公开(公告)号：US20100059786A1

公开(公告)日：2010-03-11

申请号：US12616773

申请日：2009-11-11

申请人： Charles W.C. Lin ,  Chia-Chung Wang

发明人： Charles W.C. Lin ,  Chia-Chung Wang

IPC分类号： H01L33/00

CPC分类号： H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，衬底和粘合剂。 半导体器件电连接到衬底并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部向上延伸到粘合剂中的开口和基底中的孔，并且基部从柱横向延伸。 粘合剂在柱和基底之间以及基底和基底之间延伸。 组件提供垫和终端之间的信号路由。

公开(公告)号：US20100052005A1

公开(公告)日：2010-03-04

申请号：US12616775

申请日：2009-11-11

申请人： Charles W.C. Lin ,  Chia-Chung Wang

发明人： Charles W.C. Lin ,  Chia-Chung Wang

IPC分类号： H01L23/34

CPC分类号： H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部向上延伸到粘合剂中的开口中，并且基部从柱横向延伸。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US06590282B1

公开(公告)日：2003-07-08

申请号：US10038232

申请日：2002-04-12

申请人： Hsing-Seng Wang ,  Rong-Shen Lee ,  Chia-Chung Wang

发明人： Hsing-Seng Wang ,  Rong-Shen Lee ,  Chia-Chung Wang

IPC分类号： H01L2302

CPC分类号： H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/01078

摘要： A stacked semiconductor package formed on a substrate arranged in a serpentine configuration and a method for such fabrication are disclosed. The package is formed by at least one substrate section formed on the substrate bonded to at least one IC die by a flip-chip bonding method. The substrate is then folded onto itself such that the backside of a first IC die is adhesively bonded to the backside of a second IC die. A heat sink may optionally be utilized in-between the IC dies during the adhesive bonding process to further enhance thermal dissipation. The substrate section may be bonded to a printed circuit board by a plurality of solder balls formed on an active surface of the substrate section. The present invention can be bonded to a printed circuit board either in a horizontal position or in a vertical position for saving more real-estate on the board.

摘要翻译： 公开了一种形成在以蛇形结构布置的基板上的堆叠半导体封装以及用于这种制造的方法。 封装由通过倒装芯片接合方法形成在基板上的至少一个基板部分形成，该基板部分与至少一个IC管芯接合。 然后将衬底折叠到自身上，使得第一IC芯片的背面粘合到第二IC芯片的背面。 在粘合剂粘合过程期间，散热器可以可选地用于IC管芯之间，以进一步增强散热。 基板部分可以通过形成在基板部分的有效表面上的多个焊球接合到印刷电路板。 本发明可以在水平位置或垂直位置上结合到印刷电路板，以便在板上节省更多的不动产。

公开(公告)号：US06444561B1

公开(公告)日：2002-09-03

申请号：US09677491

申请日：2000-10-02

申请人： Chia-Chung Wang ,  Chung-Tao Chang ,  Kuo-Chuan Chen

发明人： Chia-Chung Wang ,  Chung-Tao Chang ,  Kuo-Chuan Chen

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/10674 ,  H01L2224/29099 ,  H01L2224/05599

摘要： A method for forming solder bumps for a flip-chip bonding process wherein the bumps have substantially the same height and structures formed by the method are described. In the method, a pre-processed semiconductor substrate that has a plurality of metal traces formed on a top surface is first provided. At least two solder non-wettable masking strips are then deposited on top of and perpendicular to the plurality of metal traces. The at least two solder non-wettable masking strips are deposited spaced-apart at a predetermined spacing sufficient for forming a bond pad therein-between on the plurality of metal traces. Finally, a solder material is deposited onto the bond pads forming solder bumps which are then reflown into solder balls.

摘要翻译： 描述了用于形成倒装芯片接合工艺的焊料凸块的方法，其中凸块具有基本相同的高度和通过该方法形成的结构。 在该方法中，首先设置具有形成在顶面上的多个金属迹线的预处理半导体基板。 然后将至少两个焊接不可润湿的掩模条沉积在多个金属迹线的顶部并垂直于多个金属迹线。 所述至少两个焊料不可润湿掩模条以足以在其间形成接合焊盘的预定间隔隔开间隔地放置在多个金属迹线之间。 最后，将焊料材料沉积到形成焊料凸块的接合焊盘上，然后将其重新焊接到焊球中。

公开(公告)号：US08614502B2

公开(公告)日：2013-12-24

申请号：US13456293

申请日：2012-04-26

申请人： Charles W.C. Lin ,  Chia-Chung Wang

发明人： Charles W.C. Lin ,  Chia-Chung Wang

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/12

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor assembly board includes a supporting board, a coreless build-up circuitry and a built-in electronic device. The supporting board includes a bump, a flange and a via hole in the bump. The built-in electronic device extends into the via hole and is electrically connected to the build-up circuitry. The build-up circuitry extends from the flange and the built-in electronic device and provides signal routing for the built-in electronic device. The supporting board provides mechanical support, ground/power plane and heat sink for the coreless build-up circuitry.

