公开(公告)号：US20110108870A1

公开(公告)日：2011-05-12

申请号：US12922240

申请日：2009-04-20

Applicant: Harald Jaeger ,  Joerg Erich Sorg

Inventor： Harald Jaeger ,  Joerg Erich Sorg

IPC: H01L33/48 ,  H05K1/03 ,  H01L33/00

CPC classification number: H01L33/483 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/181 ,  H05K1/0366 ,  H05K2201/0162 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An optoelectronic semiconductor component includes a connection carrier with at least two connection points and configured with a silicone matrix with a fiber reinforcement, and at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith.

Abstract translation: 光电子半导体部件包括具有至少两个连接点的连接载体，并且配置有具有纤维加强件的硅树脂矩阵，以及安装在连接载体上并与其直接接触的至少一个光电子半导体芯片。

公开(公告)号：US07895742B2

公开(公告)日：2011-03-01

申请号：US11872580

申请日：2007-10-15

Applicant: Kyoung-Sei Choi ,  Sa-Yoon Kang ,  Yong-Hwan Kwon ,  Chung-Sun Lee

Inventor： Kyoung-Sei Choi ,  Sa-Yoon Kang ,  Yong-Hwan Kwon ,  Chung-Sun Lee

IPC: H01K3/22

CPC classification number: H05K3/28 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/101 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0129 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/0759 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916

Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Abstract translation: 根据本发明的制造带布线板的方法可以在形成布线图案中采用压印工艺，从而减少制造带布线板的工艺的数量，并允许制造工艺在单个生产线中进行。 因此，制造时间和成本可能降低。 布线图案的轮廓可以通过模具的印模图案的形状来确定。 这可以建立内部和外部引线的顶部宽度并且结合细小的垫间距。 虽然ILB和OLB过程可能使用NCP，但是由于软和弹性布线图案可能建立连接可靠性。

公开(公告)号：US20110030999A1

公开(公告)日：2011-02-10

申请号：US12634145

申请日：2009-12-09

Applicant: Young-Il LEE ,  Sung-Eun Kim ,  Tae-Hoon Kim ,  Young-Kwan Seo

Inventor： Young-Il LEE ,  Sung-Eun Kim ,  Tae-Hoon Kim ,  Young-Kwan Seo

IPC: H05K1/03 ,  H05K3/10

CPC classification number: H05K3/386 ,  H05K3/1208 ,  H05K2201/0133 ,  H05K2201/0162 ,  Y10T29/49162

Abstract: The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin; and metal wiring patterns formed with an ink composition including metal nanoparticles, in which the metal wiring exhibits excellent adhesive between metal nano materials and the substrate and electrical property.

Abstract translation: 本发明提供一种具有有机粘合剂层的金属电路布线，金属电路布线包括：由选自丙烯酸树脂，氯丁二烯橡胶和硅橡胶树脂的树脂形成的有机粘合剂层; 以及金属配线图案，其形成有包含金属纳米颗粒的油墨组合物，其中金属布线在金属纳米材料和基材之间表现出优异的粘合剂和电性能。

公开(公告)号：US07871707B2

公开(公告)日：2011-01-18

申请号：US11506617

申请日：2006-08-17

Applicant: Lucien D. Laude ,  Robert J. Greenberg

Inventor： Lucien D. Laude ,  Robert J. Greenberg

IPC: B32B15/08

CPC classification number: H05K3/185 ,  C08J7/12 ,  C08J2383/04 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1657 ,  C23C18/204 ,  C23C18/206 ,  H05K3/28 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T428/26 ,  Y10T428/31663

Abstract: A flexible electrode array of silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or their mixtures and at least one metal trace in a silicone-containing polymer.

