 第一金属化层和/或第二金属化层与至少一个像素电导连接。 第一金属化层和第二金属化层被布置成彼此重叠，使得在平面图中，在显示装置上，驱动电路被覆盖有至少一个金属化层，在与 像素或布置在两个相邻像素之间。

公开(公告)号：US20140225149A1

公开(公告)日：2014-08-14

申请号：US14348519

申请日：2012-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Andreas Ploessl ,  Norwin von Malm ,  Alexander Linkov ,  Lutz Hoeppel ,  Christopher Koelper

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L31/0232 ,  H01L33/20 ,  H01L33/22 ,  H01L33/486 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip and an optical element. A connecting layer includes a transparent oxide arranged between the semiconductor chip and the optical element. The connecting layer directly adjoins the semiconductor chip and the optical element and fixes the optical element on the semiconductor chip. A method for fabricating an optoelectronic semiconductor component is furthermore specified.

Abstract translation: 光电子半导体部件包括光电半导体芯片和光学元件。 连接层包括布置在半导体芯片和光学元件之间的透明氧化物。 连接层直接邻接半导体芯片和光学元件，并将光学元件固定在半导体芯片上。 此外还规定了制造光电子半导体部件的方法。

公开(公告)号：US20140098556A1

公开(公告)日：2014-04-10

申请号：US14115697

申请日：2012-03-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Norwin von Malm ,  Georg Bogner ,  Joachim Reill ,  Stefan Grötsch

IPC: H01L33/08 ,  F21S8/10

CPC classification number: H01L33/08 ,  F21K9/00 ,  F21S41/141 ,  F21S41/143 ,  F21S41/18 ,  F21S41/663 ,  F21Y2105/12 ,  F21Y2105/14 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic semiconductor module includes a plurality of light-emitting areas, which emit light when in operation. At least two abutting lateral edges of at least one light-emitting area are arranged at an angle of more than 0 degrees and less than 90 degrees to each other. Further embodiments relate to a display having a plurality of such modules.

Abstract translation: 光电子半导体模块包括多个在工作时发光的发光区域。 至少一个发光区域的至少两个邻接横向边缘彼此以大于0度且小于90度的角度布置。 另外的实施例涉及具有多个这样的模块的显示器。

公开(公告)号：US20230049186A1

公开(公告)日：2023-02-16

申请号：US17785747

申请日：2020-12-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jens Eberhard ,  Andreas Hanisch ,  Norwin von Malm

IPC: H01L33/46 ,  H01L33/00 ,  H01L25/075

Abstract: In an embodiment an optical component includes an optical body at least partially translucent to visible light and a coating directly arranged at the optical body, wherein the coating has a reflection coefficient of at least 0.8 for at least one wavelength range in a range from 380 nm to 1500 nm and an average thickness between 10 μm and 200 μm inclusive, wherein the coating has a polysiloxane as base material, and wherein the polysiloxane comprises —SiO3/2 units.

公开(公告)号：US20210384395A1

公开(公告)日：2021-12-09

申请号：US17415977

申请日：2019-12-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm ,  Reinhard Streitel ,  Kathy Schmidtke

IPC: H01L33/62 ,  H01L33/64 ,  H01L33/46

Abstract: A radiation-emitting component is disclosed. In an embodiment a radiation-emitting component includes a radiation-emitting semiconductor chip and a transparent joining layer mechanically stably connecting the radiation-emitting semiconductor chip with a carrier, wherein the transparent joining layer comprises a matrix material in which a plurality of nanoparticles are located.