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1.发明授权Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same 有权包含硅氧烷和至少一种金属痕迹的聚合物层及其制造方法公开(公告)号：US08603590B2
公开(公告)日：2013-12-10
申请号：US11924363
申请日：2007-10-25
CPC分类号： H05K3/185 , C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/1692 , C23C18/204 , H05K1/0289 , H05K1/032 , H05K1/0373 , H05K1/0393 , H05K3/0035 , H05K3/007 , H05K3/107 , H05K3/28 , H05K3/4661 , H05K3/4682 , H05K2201/0162 , H05K2201/0209 , H05K2203/016 , H05K2203/1105
摘要： The invention relates to a method of embedding a metal trace in a silicone containing polymer layer, by the steps of applying an agent that does not adhere to a substrate; applying a polymer layer on the non adhering agent; irradiating a surface of the polymer with a light beam emitted by an excimer laser creating cuts, grooves, blind holes or vias; immersing the irradiated polymer in an autocatalytic bath containing metal ions and metallizing the polymer; thermally treating the metallized polymer layer to induce diffusion of the metalized metal into the first polymer layer; applying a polymer layer on the thermally treated metallized polymer; and thermally treating the metallized polymer.
摘要翻译： 本发明涉及一种将含金属痕迹嵌入有机硅聚合物层中的方法，通过以下步骤：施加不粘附到基底上的试剂; 在非粘合剂上施加聚合物层; 用由准分子激光器发射的光束照射聚合物的表面，产生切口，凹槽，盲孔或通孔; 将照射的聚合物浸入含有金属离子的自催化浴中并使聚合物金属化; 热处理金属化聚合物层以诱导金属化金属扩散到第一聚合物层中; 将聚合物层施加在经热处理的金属化聚合物上; 并对金属化聚合物进行热处理。
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2.发明申请Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same 有权包含硅氧烷和至少一种金属痕迹的聚合物层及其制造方法公开(公告)号：US20070287784A1
公开(公告)日：2007-12-13
申请号：US11595516
申请日：2006-11-10
CPC分类号： H05K3/185 , C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/1692 , C23C18/204 , H05K1/0289 , H05K1/032 , H05K1/0373 , H05K1/0393 , H05K3/0035 , H05K3/007 , H05K3/107 , H05K3/28 , H05K3/4661 , H05K3/4682 , H05K2201/0162 , H05K2201/0209 , H05K2203/016 , H05K2203/1105
摘要： The present invention relates to a process for embedding at least one layer of at least one metal trace in a silicone containing polymer, comprising: a) applying a non adhering on a substrate; b) applying a polymer layer on the non adhering agent; c) irradiation at least one surface area of said polymer with a light beam emitted by an excimer laser; d) immersing said irradiated polymer in at least one autocatalytic bath containing metal ions of at least one metal and metallizing the polymer; e) thermally treating said metallized polymer; f) applying a polymer layer on said thermally treated metallized polymer; and g) thermally treating said metallized polymer.
摘要翻译： 本发明涉及一种在含硅氧烷聚合物中嵌入至少一层至少一种金属迹线的方法，包括：a）将不粘附在基底上; b）在非粘合剂上施加聚合物层; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将所述照射的聚合物浸入至少一种含有至少一种金属的金属离子并使聚合物金属化的自催化浴; e）热处理所述金属化聚合物; f）将聚合物层施加在所述热处理的金属化聚合物上; 和g）热处理所述金属化聚合物。
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公开(公告)号：US07750076B2
公开(公告)日：2010-07-06
申请号：US11595516
申请日：2006-11-10
IPC分类号： C08L83/04
CPC分类号： H05K3/185 , C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/1692 , C23C18/204 , H05K1/0289 , H05K1/032 , H05K1/0373 , H05K1/0393 , H05K3/0035 , H05K3/007 , H05K3/107 , H05K3/28 , H05K3/4661 , H05K3/4682 , H05K2201/0162 , H05K2201/0209 , H05K2203/016 , H05K2203/1105
摘要： A polymer layer comprising silicone contains oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and one or more metal traces embedded in the polymer layer, where the metal trace is bonded to the polymer silicon metal bond.