Abstract translation: 含有SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的含硅氧烷颗粒的柔性电极阵列和含硅氧烷聚合物中的至少一种金属痕迹。

公开(公告)号：US07750076B2

公开(公告)日：2010-07-06

申请号：US11595516

申请日：2006-11-10

Applicant: Lucien D. Laude ,  Neil Hamilton Talbot ,  Robert J. Greenberg

Inventor： Lucien D. Laude ,  Neil Hamilton Talbot ,  Robert J. Greenberg

IPC: C08L83/04

CPC classification number: H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/204 ,  H05K1/0289 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/007 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2203/016 ,  H05K2203/1105

Abstract: A polymer layer comprising silicone contains oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and one or more metal traces embedded in the polymer layer, where the metal trace is bonded to the polymer silicon metal bond.

Abstract translation: 包含硅氧烷的聚合物层包含SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒，以及嵌入聚合物层中的一种或多种金属迹线， 聚合物硅金属键。

公开(公告)号：US20100012362A1

公开(公告)日：2010-01-21

申请号：US12090628

申请日：2006-10-18

Applicant: Tomoyuki Abe ,  Toshio Komiyatani

Inventor： Tomoyuki Abe ,  Toshio Komiyatani

IPC: H05K1/02 ,  B32B27/04 ,  B32B7/06 ,  B32B7/12 ,  H05K1/03 ,  C08G77/04 ,  C08L79/08 ,  C08L83/04 ,  C08K3/22

CPC classification number: C09J179/08 ,  C08G59/4042 ,  C08L63/00 ,  H05K1/0346 ,  H05K3/281 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  Y10T428/1476 ,  Y10T428/2852 ,  Y10T428/31663

Abstract: The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, in which flowing out during heating/pressing is prevented and which provide excellent adhesion strength. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, which exhibit excellent heat resistance.

Abstract translation: 本发明提供一种用作印刷电路板的粘合剂材料的树脂组合物，其包含聚酰亚胺硅氧烷树脂。 本发明还提供了防止加热/加压期间流出的树脂组合物，树脂膜，覆盖膜，层间粘合剂，覆金属层压板和多层印刷电路板，并且提供优异的粘合强度 。 本发明还提供耐热性优异的树脂组合物，树脂膜，覆盖膜，层间粘合剂，覆金属层压板和多层印刷电路板。

公开(公告)号：US20090321121A1

公开(公告)日：2009-12-31

申请号：US12552389

申请日：2009-09-02

Applicant: Hiromichi KAWAKAMI ,  Iwao FUJITA ,  Makoto TOSE ,  Yoshifumi SAITO ,  Masahiro KIMURA

Inventor： Hiromichi KAWAKAMI ,  Iwao FUJITA ,  Makoto TOSE ,  Yoshifumi SAITO ,  Masahiro KIMURA

IPC: H05K1/18

CPC classification number: H01L24/81 ,  H01L21/4807 ,  H01L21/481 ,  H01L23/15 ,  H01L23/24 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/3185 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81355 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/0179 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film is lower than about 100 nm. After that, external electrodes of a mounting component are electrically connected and firmly hold to the lands of the laminated substrate body via solder. Next, a resin sealing material for sealing the mounting component is formed on the laminated substrate body.

Abstract translation: 具有优异的耐迁移性和树脂密封材料与陶瓷多层基板本体之间的高粘合强度的陶瓷多层基板包括具有焊盘的层叠基板主体和外部电极，并被通过PVD工艺形成的硅氧烷膜覆盖。 硅氧烷膜的厚度低于约100nm。 此后，安装部件的外部电极通过焊料电连接并牢固地保持在层叠基板主体的焊盘上。 接下来，在层叠基板主体上形成用于密封安装部件的树脂密封材料。

公开(公告)号：US20090092748A1

公开(公告)日：2009-04-09

申请号：US12329960

申请日：2008-12-08

Applicant: Masahiro NAIKI ,  Masayuki KINOUCHI ,  Seiji ISHIKAWA ,  Yuji Matsui ,  Yoshiki TANAKA

Inventor： Masahiro NAIKI ,  Masayuki KINOUCHI ,  Seiji ISHIKAWA ,  Yuji Matsui ,  Yoshiki TANAKA

IPC: B05D5/12

CPC classification number: H05K3/285 ,  H01L23/296 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/3452 ,  H05K2201/0162 ,  Y10T29/49171 ,  Y10T29/49224 ,  H01L2224/0401

