公开(公告)号：US06650457B2

公开(公告)日：2003-11-18

申请号：US09862414

申请日：2001-05-21

Applicant: Bradley L. Busscher ,  Bradley L. Northman ,  Kenton J. Ypma ,  Randall J. Beute ,  John K. Roberts ,  Wayne M. Jordan ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Randall S. Braun ,  Gregory A. Bosch ,  Timothy A. Bonardi

Inventor： Bradley L. Busscher ,  Bradley L. Northman ,  Kenton J. Ypma ,  Randall J. Beute ,  John K. Roberts ,  Wayne M. Jordan ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Randall S. Braun ,  Gregory A. Bosch ,  Timothy A. Bonardi

IPC: G02F115

CPC classification number: B60R1/0602 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/072 ,  B60R1/088 ,  B60R1/1207 ,  B60R2001/1215 ,  G02B5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting/diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

公开(公告)号：US06507496B2

公开(公告)日：2003-01-14

申请号：US09872122

申请日：2001-05-31

Applicant: Paul S. Levy ,  David Frame

Inventor： Paul S. Levy ,  David Frame

IPC: H05K706

CPC classification number: H05K1/141 ,  H05K1/181 ,  H05K3/3447 ,  H05K2201/0792 ,  H05K2201/1034 ,  H05K2201/10484 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: A dual-sided circuit board module designed for an operating position that is not perpendicular to a system motherboard will be coupled to the motherboard by leads having at least two different lengths. Because leads of differing lengths have differing associated inductance, the operating characteristics of the leads and therefore the devices coupled to the leads will differ. In order to improve the operating characteristics of the module, integrated circuit packages are selected based on the inductive (and possibly other) qualities of the leads to which the respective packages are coupled. In one embodiment, leads having a larger inductance are coupled to integrated circuit (IC) packages having a smaller inductance and vice versa, which allows the inductive characteristics of the various components of the module to have more closely matching inductive characteristics than would otherwise be possible.

Abstract translation: 设计用于不垂直于系统主板的操作位置的双面电路板模块将通过具有至少两个不同长度的引线耦合到母板。 因为不同长度的引线具有不同的相关电感，所以引线的工作特性以及耦合到引线的器件的操作特性将不同。 为了提高模块的工作特性，集成电路封装是基于各个封装所耦合的引线的电感（也可能是其它）的质量来选择的。 在一个实施例中，具有较大电感的引线被耦合到具有较小电感的反馈的集成电路（IC）封装，这允许模块的各种部件的电感特性具有比否则可能更紧密匹配的感应特性 。

公开(公告)号：US20020159707A1

公开(公告)日：2002-10-31

申请号：US10060067

申请日：2002-01-29

Applicant: Onix Microsystems, Inc.

Inventor： Kristofer Mortzheim ,  Kelvin Chau

IPC: G02B006/26

CPC classification number: G02B6/43 ,  G02B6/422 ,  G02B6/4231 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10484 ,  Y02P70/613

Abstract: An apparatus and method for aligning one or more optical fibers is disclosed. The apparatus includes a carrier having one or more through holes and one or more plugs, each of which is sized to be received in one or more of the three or more through holes. The carrier is adapted to receive one or more waveguides. The waveguides may be aligned by inserting a plug into each of one or more through holes in a carrier; attaching a waveguide to the carrier; aligning the carrier to align the one or more waveguides with respect to an optical device attached to a substrate; and tacking one or more of the plugs to the substrate to maintain the alignment of the waveguides with respect to the optical device.

Abstract translation: 公开了一种用于对准一根或多根光纤的装置和方法。 该装置包括具有一个或多个通孔和一个或多个插头的载体，每个插头的尺寸被设计成容纳在三个或更多个通孔中的一个或多个中。 载体适于接收一个或多个波导。 波导可以通过将插头插入到载体中的一个或多个通孔中的每一个中而对准; 将波导附接到所述载体; 对准载体以使一个或多个波导相对于连接到基板的光学装置对准; 并且将一个或多个插头固定到基板以保持波导相对于光学装置的对准。

公开(公告)号：US20020109000A1

公开(公告)日：2002-08-15

申请号：US10016270

申请日：2001-11-02

Inventor： Glenn A. Rinne

IPC: B23K001/00 ,  B23K031/00 ,  B23K031/02 ,  B23K013/08 ,  B23K015/02

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0212 ,  H05K3/3436 ,  H05K2201/10484 ,  H05K2203/0278 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A second substrate is positioned relative to a first substrate having phase-changeable bumps, such as solder bumps, between them, wherein the second substrate has a first face adjacent the first substrate, a second face remote from the first substrate, and at least one edge wall between the first and second faces. The phase-changeable bumps are liquefied to establish an equilibrium position of the first and second substrates relative to one another. At least a portion of the second face is pushed away from the equilibrium position towards the first substrate, to a new position, without applying external force to the first face other than spring forces of the phase-changeable bumps that are liquefied, and without applying external force to any edge wall. Thus, only spring forces of the phase-changeable bumps that are liquefied oppose the pushing. The phase-changeable bumps that are liquefied then are solidified, to maintain the new position.

