METHOD OF CONTROLLING OPTICAL TRANSMITTER OPERABLE FOR PULSE-AMPLITUDE MODULATION SIGNAL

    公开(公告)号:US20170346570A1

    公开(公告)日:2017-11-30

    申请号:US15604048

    申请日:2017-05-24

    发明人: Ryouta Teranishi

    IPC分类号: H04B10/50 H04B10/516

    摘要: An optical transmitter that outputs an optical signal with a pulse amplitude modulation (PAM) configuration is disclosed. The optical transmitter includes a light-generating device and a driver. The light-generating device has non-linearity in a transfer characteristic between the electrical driving signal and the optical signal. The driver includes a PAM signal generator, a level controller, and an output driver. The PAM signal generator receives the input electrical signal and outputs a PAM signal. The level controller adjusts the electrical levels of the PAM signal based on the non-linear transfer characteristic of the light-generating device, where the electrical levels set the optical levels of the optical signal with preset ratios. The output driver generates the driving signal by superposing the electrical levels adjusted by the level controller with the PAM signal provided from the PAM signal generator.

    METHOD FOR FABRICATING ELECTRONIC DEVICE
    75.
    发明申请

    公开(公告)号:US20170256605A1

    公开(公告)日:2017-09-07

    申请号:US15599743

    申请日:2017-05-19

    发明人: Yasunori Nonaka

    摘要: A method for fabricating an electronic device is provided, and the method comprises the steps of: forming a lower electrode on a substrate; forming a dielectric film on the lower electrode; forming an upper electrode on the dielectric film, the upper electrode including gold (Au); forming a refractory metal layer on at least one of upper or lower surface of the upper electrode, the refractory metal layer having a melting temperature higher than a melting temperature of the upper electrode; forming an insulating film to cover the lower electrode, the dielectric film, the upper electrode, and the refractory metal layer; and dry-etching the insulating film to form an opening therein, the upper electrode or the refractory metal layer being exposed at the opening.

    Method for controlling tunable wavelength laser

    公开(公告)号:US09742149B2

    公开(公告)日:2017-08-22

    申请号:US14473748

    申请日:2014-08-29

    摘要: In the method for controlling a tunable wavelength laser, information designating an oscillation wavelength is inputted. A driving condition for causing laser oscillation at a first wavelength is acquired from a memory. A control value of wavelength characteristics of the etalon and a difference between the first wavelength and a second wavelength are referred to, and a control value of wavelength characteristics of the etalon for causing laser oscillation at the second wavelength is calculated. The control value of wavelength characteristics of the etalon are assigned to the tunable wavelength laser, and a wavelength is controlled so that a wavelength sensing result becomes a first target value. Information indicating a wavelength shift amount from the designated oscillation wavelength is inputted. The wavelength sensing result is calculated as a second target value. The wavelength is controlled so that the wavelength sensing result becomes the second target value.

    Package for electronic device
    80.
    发明授权
    Package for electronic device 有权
    电子设备包装

    公开(公告)号:US09578770B2

    公开(公告)日:2017-02-21

    申请号:US14670973

    申请日:2015-03-27

    发明人: Akitada Kodama

    摘要: A package for an electronic device is disclosed. The package includes a metal base, an insulating casing mounted on the metal base and having a seating metal on the top thereof, and a lid tightly enclosing a space surrounded by the base and the casing. The lid provides a sealing metal facing the sealing metal on the top of the casing with putting a brazing metal therebetween. The sealing metal of the lid has an area wider than an area of the sealing metal of the casing.

    摘要翻译: 公开了一种用于电子设备的包装。 该包装包括金属基座,安装在金属基座上的绝缘壳体,其顶部具有座位金属,以及紧密包围由基座和外壳包围的空间的盖子。 盖子通过在其之间放置钎焊金属而在壳体顶部提供面向密封金属的密封金属。 盖的密封金属的面积比壳体的密封金属的面积宽。