公开(公告)号：US20080185705A1

公开(公告)日：2008-08-07

申请号：US11895191

申请日：2007-08-23

申请人： Philip R. Osborn ,  Belgacem Haba ,  Ellis Chau ,  Giles Humpston ,  Masud Beroz ,  Teck-Gyu Kang ,  Dat Nghe Duong ,  Jae M. Park ,  Jesse Burl Thompson ,  Richard Dewitt Crisp

发明人： Philip R. Osborn ,  Belgacem Haba ,  Ellis Chau ,  Giles Humpston ,  Masud Beroz ,  Teck-Gyu Kang ,  Dat Nghe Duong ,  Jae M. Park ,  Jesse Burl Thompson ,  Richard Dewitt Crisp

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83194 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.

摘要翻译： 微电子封装包括具有包括触点的第一面的微电子元件和具有第一表面和第二表面的柔性基板，从第一表面突出的导电柱和在第二表面可接触的导电端子，至少一些导电端子 并且所述导电柱电互连，并且所述导电端子中的至少一些偏离所述导电柱。 柔性基板的第一表面与微电子元件的第一面并置，使得导电柱从柔性基板朝向微电子元件的第一面突出。 导电柱与微电子元件的触点电互连，并且至少一些导电端子可相对于微电子元件移动。

公开(公告)号：US20080042250A1

公开(公告)日：2008-02-21

申请号：US11506472

申请日：2006-08-18

申请人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

发明人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

IPC分类号： H01L23/02

CPC分类号： H01L23/66 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/09701 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00

摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.

摘要翻译： 堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。 第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。 组件还具有覆盖在基底基板上的第二微电子子组件。 第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。 第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。

公开(公告)号：US07298030B2

公开(公告)日：2007-11-20

申请号：US10948976

申请日：2004-09-24

申请人： Bruce M. McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David B. Tuckerman

发明人： Bruce M. McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David B. Tuckerman

IPC分类号： H01L23/02

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

摘要翻译： 提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面 面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。 提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。 密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

公开(公告)号：US20070147816A1

公开(公告)日：2007-06-28

申请号：US11318874

申请日：2005-12-27

申请人： Giles Humpston ,  Kenneth Honer

发明人： Giles Humpston ,  Kenneth Honer

IPC分类号： G03B17/00

CPC分类号： G03B17/00 ,  G02B3/14 ,  G02B26/005 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00

摘要： An electronic camera module includes a lens or refractive element formed by a pair of immiscible liquids and having optical properties which can be varied by applying a voltage so as to deform the meniscus. One of the two liquids extends from the meniscus all the way to the front surface of the sensor, so that light passing through the meniscus does not encounter further changes in refractive index enroute to the sensor.

摘要翻译： 电子照相机模块包括由一对不混溶液体形成的具有光学特性的透镜或折射元件，该特性可以通过施加电压以使弯液面变形来改变。 两个液体中的一个液体从弯液面一直延伸到传感器的前表面，使得穿过弯月面的光不会遇到传感器的折射率的进一步变化。

公开(公告)号：US20060183270A1

公开(公告)日：2006-08-17

申请号：US11351591

申请日：2006-02-10

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： H01L21/50 ,  H01L21/48

CPC分类号： H01L24/13 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/132 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/01105 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/16235 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of making a microelectronic assembly includes providing a microelectronic element having a front face and contact pads accessible at the front face, providing a dispensing tool containing a molten metal and having a discharge port for dispensing the molten metal, and aligning the discharge port of the dispensing tool with one of the contact pads of the microelectronic element. A mass of the molten metal is dispensed through the discharge port and onto the one of the contact pads of the microelectronic element; and ultrasonic waves are applied to the mass of molten metal during the dispensing step for facilitating wetting of the mass of molten metal with the one of the contact pads of the microelectronic element.

摘要翻译： 制造微电子组件的方法包括提供具有正面的微电子元件和在前表面可接触的接触片，提供容纳熔融金属的分配工具，并具有用于分配熔融金属的排出口， 所述分配工具具有微电子元件的接触焊盘之一。 熔融金属的质量通过排出口分配到微电子元件的接触焊盘之一上; 并且在分配步骤期间将超声波施加到熔融金属块，以便于微电子元件的接触焊盘之一润湿熔融金属块。

公开(公告)号：US20060138647A1

公开(公告)日：2006-06-29

申请号：US11021627

申请日：2004-12-23

申请人： Richard Crisp ,  Belgacem Haba ,  Giles Humpston

发明人： Richard Crisp ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/34 ,  H01L23/48

CPC分类号： H01L24/73 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to the second microelectronic element via the conductive posts. The first microelectronic element preferably has an interposer element from which the conductive posts extend. The second microelectronic element is interconnected to the interposer element via contacts on the second microelectronic element via the conductive posts. The so interconnected microelectronic elements have coordinated functionality, such as a programmable logic device wherein one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device. The packaged microelectronic device is formed by using a transfer substrate to transfer solder masses onto at least some of the conductive posts extending from the first major surface of the first microelectronic element or contacts on the second microelectronic element. The solder masses are then used to electrically interconnect the conductive posts with the contacts disposed on the surface of the second microelectronic element.

