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    Semiconductor package
    51.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10276516B2

    公开(公告)日：2019-04-30

    申请号：US15966382

    申请日：2018-04-30

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Jing-Cheng Lin ,  Chin-Chuan Chang ,  Jui-Pin Hung

    IPC: H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/03 ,  H01L25/065 ,  H01L25/10

    Abstract: Some embodiments relate to a semiconductor package. The semiconductor package includes a redistribution layer (RDL) including a first metal layer and a second metal layer. The second metal layer is stacked over the first metal layer and is coupled to the first metal layer through a via. A first semiconductor die is disposed over the RDL. The first semiconductor die includes a plurality of contact pads electrically coupled to the RDL, and the RDL enables fan-out connection of the first semiconductor die. A second semiconductor die is disposed over the first semiconductor die and over the RDL. The second semiconductor die is bonded to the RDL by a plurality of conductive bump structures.

    PRINTING MODULE, PRINTING METHOD AND SYSTEM OF FORMING A PRINTED STRUCTURE
    52.
    发明申请
    PRINTING MODULE, PRINTING METHOD AND SYSTEM OF FORMING A PRINTED STRUCTURE 审中-公开

    公开(公告)号：US20190123015A1

    公开(公告)日：2019-04-25

    申请号：US16218495

    申请日：2018-12-13

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Jing-Cheng Lin ,  Li-Hui Cheng ,  Po-Hao Tsai ,  Chih-Chien Pan

    IPC: H01L23/00 ,  H01L21/67 ,  H01L25/10 ,  H01L21/56 ,  H01L21/78

    Abstract: A printing module, printing method and system of forming a printed structure are provided. The printing module includes a first printing dispenser operable to dispense a first material, a second printing dispenser operable to dispense a second material, a first curing unit, a second curing unit and a third curing unit. The first, the second and the third curing units each is operable to irradiate a light capable of curing the first and second materials and are alternately arranged with the first and second printing dispensers along a line. The first and second printing dispensers and the first, second and third curing units are simultaneously movable along the line. During the second curing unit and one of the first curing unit and the third curing unit are operable to irradiate the light, the other of the first curing unit and the third curing unit is off.

    FAN-OUT WAFER LEVEL PACKAGE STRUCTURE
    60.
    发明申请
    FAN-OUT WAFER LEVEL PACKAGE STRUCTURE 有权

    公开(公告)号：US20250070004A1

    公开(公告)日：2025-02-27

    申请号：US18944831

    申请日：2024-11-12

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Jing-Cheng Lin

    IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/03 ,  H01L25/10

    Abstract: A method for forming a package structure may comprise applying a die and vias on a carrier having an adhesive layer and forming a molded substrate over the carrier and around the vias, and the ends of the vias and mounts on the die exposed. The vias may be in via chips with one or more dielectric layers separating the vias. The via chips 104 may be formed separately from the carrier. The dielectric layer of the via chips may separate the vias from, and comprise a material different than, the molded substrate. An RDL having RDL contact pads and conductive lines may be formed on the molded substrate. A second structure having at least one die may be mounted on the opposite side of the molded substrate, the die on the second structure in electrical communication with at least one RDL contact pad.

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