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公开(公告)号：US20170203962A1
公开(公告)日：2017-07-20
申请号：US15182754
申请日：2016-06-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Shyh-Wei Cheng , Hsi-Cheng Hsu , Hsin-Yu Chen , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu , Yu-Jui Wu , Ching-Hsiang Hu , Ming-Tsung Chen
CPC classification number: B81C1/00285 , B81B7/0038 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81C2203/0118 , B81C2203/0792
Abstract: The present disclosure relates to a MEMS package having an outgassing element configured to adjust a pressure within a hermetically sealed cavity by inducing outgassing of into the cavity, and an associated method. In some embodiments, the method is performed by forming an outgassing element within a passivation layer over a CMOS substrate and forming an outgassing resistive layer to cover the outgassing element. The outgassing resistive layer is removed from over the outgassing element, and the MEMS substrate is bonded to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity. After removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity.
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公开(公告)号：US20170203957A1
公开(公告)日：2017-07-20
申请号：US15401808
申请日：2017-01-09
Applicant: Robert Bosch GmbH
Inventor： Achim Breitling , Frank Reichenbach , Jochen Reinmuth , Julia Amthor
CPC classification number: B81B7/0041 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/056 , B81B2207/09 , B81C1/00293 , B81C2203/0109 , B81C2203/0118 , B81C2203/0145 , B81C2203/019 , B81C2203/035
Abstract: A method for manufacturing a micromechanical component is provided including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the cap together with the substrate enclosing a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity. A recess situated essentially between the first cavity and the second cavity is formed for diverting at least one first particle type of the first gas mixture and/or at least one second particle type of the second gas mixture.
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公开(公告)号：US09708176B2
公开(公告)日：2017-07-18
申请号：US14723927
申请日：2015-05-28
Applicant: InvenSense, Inc.
Inventor： Matthew Thompson , Joseph Seeger
IPC: B81B3/00
CPC classification number: B81B3/0086 , B81B7/02 , B81B2201/014 , B81B2201/0214 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/0292 , B81B2201/036 , B81B2203/0118 , B81B2203/0307 , B81B2203/04 , B81B2207/012 , B81C2203/0792 , H01H1/0036
Abstract: A system and/or method for utilizing MEMS switching technology to operate MEMS sensors. As a non-limiting example, a MEMS switch may be utilized to control DC and/or AC bias applied to MEMS sensor structures. Also for example, one or more MEMS switches may be utilized to provide drive signals to MEMS sensors (e.g., to provide a drive signal to a MEMS gyroscope).
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公开(公告)号：US20170183220A1
公开(公告)日：2017-06-29
申请号：US15379017
申请日：2016-12-14
Applicant: Robert Bosch GmbH
Inventor： Nicole Schittenhelm , Carsten Geckeler , Sebastian Guenther
CPC classification number: B81B7/0038 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C1/00285 , B81C2203/0163
Abstract: A getter device for a micromechanical component, having a metallic getter structure that is situated in a cavity of the micromechanical component. The getter structure is heatable using a defined electric current. It is possible to evaporate the material of the getter structure in a defined manner.
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公开(公告)号：US20170166439A1
公开(公告)日：2017-06-15
申请号：US14963998
申请日：2015-12-09
Applicant: Analog Devices, Inc.
Inventor： Bradley C. Kaanta
CPC classification number: B81B7/0006 , B81B2201/0235 , B81B2201/0242 , B81B2203/0118 , B81B2207/015 , B81B2207/07 , B81C1/0015 , B81C1/00682 , B81C1/00698 , B81C2201/0161 , B81C2201/0176
Abstract: Various embodiments produce a semiconductor device, such a MEMS device, having metallized structures formed by replacing a semiconductor structure with a metal structure. Some embodiments expose a semiconductor structure to one or more a reacting gasses, such as gasses including tungsten or molybdenum.
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Patent Agency Ranking
公开(公告)号：US09670055B2
公开(公告)日：2017-06-06
申请号：US14530437
申请日：2014-10-31
Applicant: Robert Bosch GmbH
Inventor： Jochen Reinmuth , Julian Gonska
IPC: B81B3/00 , B81C1/00 , G01P15/00 , G01R33/028 , G01P15/08
CPC classification number: B81B3/00 , B81B2201/0235 , B81B2201/0242 , B81C1/00 , B81C1/00293 , B81C2203/0145 , G01P15/00 , G01P15/0802 , G01R33/0286
Abstract: A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, in the first method step the substrate and the sealing cap being configured and joined in such a way that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are manufactured, in a second method step a sealable channel leading into the first cavity being created, in a third method step the first pressure in the first cavity being established via the sealable channel.