摘要翻译： 具有第一和第二电互连微电子元件的封装微电子器件及其制造方法。 导电柱从第一微电子元件的一个主表面延伸。 第一微电子元件经由导电柱与第二微电子元件电互连。 第一微电子元件优选地具有导电柱延伸的插入元件。 第二微电子元件经由导电柱经由第二微电子元件上的触点而互连到插入元件。 如此互连的微电子元件具有协调的功能，例如可编程逻辑器件，其中一个微电子元件是现场可编程门阵列，而另一微电子元件是存储器件。 封装的微电子器件通过使用转移衬底来形成，以将焊料块转移到从第一微电子元件的第一主表面或第二微电子元件上的触点延伸的至少一些导电柱上。 焊料块然后用于将导电柱与布置在第二微电子元件的表面上的触点电互连。

公开(公告)号：US20050116344A1

公开(公告)日：2005-06-02

申请号：US10977515

申请日：2004-10-29

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： B81B7/00 ,  H01L23/48

CPC分类号： B81B7/007 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/92144 ,  H01L2924/00014

摘要： An article is provided which includes a structure overlying a face of an element. The structure includes a first metal layer and a wettable metal layer overlying the first metal layer. A conductive trace overlies and contacts at least one of the first metal layer and the wettable metal layer, the trace having a composition different from at least one of the first metal layer and the wettable metal layer.

摘要翻译： 提供了一种包括覆盖元件的面的结构的物品。 该结构包括覆盖在第一金属层上的第一金属层和可湿性金属层。 导电迹线覆盖并接触第一金属层和可湿性金属层中的至少一个，迹线具有不同于第一金属层和可湿性金属层中的至少一个的组成。

公开(公告)号：US5106009A

公开(公告)日：1992-04-21

申请号：US578542

申请日：1990-09-04

申请人： Giles Humpston ,  David M. Jacobson

发明人： Giles Humpston ,  David M. Jacobson

IPC分类号： B23K35/00 ,  B23K35/14 ,  B23K35/26 ,  B23K35/30 ,  H01L21/60 ,  H01L23/492

CPC分类号： H01L24/83 ,  B23K35/3006 ,  H01L23/4924 ,  H01L24/28 ,  B23K2035/008 ,  B23K35/005 ,  B23K35/007 ,  B23K35/26 ,  B23K35/262 ,  H01L2224/04026 ,  H01L2224/2908 ,  H01L2224/29111 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253

摘要： A method of joining components by soldering comprising forming discrete layers of silver (13, 17) and another metal (19), e.g. a tin or indium based material, the two layers having volumes in a ratio different from that in the eutectic alloy formed by silver and that metal, and raising the temperature of the layers above the melting point of the eutectic alloy for a period sufficient to cause initially formation of the eutectic alloy and then, by reaction between the eutectic alloy and one or other of silver and the other metal, formation of a material having a melting point higher than the eutectic alloy melting point. The method allows soldering, e.g. of a silicon wafer (1) to a header (3), at a relatively low temperature below that which the joint will withstand after formation.

公开(公告)号：US08735287B2

公开(公告)日：2014-05-27

申请号：US13488930

申请日：2012-06-05

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L21/441

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit can include a semiconductor element having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts at the front surface and a rear surface remote from the front surface. The semiconductor element can have through holes extending from the rear surface through the semiconductor element and through the contacts. A dielectric layer can line the through holes. A conductive layer may overlie the dielectric layer within the through holes. The conductive layer can conductively interconnect the contacts with unit contacts.

摘要翻译： 微电子单元可以包括具有前表面的半导体元件，与前表面相邻的微电子半导体器件，在前表面处的接触和远离前表面的后表面。 半导体元件可以具有从后表面穿过半导体元件并通过触点延伸的通孔。 电介质层可以对通孔进行排列。 导电层可覆盖通孔内的电介质层。 导电层可以将触点与单元触点导电互连。

公开(公告)号：US08604605B2

公开(公告)日：2013-12-10

申请号：US11650356

申请日：2007-01-05

申请人： Michael J. Nystrom ,  Giles Humpston

发明人： Michael J. Nystrom ,  Giles Humpston

IPC分类号： H01L23/12

CPC分类号： H01B13/00 ,  H01L23/10 ,  H01L2224/48091 ,  H01L2224/48463 ,  Y10T29/49126 ,  Y10T156/1062 ,  Y10T156/1092 ,  H01L2924/00014

摘要： A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

摘要翻译： 形成微电子组件的方法包括将支撑结构定位在与器件的有源区相邻但不延伸到有源区上。 支撑结构具有平面部分。 每个平面部分具有基本均匀的组成。 至少一个平面部分的组成不同于其它平面部分中的至少一个的组成。 盖子定位成与支撑结构接触并在有源区域上延伸。 支撑结构结合到装置和盖子上。