摘要翻译： 半导体组装板包括支撑板，无芯堆积电路和内置电子设备。 支撑板包括凸块，凸缘和凸块中的通孔。 内置的电子设备延伸到通孔中并电连接到积聚电路。 积聚电路从凸缘和内置电子设备延伸，并为内置电子设备提供信号路由。 支持板为无芯层积木电路提供机械支撑，接地/电源平面和散热器。

公开(公告)号：US20130032938A1

公开(公告)日：2013-02-07

申请号：US13456293

申请日：2012-04-26

申请人： Charles W.C. LIN ,  Chia-Chung Wang

发明人： Charles W.C. LIN ,  Chia-Chung Wang

IPC分类号： H01L23/498

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor assembly board includes a supporting board, a coreless build-up circuitry and a built-in electronic device. The supporting board includes a bump, a flange and a via hole in the bump. The built-in electronic device extends into the via hole and is electrically connected to the build-up circuitry. The build-up circuitry extends from the flange and the built-in electronic device and provides signal routing for the built-in electronic device. The supporting board provides mechanical support, ground/power plane and heat sink for the coreless build-up circuitry.

摘要翻译： 半导体组装板包括支撑板，无芯堆积电路和内置电子设备。 支撑板包括凸块，凸缘和凸块中的通孔。 内置的电子设备延伸到通孔中并电连接到积聚电路。 积聚电路从凸缘和内置电子设备延伸，并为内置电子设备提供信号路由。 支撑板为无芯堆积电路提供机械支撑，接地/电源平面和散热器。

公开(公告)号：US20120129300A1

公开(公告)日：2012-05-24

申请号：US13299495

申请日：2011-11-18

申请人： Charles W.C. LIN ,  Chia-Chung Wang

发明人： Charles W.C. LIN ,  Chia-Chung Wang

IPC分类号： H01L21/58

CPC分类号： H01L24/82 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a stackable semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device.

摘要翻译： 公开了一种制造包括半导体器件，散热器，粘合剂，端子，电镀通孔和积聚电路的可堆叠半导体组件的方法。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路为半导体器件提供信号路由。 电镀通孔在积聚电路和终端之间提供信号路由。 散热器为半导体器件提供散热。

公开(公告)号：US20110275180A1

公开(公告)日：2011-11-10

申请号：US13113051

申请日：2011-05-22

申请人： Charles W.C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

发明人： Charles W.C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

IPC分类号： H01L21/60

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the underlayer and a thermal via that extends from the base through the support layer to the underlayer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 一种制造半导体芯片组件的方法包括提供柱，基底，支撑层和底层，其中柱延伸到基底之上，并且支撑层夹在基底和底层之间，将粘合剂安装在基底上，包括 将所述柱插入所述粘合剂的开口中，将导电层安装在所述粘合剂上，包括使所述柱与所述导电层中的孔对准，然后使所述粘合剂在所述柱和所述导电层之间向上流动，使所述粘合剂固化， 轨迹，其包括衬垫，端子和导电层的选定部分，提供包括柱，基底，底层的散热器和从基底穿过支撑层延伸到底层的热通孔，然后安装 在该柱上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到第二半导体器件 e散热器。

公开(公告)号：US20110183472A1

公开(公告)日：2011-07-28

申请号：US13079044

申请日：2011-04-04

申请人： Charles W.C. Lin ,  Chia-Chung Wang

发明人： Charles W.C. Lin ,  Chia-Chung Wang

IPC分类号： H01L21/58

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a plated through-hole and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 一种制造半导体芯片组件的方法包括提供柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上，包括使导柱与导电 然后使粘合剂在柱和导电层之间向上流动，固化粘合剂，然后提供包括衬垫，端子，电镀通孔和导电层的选定部分的导电迹线，安装半导体器件 在支柱上，其中散热器包括柱和基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20110101410A1

公开(公告)日：2011-05-05

申请号：US12987166

申请日：2011-01-10

申请人： Charles W.C. Lin ,  Chia-Chung Wang

发明人： Charles W.C. Lin ,  Chia-Chung Wang

IPC分类号： H01L33/64

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 散热器包括第一柱，第二柱和基部。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 第一柱从第一垂直方向的基部延伸到第一粘合剂中的第一开口中，第二柱从第二垂直方向的基部延伸到第二粘合剂中的第二开口中，并且基部夹在两侧之间并且横向延伸 从帖子。 导电迹线提供焊盘和端子之间的信号路由。