Abstract translation: 第二基板相对于在它们之间具有相变凸块（例如焊料凸块）的第一基板定位，其中第二基板具有邻近第一基板的第一面，远离第一基板的第二面，以及至少一个 第一和第二面之间的边缘壁。 相变凸块被液化以建立第一和第二衬底相对于彼此的平衡位置。 将第二面的至少一部分从平衡位置朝向第一基板推向新的位置，而不对除液化的相变凸块的弹簧力之外的第一面施加外力，并且不施加 对任何边缘墙的外力。 因此，只有液化的可相变凸块的弹簧力相对于推动。 然后液化的相变凸块被固化，以保持新的位置。

公开(公告)号：US06434034B1

公开(公告)日：2002-08-13

申请号：US09888167

申请日：2001-06-22

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C502

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US06215671B1

公开(公告)日：2001-04-10

申请号：US09208905

申请日：1998-12-10

Applicant: Robert M. Kalis

Inventor： Robert M. Kalis

IPC: H05K111

CPC classification number: H05K1/148 ,  H01R12/52 ,  H01R43/0263 ,  H01R43/205 ,  H05K1/0215 ,  H05K3/3447 ,  H05K9/0039 ,  H05K2201/096 ,  H05K2201/10484 ,  H05K2201/10924

Abstract: A circuit board assembly is provided for electrically coupling together two or more circuit boards, with one circuit board oriented at an acute angle relative to the other circuit board. The assembly includes a first circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes is electrically isolated from the others and each is electrically connected to electronic circuitry printed on the first circuit board. The assembly further includes a second circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes of the second board is electrically isolated from the others and is electrically connected to electronic circuitry printed on the second circuit board. The assembly also includes a conductive support plate having a plurality of connecting legs extending therefrom along a first edge thereof. The second circuit board is placed in registry with the plate, with the legs extending through the connecting holes of the second circuit board. The legs also extend through the connecting holes of the first circuit board, with the plate and the second circuit board being oriented at an angle with respect to the first circuit board. The legs are adapted to be soldered to the first circuit board and the second circuit board, and are adapted to be severed from the plate to form an electrical connection between the first circuit board and the second circuit board.

公开(公告)号：US5143277A

公开(公告)日：1992-09-01

申请号：US825068

申请日：1992-01-24

Applicant: Pascal Roche ,  Claude Courtin

Inventor： Pascal Roche ,  Claude Courtin

IPC: H01L23/50 ,  B23K20/02 ,  H01L21/603 ,  H05K1/00 ,  H05K1/02 ,  H05K3/34 ,  H05K13/04

CPC classification number: H01L24/80 ,  B23K20/023 ,  H05K13/0465 ,  H05K3/3421 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0393 ,  H05K2201/10469 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49135

Abstract: Disclosed is a method for the mounting, on an flexible substrate, of miniature electronic components of the beam lead type. Said method consists, after a first connection lead of a component has been soldered to the substrate, in arching each of the other connection leads of the component considered during their soldering by pressing the connection lead considered on a metallized zone of the substrate by means of a tip of a soldering tool while, at the same time, making a approaching movement towards the body of the component considered with this tip before carrying out the soldering operation itself. Through this mounting method, the beam lead electronic components are no longer placed flat against the substrate with their connection leads in an extended position but are arched on these leads. This gives them a freedom of play that enables them to absorb mechanical stresses by adopting positions of greater flatness or lesser flatness on the substrate.

Abstract translation: 公开了一种用于在柔性基板上安装光束引线型微型电子部件的方法。 所述方法包括：在将部件的第一连接引线焊接到基板之后，在焊接期间考虑的部件的其它连接引线中的每个连接引线，通过在基板的金属化区域上压制连接引线，借助于 同时在进行焊接操作本身之前同时朝向与该尖端相关的部件的主体接近移动。 通过这种安装方法，光束引线电子部件不再放置在基板的平面上，其连接引线处于延伸位置，而是在这些引线上拱起。 这使它们具有游戏自由度，使得它们能够通过采用更大的平坦度或更小平坦度的位置来吸收机械应力。

公开(公告)号：US4451121A

公开(公告)日：1984-05-29

申请号：US390940

申请日：1982-06-22

Applicant: Hideo Fushimoto

Inventor： Hideo Fushimoto

IPC: H05K1/18 ,  G02F1/13 ,  G09F9/00 ,  H01R13/24 ,  H05K3/30 ,  H05K3/32 ,  H01L39/02

CPC classification number: H05K3/303 ,  G02F1/13452 ,  H01R13/2414 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10136 ,  H05K2201/10484 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A display device for electronic appliances, wherein a table having an inclined surface and connectors to connect a display implement and printed wires formed on a printed base board are interposed between the display implement and a single sheet of the printed board. By urging the display device toward the printed base board, the display implement is supported in inclination with respect to the printed base board by urging the former to the latter.

Abstract translation: 一种用于电子设备的显示装置，其中具有倾斜表面的桌子和用于连接显示器具的连接器和形成在印刷基板上的印刷线夹在显示器具和单张印刷电路板之间。 通过将显示装置推向印刷基板，显示工具相对于印刷基板倾斜地支撑，通过将印刷机推向印刷基板。

公开(公告)号：US2958013A

公开(公告)日：1960-10-25

申请号：US60591656

申请日：1956-08-20

Applicant: ARTHUR ANSLEY MFG CO

Inventor： ANSLEY ARTHUR C

IPC: H01R12/55 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K3/366 ,  H05K1/14 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

公开(公告)号：US08431829B2

公开(公告)日：2013-04-30

申请号：US12453632

申请日：2009-05-18

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/10484 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.