公开(公告)号：US06952961B2

公开(公告)日：2005-10-11

申请号：US10820772

申请日：2004-04-09

申请人： Masahiro Kawai ,  Fumiyoshi Yonezawa ,  Akira Takashima ,  Hiroyuki Uramachi

发明人： Masahiro Kawai ,  Fumiyoshi Yonezawa ,  Akira Takashima ,  Hiroyuki Uramachi

IPC分类号： G01F15/02 ,  G01F1/684 ,  G01F5/00 ,  G01F1/68

CPC分类号： G01F5/00 ,  G01F1/6845

摘要： An air flow rate measuring device serves to measure a flow rate of air flowing through a main passage inside an intake pipe of an engine. A base has its one end directed axially of the main passage toward an upstream side of air flowing therein, and its other end directed toward a downstream side thereof, with a bent groove being formed in the base. A circuit module includes a support substrate and a detection element installed one surface of the support substrate for detecting the flow rate of air, the module being joined to the base in a face-to-face relation with respect to each other to form an auxiliary passage in cooperation with the groove. The detection element on the one surface of the support substrate is exposed to air in the auxiliary passage, and the other surface of the support substrate is exposed to air in the main passage.

摘要翻译： 空气流量测量装置用于测量流过发动机的进气管内的主通道的空气的流量。 底座的一端朝向主通道的轴向朝向其中流动的空气的上游侧，并且其另一端指向其下游侧，在基座中形成有弯曲的凹槽。 电路模块包括支撑基板和安装在支撑基板的一个表面上用于检测空气流量的检测元件，该模块以相对于彼此的面对面关系连接到基座，以形成辅助 与沟槽合作。 支撑基板的一个表面上的检测元件暴露于辅助通道中的空气，并且支撑基板的另一个表面暴露于主通道中的空气。

公开(公告)号：US06869819B2

公开(公告)日：2005-03-22

申请号：US10321629

申请日：2002-12-18

申请人： Mitsuhisa Watanabe ,  Yoshikazu Kumagaya ,  Akira Takashima

发明人： Mitsuhisa Watanabe ,  Yoshikazu Kumagaya ,  Akira Takashima

IPC分类号： H01L21/68 ,  G01B11/00 ,  G01R31/26 ,  G03F9/00 ,  G06K9/00 ,  H01L21/00 ,  H01L21/50 ,  H01L21/66 ,  H01L21/683 ,  H01L21/78 ,  H01L21/784 ,  H01L23/44 ,  H01L23/544

CPC分类号： H01L21/78 ,  H01L21/67092 ,  H01L21/681 ,  H01L23/44 ,  H01L2924/0002 ,  H01L2924/00

摘要： A high-contrast image recognition can be performed by recognizing an image of a recognition mark from a back surface of a wafer by a visible-light camera by irradiating a visible light from a circuit pattern surface of a silicon substrate. A thickness of the silicon substrate is set to 5 μm to 50 μm. A white or visible light having a wavelength equal to or less than 800 nm is irradiated onto the circuit-pattern forming surface of the substrate. A visible light that has transmitted through the silicon substrate is received by a visible-light camera on a side of a back surface of the silicon substrate. An image of a recognition mark formed on the circuit-pattern forming surface of the silicon substrate is recognized by the visible-light camera.

摘要翻译： 通过从硅衬底的电路图案表面照射可见光，可以通过可见光照相机从晶片的背面识别识别标记的图像来执行高对比度图像识别。 将硅衬底的厚度设定为5μm至50μm。 将具有等于或小于800nm的波长的白色或可见光照射到基板的电路图案形成表面上。 通过硅衬底透射的可见光被可见光照相机接收在硅衬底背面的一侧上。 形成在硅衬底的电路图案形成表面上的识别标记的图像由可见光照相机识别。

公开(公告)号：US06777799B2

公开(公告)日：2004-08-17

申请号：US10623490

申请日：2003-07-22

申请人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Takao Nishimura

发明人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Takao Nishimura

IPC分类号： H01L2302

CPC分类号： H01L25/0652 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

公开(公告)号：US06621169B2

公开(公告)日：2003-09-16

申请号：US09940625

申请日：2001-08-29

申请人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Tadashi Uno ,  Takao Nishimura ,  Fumihiko Ando ,  Hiroshi Onodera ,  Hayato Okuda

发明人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Tadashi Uno ,  Takao Nishimura ,  Fumihiko Ando ,  Hiroshi Onodera ,  Hayato Okuda