Abstract: A process for packaging an electronic device employs an insulating protective resin layer produced from one or more of the resin compositions: (1) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.5 to 30 parts of an epoxy compound having an epoxy equivalent of more than 800, and an organic solvent, (2) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 10 parts of an epoxy compound having an epoxy equivalent of 100 to 800, 2 to 30 weight parts of a polyvalent isocyanate compound, and an organic solvent; and (3) 100 parts of an organic solvent-soluble resin having a polysiloxane skeleton and a polar group, 0.1 to 20 parts of an epoxy compound having an epoxy equivalent of more than 800, 2 to 30 parts of a polyvalent isocyanate compound, and an organic solvent.

Abstract translation: 包装电子装置的方法采用由一种或多种树脂组合物制成的绝缘保护树脂层：（1）100份具有聚硅氧烷骨架和极性基团的有机溶剂可溶性树脂，0.5〜30份 环氧当量大于800的环氧化合物和有机溶剂，（2）100份具有聚硅氧烷骨架和极性基团的有机溶剂可溶性树脂，0.1至10份具有环氧当量的环氧当量的环氧化合物 100〜800,2重量份至30重量份的多价异氰酸酯化合物和有机溶剂; 和（3）100份具有聚硅氧烷骨架和极性基团的有机溶剂可溶性树脂，0.1〜20份环氧当量大于800的环氧化合物，2〜30份多价异氰酸酯化合物，以及 有机溶剂。

公开(公告)号：US07511616B2

公开(公告)日：2009-03-31

申请号：US10788505

申请日：2004-02-26

Applicant: Rickie C. Lake

Inventor： Rickie C. Lake

IPC: G08B13/14

CPC classification number: H05K3/321 ,  H01M2/1044 ,  H05K2201/0162 ,  H05K2201/10037 ,  Y10S257/924 ,  Y10T29/49114 ,  Y10T29/4913

Abstract: A curable adhesive composition is provided. A battery and a substrate to which the battery is to be conductively connected are also provided. The adhesive composition is interposed between the battery and the substrate. In another aspect, a curable epoxy composition is interposed between first and second electrically conductive components. In another aspect, a battery powerable apparatus, such as an RF communication device or RFID device, is coupled to a battery via a conductive epoxy. In another aspect, first and second electric components are electrically connected with one another through a conductive epoxy.

Abstract translation: 提供了一种可固化的粘合剂组合物。 还提供了电池和要与其导电连接的基板。 粘合剂组合物介于电池和基底之间。 另一方面，可固化的环氧组合物介于第一和第二导电组分之间。 另一方面，诸如RF通信设备或RFID设备的电池供电设备经由导电环氧树脂耦合到电池。 在另一方面，第一和第二电气部件通过导电环氧树脂彼此电连接。

公开(公告)号：US20080276508A1

公开(公告)日：2008-11-13

申请号：US12112863

申请日：2008-04-30

Applicant: Dae Hee LEE

Inventor： Dae Hee LEE

IPC: G09F13/22

CPC classification number: G09F9/33 ,  H01L25/167 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/10106 ,  H01L2924/00

Abstract: Disclosed is a Light Emitting Diode (LED) for an electric signboard. The LED can prevent formation of shade caused by a coated silicon layer while minimizing the weight and thickness of the electric signboard. Further, the LED protects an internal LED chip by using a transparent hemispheric cap having scattering property, and a chip die is mounted on a Printed Circuit Board (PCB) while closely making contact with the surface of the PCB, so that thickness and weight of silicon coated on the surface of the PCB can be minimized.

Abstract translation: 公开了一种用于电动招牌的发光二极管（LED）。 LED可以防止由涂覆的硅层引起的阴影的形成，同时最小化电招牌的重量和厚度。 此外，LED通过使用具有散射特性的透明半球帽来保护内部LED芯片，并且在与PCB的表面紧密接触的同时将印刷电路板（PCB）安装在印刷电路板（PCB）上，使得厚度和重量 涂覆在PCB表面上的硅可以最小化。