公开(公告)号：US07943434B2

公开(公告)日：2011-05-17

申请号：US12405773

申请日：2009-03-17

申请人： Joseph Charles Fjelstad

发明人： Joseph Charles Fjelstad

IPC分类号： H01L21/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/0278 ,  H05K3/1241 ,  H05K2201/0191 ,  H05K2201/09118 ,  H05K2203/1469

摘要： A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

摘要翻译： 一种用于制造单片模制电子组件（12）的方法（10）。 提供具有配合以形成内部腔室（16）的第一和第二模具部分（14a-b）的模具（14）。 模具具有连接到腔室中的注射口（22）和通道（24）。 具有电子触点（32）的电子部件（30）填充到第二模具部分上，以基本上容纳在腔室中。 将模具配合在一起，并且通过注入口通道注入液体绝缘模塑材料（36）以填充腔室。 将成型材料硬化成固体，从而将电子部件嵌入到成型材料中作为整体式子组件（40）。 将单片子组件从模具中取出，并且将一个或多个无焊导电电路（50）施加到电子部件的电子触点，从而提供电子组件。

公开(公告)号：US07936066B2

公开(公告)日：2011-05-03

申请号：US12125155

申请日：2008-05-22

申请人： Sang Gon Lee ,  Dae Sung Kim ,  Woo Hyuck Chang

发明人： Sang Gon Lee ,  Dae Sung Kim ,  Woo Hyuck Chang

IPC分类号： H01L29/72

CPC分类号： H05K3/388 ,  H01L2224/16225 ,  H01L2924/12044 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K3/243 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10128 ,  H05K2201/10681 ,  Y10T428/12389 ,  Y10T428/24917 ,  Y10T428/2495 ,  H01L2924/00

摘要： A flexible film is provided. The flexible film includes a dielectric film; and a metal layer disposed on the dielectric film, wherein the ratio of the thickness of the metal layer to the thickness of the dielectric film is about 1:3 to 1:10. Therefore, it is possible to improve the peel strength, dimension stability, and tensile strength of a flexible film by limiting the ratio of the thicknesses of a dielectric film and a metal layer of the flexible film.

摘要翻译： 提供柔性膜。 柔性膜包括电介质膜; 以及设置在所述电介质膜上的金属层，其中所述金属层的厚度与所述电介质膜的厚度之比为约1:3至1:10。 因此，可以通过限制柔性膜的电介质膜和金属层的厚度的比例来提高柔性膜的剥离强度，尺寸稳定性和拉伸强度。

公开(公告)号：US07902678B2

公开(公告)日：2011-03-08

申请号：US10594844

申请日：2005-01-12

申请人： Akira Ohuchi ,  Tomoo Murakami

发明人： Akira Ohuchi ,  Tomoo Murakami

IPC分类号： H01L23/498

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10175 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/16111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/27013 ,  H01L2224/29036 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/81805 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Electrode pads (5) and a solder resist (7) are disposed on the upper surface of a wiring board (1), and apertures (7a) are formed in the solder resist (7) so as to expose the electrode pads (5). Electrodes (4) are disposed on the lower surface of a semiconductor element (2). Electrodes (4) are connected to the electrode pads (5) by way of bumps (3). An underfill resin (6) is disposed in the area that excludes the solder resist (7) and the bumps (3) in the space between the wiring board (1) and the semiconductor element (2). Between the wiring board (1) and the semiconductor element (2), the thickness (B) of the solder resist (7) is equal to or greater than the thickness (A) of the underfill resin (6) on the solder resist (7). The volume (Vb) of the bumps (3) is less than the volume (Vs) of the apertures (7a).

摘要翻译： 电极焊盘（5）和阻焊剂（7）设置在布线板（1）的上表面上，并且在阻焊剂（7）中形成孔（7a）以暴露电极焊盘（5） 。 电极（4）设置在半导体元件（2）的下表面上。 电极（4）通过凸块（3）连接到电极焊盘（5）。 在布线基板（1）和半导体元件（2）之间的空间中排除阻焊剂（7）和凸起（3）的区域中设置底部填充树脂（6）。 在布线基板（1）和半导体元件（2）之间，阻焊剂（7）的厚度（B）等于或大于阻焊剂上的底部填充树脂（6）的厚度（A） 7）。 凸块（3）的体积（Vb）小于孔（7a）的体积（Vs）。