摘要翻译： 包含硅氧烷的聚合物层包含SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒，以及嵌入聚合物层中的一种或多种金属迹线， 聚合物硅金属键。
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4.发明授权Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same 有权包含有机硅和至少一种金属痕迹的成型聚合物及其制造方法公开(公告)号：US09185810B2
公开(公告)日：2015-11-10
申请号：US11924752
申请日：2007-10-26
IPC分类号： B29D11/00 , B05D3/06 , B05D5/12 , H05K3/18 , C25D5/02 , C25D5/56 , C23C18/16 , C23C18/18 , C23C18/20 , H05K1/03 , H05K3/00 , H05K3/28 , H05K3/42 , H05K3/46
CPC分类号： H05K3/185 , C23C18/1612 , C23C18/1639 , C23C18/1641 , C23C18/1692 , C23C18/1868 , C23C18/204 , C25D5/02 , C25D5/56 , H05K1/032 , H05K1/0393 , H05K3/0035 , H05K3/28 , H05K3/421 , H05K3/4661 , H05K2201/0162
摘要： The invention is a method of making a flexible electrode array, comprising a silicone containing body, a metal trace layer and an electrode pad on the surface, including the steps of irradiating a surface area of a molded silicone containing layer yielding traces with the light beam from a pulsed ultraviolet laser source; immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal traces; applying a silicone containing layer on the silicone containing layer and the metal traces; irradiating the surface for drilling holes in the molded silicone containing layer; and immersing the irradiated molded silicone layer for inducing the deposit of metal ions to form metal electrode pads.
摘要翻译： 本发明是一种制造柔性电极阵列的方法，该方法包括含硅体的物质，金属迹线层和表面上的电极焊盘，包括以下步骤：用模塑的含硅氧烷的层的表面积照射光束 来自脉冲紫外激光源; 浸渍所述照射的模制的硅氧烷层以诱导金属离子的沉积形成金属痕迹; 在含硅树脂层和金属迹线上涂覆含硅氧烷层; 照射表面用于在模塑的含硅树脂层中钻孔; 并将用于诱导金属离子沉积的照射的模制硅氧烷层浸渍以形成金属电极焊盘。
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公开(公告)号：US07749608B2
公开(公告)日：2010-07-06
申请号：US11810758
申请日：2007-06-06
IPC分类号： H05K1/09
CPC分类号： H05K3/185 , A61N1/0543 , C23C18/1639 , C23C18/1653 , C23C18/1692 , C23C18/1868 , C23C18/1882 , C23C18/31 , H05K1/032 , H05K3/0035 , H05K3/107 , H05K3/465 , H05K3/4661 , H05K2201/0162 , H05K2201/096 , H05K2203/107 , Y10T428/24917 , Y10T428/31663
摘要： The present invention provides a flexible electrode array, comprising a silicone containing body, at least one metal trace layer and at least one electrode pad on the surface.
摘要翻译： 本发明提供了一种柔性电极阵列，其包括硅氧烷容纳体，至少一个金属迹线层和表面上的至少一个电极焊盘。
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6.发明授权Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same 有权包含硅氧烷和至少一种金属痕迹的聚合物层及其制造方法公开(公告)号：US08771805B2
公开(公告)日：2014-07-08
申请号：US11270907
申请日：2005-11-10
CPC分类号： H05K3/185 , C08J7/12 , C08J2383/04 , C23C18/1608 , C23C18/1612 , C23C18/1657 , C23C18/204 , C23C18/206 , H05K3/28 , H05K3/387 , H05K2201/0133 , H05K2201/0162 , H05K2201/0209 , H05K2201/0236 , H05K2203/107 , H05K2203/1105 , Y10T428/26 , Y10T428/31663
摘要： The present invention provides a process for embedding at least one layer of at least one metal trace in a silicone-containing polymer, comprising: a) applying a polymer layer on a substrate; b) thermally treating the polymer; c) irradiating at least one surface area of the polymer with a light beam emitted by an excimer laser; d) immersing the irradiated polymer in at least one autocatalytic bath containing ions of at least one metal, and metallizing the polymer; e) thermally treating the metallized polymer; f) applying a polymer layer covering the thermally treated metallized polymer; and g) thermally treating the metallized covered polymer. The present invention further provides a polymer layer comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.The present invention further provides a flexible electrode array comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.