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公开(公告)号：US20170152887A1
公开(公告)日：2017-06-01
申请号：US15379512
申请日：2016-12-15
Applicant: Raviv Erlich , Yuval Gerson
Inventor： Raviv Erlich , Yuval Gerson
IPC: F16C11/12 , B81C1/00 , B81B3/00 , G02B26/10 , G01P15/125 , G01P15/09 , G01C19/02 , G02B26/08 , F16F1/48 , G01P15/093
CPC classification number: F16C11/12 , B81B3/0043 , B81B2201/0235 , B81B2201/034 , B81B2201/042 , B81B2203/0118 , B81B2203/0163 , B81C1/0015 , B81C1/00198 , B81C1/00523 , B81C2201/013 , E05D1/02 , E05D7/00 , E05D11/0081 , F16F1/48 , F16F2224/025 , F16F2226/00 , F16F2226/042 , G01C19/02 , G01P15/09 , G01P15/093 , G01P15/125 , G02B26/0833 , G02B26/105 , Y10T16/522 , Y10T16/525 , Y10T29/24 , Y10T29/25
Abstract: A mechanical device includes a long, narrow element made of a rigid, elastic material. A rigid frame is configured to anchor at least one end of the element, which is attached to the frame, and to define a gap running longitudinally along the element between the beam and the frame, so that the element is free to move within the gap. A solid filler material, different from the rigid, elastic material, fills at least a part of the gap between the element and the frame so as to permit a first mode of movement of the element within the gap while inhibiting a different, second mode of movement.
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公开(公告)号：US09663357B2
公开(公告)日：2017-05-30
申请号：US14963362
申请日：2015-12-09
Applicant: Texas Instruments Incorporated
Inventor： Jie Mao , Hau Nguyen , Luu Nguyen , Anindya Poddar
IPC: H01L21/683 , B81C1/00 , B81B7/00
CPC classification number: B81C1/00873 , B81B7/007 , B81B2201/0214 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2201/047 , B81B2207/07 , B81B2207/098 , B81C1/00333 , B81C2201/0125 , B81C2201/0132 , B81C2201/0159 , B81C2201/0181 , B81C2201/0188 , B81C2203/0136 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/3121 , H01L24/19 , H01L2221/68359 , H01L2224/04105 , H01L2224/96 , H01L2924/3511
Abstract: A method for fabricating packaged semiconductor devices (100) with an open cavity (110a) in panel format; placing (process 201) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad (230) and symmetrically placed vertical pillars (231); attaching (process 202) semiconductor chips (101) with sensor systems face-down onto the tape; laminating (process 203) and thinning (process 204) low CTE insulating material (234) to fill gaps between chips and grid; turning over (process 205) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process 206) uniform metal layer across assembly and optionally plating (process 209) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process 212) insulating stiffener across panel; opening (process 213) cavities in stiffener to access the sensor system; and singulating (process 214) packaged devices by cutting metallic pieces.
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公开(公告)号：US09663353B2
公开(公告)日：2017-05-30
申请号：US14403571
申请日：2013-06-28
Applicant: Intel IP Corporation
Inventor： Gerald Ofner , Thorsten Meyer , Reinhard Mahnkopf , Christian Geissler , Andreas Augustin
CPC classification number: B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
Abstract: In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.
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公开(公告)号：US20170113923A1
公开(公告)日：2017-04-27
申请号：US15297794
申请日：2016-10-19
Applicant: Robert Bosch GmbH
Inventor： Frank Reichenbach , Jochen Reinmuth , Philip Kappe , Mawuli Ametowobla
CPC classification number: B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81C1/00269 , B81C1/00333 , B81C2203/0145 , B81C2203/036 , C03B23/20 , C03C23/0025
Abstract: A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity: in a first method step, an access opening, connecting the first cavity to surroundings of the micromechanical component, being formed in the substrate or in the cap; in a second method step, the first pressure and/or the first chemical composition being adjusted in the first cavity; in a third method step, the access opening being sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser; in a fourth method step, a recess being formed, and/or an elevation being formed, and/or a reflection area being formed, and/or an absorption area being formed.
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