公开(公告)号：US20100288550A1

公开(公告)日：2010-11-18

申请号：US12679615

申请日：2008-07-28

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H05K1/11

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/002 ,  H05K3/4007 ,  H05K2201/0191 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/05599

摘要： There has been such a problem that conventional element mounting substrates and circuit devices using such substrates are not easily thinned, as there is a wiring layer formed on each of the substrates and that a part of the wiring layer is protruded and used as a bump electrode. In an element mounting substrate of this invention and a circuit device using such substrate, a through hole is arranged on an insulating base material, and a wiring layer is protruded from the surface of the insulating base material through the through hole. The protruding section of the wiring layer is used as a bump electrode, and a semiconductor element is mounted on the insulating base material. With such structure, the element mounting substrate is thinned, and the circuit device using such substrate is also thinned.

摘要翻译： 存在使用这种基板的常规元件安装基板和电路装置不容易变薄的问题，因为在每个基板上形成布线层，并且布线层的一部分突出并用作凸块电极 。 在本发明的元件安装基板和使用这种基板的电路装置中，在绝缘基材上设置通孔，并且通过贯通孔从绝缘基材的表面突出布线层。 布线层的突出部分用作凸起电极，半导体元件安装在绝缘基材上。 通过这种结构，元件安装基板变薄，并且使用这种基板的电路装置也变薄。

公开(公告)号：US20100236821A1

公开(公告)日：2010-09-23

申请号：US12491043

申请日：2009-06-24

申请人： Jin Seon Park ,  Sung Yi ,  Jung Won Lee

发明人： Jin Seon Park ,  Sung Yi ,  Jung Won Lee

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/3511 ,  H05K3/321 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00

摘要： Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.

摘要翻译： 这里公开了一种电子部件嵌入式印刷电路板，包括：基板，包括绝缘树脂层和电路层; 以及埋设在所述绝缘树脂层中的电子部件，所述绝缘树脂层的厚度为所述电子部件的厚度的1.3〜3倍。 电子元件嵌入式印刷电路板具有其成分的最佳厚度比，以便使其制造时的翘曲最小化。

公开(公告)号：US07733661B2

公开(公告)日：2010-06-08

申请号：US12393034

申请日：2009-02-25

申请人： Dean Paul Kossives ,  Byung Joon Han

发明人： Dean Paul Kossives ,  Byung Joon Han

IPC分类号： H05K7/00

CPC分类号： H05K1/16 ,  H01L23/3677 ,  H01L23/645 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6622 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0237 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/0191 ,  H05K2201/10674 ,  Y10T29/49124 ,  Y10T29/49155 ,  H01L2224/05599

摘要： A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.

摘要翻译： 提供具有接地面，第一面和第二面的基板。 形成将第一侧电连接到第二侧的通孔。 印刷线形成在第一侧上，印刷线形成在第二面上。 在第一侧形成无源部件。 无源部件形成为没有接地平面。 活动部件附接到第一侧。

公开(公告)号：US20100047653A1

公开(公告)日：2010-02-25

申请号：US12544254

申请日：2009-08-20

申请人： Hiroshi YAMAZAKI ,  Noriaki AIMOTO ,  Taiki SUEYOSHI ,  Hiroyuki HANAZONO

发明人： Hiroshi YAMAZAKI ,  Noriaki AIMOTO ,  Taiki SUEYOSHI ,  Hiroyuki HANAZONO

IPC分类号： H01M8/10 ,  H05K1/00

CPC分类号： H01M8/1011 ,  H01M8/0234 ,  H01M8/0239 ,  H01M8/0243 ,  H01M8/0245 ,  H01M8/2475 ,  H01M2250/30 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/249 ,  H05K3/28 ,  H05K2201/0191 ,  Y02B90/18 ,  Y02E60/523

摘要： A pair of rectangular collector portions and extraction conductor portions that each extend in a long-sized shape from the respective collector portions are formed on one surface of a base insulating layer. A carbon containing layer is formed on the base insulating layer to cover the collector portion and the extraction conductor portion excluding a tip. A carbon containing layer and a solder resist layer are formed on the base insulating layer to cover the collector portion and the extraction conductor portion excluding a tip. The solder resist layer is formed to cover a portion of the extraction conductor portion above a bend portion.