IPC分类号： H01L2358

CPC分类号： H01L25/0652 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

公开(公告)号：US06404062B1

公开(公告)日：2002-06-11

申请号：US09492391

申请日：2000-01-27

申请人： Fumihiko Taniguchi ,  Sachiko Nogami ,  Akira Takashima

发明人： Fumihiko Taniguchi ,  Sachiko Nogami ,  Akira Takashima

IPC分类号： H01C2348

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L23/13 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a semiconductor chip, solder balls, a printed wiring substrate on which the semiconductor chip is provided and which serves to electrically connect the semiconductor chip and the solder balls. When such a semiconductor device is mounted on a motherboard, at least one through-aperture is in advance formed on the printed wiring substrate oppositely to the semiconductor chip. After the solder balls are soldered to the motherboard, an under-filler is introduced from either of a space between the semiconductor chip and the printed wiring substrate or a space between the printed wiring substrate and the motherboard, thus flowing from one space into the other space via the through-aperture.

摘要翻译： 半导体器件包括半导体芯片，焊球，其上设置有半导体芯片的印刷布线基板，其用于电连接半导体芯片和焊球。 当这种半导体器件安装在母板上时，预先在与半导体芯片相对的印刷布线基板上形成至少一个通孔。 在将焊球焊接到母板上之后，从半导体芯片和印刷布线基板之间的空间或印刷布线基板和母板之间的空间中引入底部填料，从而从一个空间流入另一个空间 通过通孔的空间。

公开(公告)号：US06388333B1

公开(公告)日：2002-05-14

申请号：US09605687

申请日：2000-06-27

申请人： Fumihiko Taniguchi ,  Kouhei Orikawa ,  Tadashi Uno ,  Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

发明人： Fumihiko Taniguchi ,  Kouhei Orikawa ,  Tadashi Uno ,  Fumihiko Ando ,  Akira Takashima ,  Hiroshi Onodera ,  Eiji Yoshida ,  Kazuo Teshirogi

IPC分类号： H01L2940

CPC分类号： H01L25/50 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plurality of semiconductor devices can be mounted on a mounting board in a three-dimensional structure by stacking one on another with a simple structure. A semiconductor element is mounted on a first surface of an interposer. Electrode pads connected to the semiconductor element are arranged around the semiconductor element on the first surface of the interposer. Protruding electrodes are provided on the respective electrode pads. Through holes are formed in the interposer so as to extend from a second surface opposite to the first surface of the redistribution substrate to the respective electrode pads. The semiconductor element is encapsulated by a seal resin. Each of the protruding electrodes is higher than the sealed portion of the semiconductor element.

摘要翻译： 多个半导体器件可以通过以简单的结构彼此堆叠而以三维结构安装在安装板上。 半导体元件安装在插入件的第一表面上。 连接到半导体元件的电极焊盘围绕该中介层的第一表面上的半导体元件布置。 突出电极设置在相应的电极焊盘上。 在插入器中形成通孔，从与再分布基板的第一表面相反的第二表面延伸到相应的电极焊盘。 半导体元件由密封树脂封装。 每个突出电极比半导体元件的密封部分高。

公开(公告)号：US5970161A

公开(公告)日：1999-10-19

申请号：US765445

申请日：1997-01-17

申请人： Akira Takashima ,  Yuichi Komatsu ,  Nobuo Miura ,  Masayuki Hashimoto ,  Nobuyuki Mukaino

发明人： Akira Takashima ,  Yuichi Komatsu ,  Nobuo Miura ,  Masayuki Hashimoto ,  Nobuyuki Mukaino

IPC分类号： G06F1/16 ,  H04N5/64 ,  H04R1/02 ,  H04R5/02

CPC分类号： G06F1/1605 ,  H04N5/642 ,  H04R5/02

摘要： A speaker system removably attachable to a video monitor is described which would eliminate the complexity in mounting the speaker system as an add-on unit as well as the ungraceful appearance of the video monitor when the speaker system is removed. The top side of a case incorporating speakers is formed to match the shape of the bottom of the front panel of the video monitor. The speaker system can be mounted on the bottom of the front panel of the video monitor, which is supported on top of a base, as a locking member formed on the top of the case is engaged with a locking hole formed in the bottom of the front panel, or a locking member formed on the bottom of the front panel is engaged with a locking hole formed in the top of the case. Due to lightweight and compact construction, the speaker system can be integrally mounted on the video monitor by using dead space formed between the video monitor and its base and it can be easily removed therefrom.