摘要翻译： 本发明提供了一种在含硅酮聚合物中嵌入至少一层至少一种金属痕迹的方法，包括：a）在基底上施加聚合物层; b）热处理聚合物; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将经辐射的聚合物浸入至少一种含有至少一种金属的离子的自催化浴中，并对聚合物进行金属化; e）热处理金属化聚合物; f）涂覆覆盖热处理的金属化聚合物的聚合物层; 和g）热处理金属化被覆聚合物。 本发明还提供一种聚合物层，其包含含硅氧烷的SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒，以及嵌入所述聚合物层中的至少一种金属迹线。 本发明还提供一种柔性电极阵列，其包括含硅氧烷的SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的氧化物颗粒和嵌入所述聚合物层中的至少一种金属迹线。
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公开(公告)号：US07871707B2
公开(公告)日：2011-01-18
申请号：US11506617
申请日：2006-08-17
IPC分类号： B32B15/08
CPC分类号： H05K3/185 , C08J7/12 , C08J2383/04 , C23C18/1608 , C23C18/1612 , C23C18/1657 , C23C18/204 , C23C18/206 , H05K3/28 , H05K3/387 , H05K2201/0133 , H05K2201/0162 , H05K2201/0209 , H05K2201/0236 , H05K2203/107 , H05K2203/1105 , Y10T428/26 , Y10T428/31663
摘要： A flexible electrode array of silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or their mixtures and at least one metal trace in a silicone-containing polymer.
摘要翻译： 含有SiO 2，TiO 2，Sb 2 O 3，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3，Fe 3 O 4，滑石，羟基磷灰石或其混合物的含硅氧烷颗粒的柔性电极阵列和含硅氧烷聚合物中的至少一种金属痕迹。
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8.发明授权公开(公告)号：US09643002B2
公开(公告)日：2017-05-09
申请号：US13167074
申请日：2011-06-23
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
CPC分类号： A61N1/0543 , A61N1/36046 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/0014 , H05K2201/05 , H05K2201/053 , H05K2201/09063 , H05K2201/09409 , Y10T29/49002 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49174 , Y10T29/49176
摘要： The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening.
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9.发明授权Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device 有权柔性电路电极阵列器件及柔性电路电极器件的背面处理方法公开(公告)号：US08738149B2
公开(公告)日：2014-05-27
申请号：US13397604
申请日：2012-02-15
申请人： Qingfang Yao , Jordan Matthew Nevsmith , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
发明人： Qingfang Yao , Jordan Matthew Nevsmith , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
IPC分类号： A61N1/04
CPC分类号： A61N1/05 , A61N1/0541 , A61N1/0543 , B23K26/361 , B23K26/362
摘要： The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.
摘要翻译： 本发明涉及一种柔性电路电极阵列器件，包括：聚合物层; 其中所述聚合物层包括一个或多个金属迹线，电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。 本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。
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公开(公告)号：US08501547B2
公开(公告)日：2013-08-06
申请号：US13567366
申请日：2012-08-06
申请人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
发明人： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Honggang Jiang
IPC分类号： H01L21/56
CPC分类号： A61N1/375 , A61N1/3754 , H01L23/291 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/12 , H01L24/85 , H01L2224/0345 , H01L2224/0347 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05164 , H01L2224/05166 , H01L2224/05187 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/13164 , H01L2224/13169 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/04953 , H01L2924/00 , H01L2224/48 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： An implantable hermetically sealed microelectronic device and method of manufacture are disclosed. The microelectronic device of the present invention is hermetically encased in a insulator, such as alumina formed by ion bean assisted deposition (“IBAD”), with a stack of biocompatible conductive layers extending from a contact pad on the device to an aperture in the hermetic layer. In a preferred embodiment, one or more patterned titanium layers are formed over the device contact pad, and one or more platinum layers are formed over the titanium layers, such that the top surface of the upper platinum layer defines an external, biocompatible electrical contact for the device. Preferably, the bottom conductive layer is larger than the contact pad on the device, and a layer in the stack defines a shoulder.
摘要翻译： 公开了可植入气密微电子器件及其制造方法。 本发明的微电子器件气密地封装在诸如由离子豆辅助沉积（“IBAD”）形成的氧化铝之类的绝缘体中，一堆生物相容的导电层从器件上的接触垫延伸到密封的孔 层。 在优选实施例中，在器件接触焊盘上形成一个或多个图案化的钛层，并且在钛层上形成一个或多个铂层，使得上铂层的顶表面限定外部的生物相容的电接触， 装置。 优选地，底部导电层大于器件上的接触焊盘，并且堆叠中的层限定了肩部。
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