摘要翻译： 在基底绝缘层的一个表面上形成一对矩形集电体部分和提取导体部分，每个矩形收集器部分和提取导体部分各自从各个集电部分延伸成长形状。 在基底绝缘层上形成含碳层，以覆盖除了尖端之外的集电体部分和提取导体部分。 在基底绝缘层上形成含碳层和阻焊层，以覆盖不包括尖端的集电体部分和提取导体部分。 阻焊层形成为覆盖在弯曲部分上方的提取导体部分的一部分。

公开(公告)号：US20100014262A1

公开(公告)日：2010-01-21

申请号：US12566186

申请日：2009-09-24

申请人： Masanori MINAMIO ,  Hideki TAKEHARA ,  Yoshiyuki ARAI ,  Toshiyuki FUKUDA

发明人： Masanori MINAMIO ,  Hideki TAKEHARA ,  Yoshiyuki ARAI ,  Toshiyuki FUKUDA

IPC分类号： H05K1/16 ,  H05K5/00 ,  H05K1/18

CPC分类号： H05K3/284 ,  H05K3/3442 ,  H05K2201/0191 ,  H05K2201/10636 ,  Y02P70/611

摘要： In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions.

摘要翻译： 在具有嵌入式电子部件的模块中，在基板的部件安装面上形成有连接电极。 每个电子部件的电极部分被放置在各个连接电极上，并通过使用焊料与固定的关系连接。 电子部件被封装在封装树脂中。 当将每个电子部件的主体部分的下表面与部件安装表面之间的距离假设为a，并且封装树脂的位于电子部件的主体部分上方的部分的厚度 假定为b，如果b / a设定为不大于6的值，则当具有嵌入式电子部件的模块被回流安装在印刷布线基板等上时，可以防止发生 由焊料的熔化和流动导致的短路故障，这导致两个电极部分之间的短路。

公开(公告)号：US20090242243A1

公开(公告)日：2009-10-01

申请号：US12413810

申请日：2009-03-30

申请人： Detlev Bagung

发明人： Detlev Bagung

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K1/028 ,  H05K1/0278 ,  H05K3/0032 ,  H05K3/0044 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2203/0228 ,  Y10T29/49124

摘要： A printed circuit board has a first main side and a second main side disposed opposite the first main side. A first and a second rigid zone are linked to each other by way of a flexible zone and the flexible zone is embodied thinner than the first and second rigid zones perpendicular to the first and second main sides. The flexible zone has at least one metallization layer and at least one substrate layer formed of an insulating material and connected to the at least one metallization layer. The substrate layer is formed with a plurality of trenches which in each case extend at the most up to one of the one or more metallization layers.

摘要翻译： 印刷电路板具有与第一主侧相对设置的第一主侧和第二主侧。 第一和第二刚性区域通过柔性区域彼此连接，并且柔性区域被实施为比垂直于第一和第二主侧面的第一刚性区域和第二刚性区域更薄。 柔性区具有至少一个金属化层和至少一个由绝缘材料形成并连接到该至少一个金属化层的基底层。 衬底层形成有多个沟槽，每个沟槽在每种情况下最多延伸到一个或多个金属化层中的一个。

公开(公告)号：US20090224397A1

公开(公告)日：2009-09-10

申请号：US12042105

申请日：2008-03-04

申请人： Wen-Jeng FAN

发明人： Wen-Jeng FAN

IPC分类号： H01L23/498 ,  H05K7/06

CPC分类号： H01L23/49822 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2203/1572 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A substrate with reduced substrate warpage and a semiconductor package utilizing the substrate are revealed. The substrate primarily comprises a core where a wiring layer and a first solder mask are formed on one surface of the core, and a second solder mask and a die-attaching layer are formed on the other surface of the core. The first solder mask has a thickness difference with respect to the second solder mask in a manner to reduce the warpage of the substrate caused by thermal stresses due to temperature differences can be well under control. Therefore, the manufacturing cost of the substrate can be lower without adding extra stiffeners to achieve substrate warpage control during semiconductor packaging processes.

摘要翻译： 揭示了具有降低的基板翘曲的基板和利用该基板的半导体封装。 基板主要包括在芯的一个表面上形成布线层和第一焊料掩模的芯，并且在芯的另一个表面上形成第二焊料掩模和管芯附着层。 第一焊料掩模具有相对于第二焊料掩模的厚度差，以减少由于温度差导致的热应力引起的基板的翘曲的方式可以很好地控制。 因此，在半导体封装工序中，不添加额外的加强件来实现基板翘曲控制，基板的制造成本可以更低。