摘要翻译： PCT No.PCT / JP96 / 01307 Sec。 371日期1997年1月17日 102（e）日期1997年1月17日PCT提交1996年5月16日PCT公布。 公开号WO96 / 37085 日期：1996年11月21日描述了可拆卸地附接到视频监视器的扬声器系统，其将消除将扬声器系统作为附加单元安装的复杂性以及当扬声器系统被移除时视频监视器的不良外观。 形成具有扬声器的外壳的顶侧形成为与视频监视器的前面板的底部的形状相匹配。 扬声器系统可以安装在视频监视器的前面板的底部，其被支撑在基座的顶部上，因为形成在壳体的顶部上的锁定构件与形成在壳体的底部的锁定孔接合 前面板或形成在前面板的底部上的锁定构件与形成在壳体顶部的锁定孔接合。 由于轻巧紧凑的结构，扬声器系统可以通过使用在视频监视器及其底座之间形成的死区而整体地安装在视频监视器上，并且可以容易地从其中移除。

公开(公告)号：US5760471A

公开(公告)日：1998-06-02

申请号：US794763

申请日：1997-02-03

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Junichi Kasai ,  Masataka Mizukoshi ,  Kousuke Otokita ,  Hiroshi Yoshimura ,  Katsuhiro Hayashida ,  Akira Takashima ,  Masahiko Ishiguri ,  Michio Sono

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Junichi Kasai ,  Masataka Mizukoshi ,  Kousuke Otokita ,  Hiroshi Yoshimura ,  Katsuhiro Hayashida ,  Akira Takashima ,  Masahiko Ishiguri ,  Michio Sono

IPC分类号： H01L23/495 ,  H01L25/10 ,  H01L23/48 ,  H01L23/02 ,  H01L23/12 ,  H01L23/50

CPC分类号： H01L23/4951 ,  H01L23/49551 ,  H01L25/105 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/8547 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042

摘要： A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and the leads. In the semiconductor device, the outer lead part is exposed to the outside of a side face of the plastic package, and the plastic package is mounted on any base in a standing form by the side face contacting the base.

摘要翻译： 包括半导体元件的半导体器件和与半导体元件连接的引线。 每个引线包括用于外部连接的外引线部分。 半导体器件还包括密封半导体元件和引线的塑料封装。 在半导体器件中，外部引线部分暴露于塑料封装的侧面的外侧，塑料封装通过与底座接触的侧面以立式形式安装在任何基座上。

公开(公告)号：US5447888A

公开(公告)日：1995-09-05

申请号：US194343

申请日：1994-02-08

申请人： Akira Takashima ,  Toshiyuki Honda ,  Masaki Waki

发明人： Akira Takashima ,  Toshiyuki Honda ,  Masaki Waki

IPC分类号： B29C45/14 ,  H01L21/56 ,  B29C45/02 ,  H01L21/603

CPC分类号： B29C45/14655 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  Y10T29/49121

摘要： A process wherein the parts of a lead frame that are outside a cavity are directly supported by ejecting pins extending from above and from below when the lead frame is sandwiched between an upper die and a lower die. The ejecting pins eject the lead frame, on which a package is formed, after a resin mold process.

摘要翻译： 当引线框架夹在上模和下模之间时，引导框架外部空腔的这些部分直接由从上方和下方延伸的引脚支撑。 在树脂模具加工之后，弹出销弹出形成包装的引线框架。

公开(公告)号：US4735494A

公开(公告)日：1988-04-05

申请号：US864277

申请日：1986-05-19

申请人： Hiroshi Makino ,  Tadaharu Kihara ,  Akira Takashima

发明人： Hiroshi Makino ,  Tadaharu Kihara ,  Akira Takashima

IPC分类号： G02B7/08 ,  G02B7/10 ,  G02B7/28 ,  G02B7/36 ,  G03B3/00 ,  G03B13/36 ,  G02B15/14 ,  H04N5/232

CPC分类号： G02B7/102 ,  G02B7/282

摘要： The present invention user plural driving speeds of the focusing lens component of a zoom lens which responds to plural separate control regions of focal length and object position. In each control region, the focusing lens component is driven in predetermined suitable constant speed. By this operation the object is nearly focused on the focal plane. The slight discrepancy between the image position of the object and the ideal plane is regarded as zero.

摘要翻译： 本发明用户对变焦透镜的聚焦透镜部件的多个驱动速度进行响应，该变焦透镜对焦距和对象位置的多个分离的控制区域进行响应。 在每个控制区域中，以预定的合适的恒定速度驱动聚焦透镜部件。 通过此操作，物体几乎集中在焦平面上。 物体的图像位置与理想平面之间的轻微差异被认为是零。