公开(公告)号：US08847380B2

公开(公告)日：2014-09-30

申请号：US12884649

申请日：2010-09-17

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： A01C1/04 ,  A01C1/00 ,  H01L21/50 ,  H01L21/283 ,  H01L25/065 ,  H01L23/00 ,  H01L23/48 ,  H01L25/00 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L23/50 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface, forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces, and forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad.

摘要翻译： 制造半导体组件的方法可以包括提供具有前表面，后表面和多个导电焊盘的半导体元件，形成至少一个至少通过相应的一个导电焊盘延伸的孔， 形成从所述后表面至少部分地延伸半导体元件的厚度的开口，使得所述至少一个孔和所述开口在前表面和后表面之间的位置相遇，以及 形成在所述后表面处暴露的至少一个导电元件以电连接到外部装置，所述至少一个导电元件在所述至少一个孔内延伸并且至少进入所述开口中，所述导电元件与相应的导电垫电连接 。

公开(公告)号：US08841763B2

公开(公告)日：2014-09-23

申请号：US13097943

申请日：2011-04-29

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L23/12 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L25/50 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2225/06524 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/00

摘要： A microelectronic assembly can include first, second and third stacked substantially planar elements, e.g., of dielectric or semiconductor material, and which may have a CTE of less than 10 ppm/° C. The assembly may be a microelectronic package and may incorporate active semiconductor devices in one, two or more of the first, second or third elements to function cooperatively as a system-in-a-package. In one example, an electrically conductive element having at least a portion having a thickness less than 10 microns, may be formed by plating, and may electrically connect two or more of the first, second or third elements. The conductive element may entirely underlie a surface of another one of the substantially planar elements.

摘要翻译： 微电子组件可以包括例如电介质或半导体材料的第一，第二和第三堆叠的基本平坦的元件，并且其可以具有小于10ppm /℃的CTE。组件可以是微电子封装，并且可以并入有源半导体 在第一，第二或第三元件中的一个，两个或更多个元件中的装置可以协同地作为系统级封装。 在一个示例中，具有厚度小于10微米的至少一部分的导电元件可以通过电镀形成，并且可以电连接第一，第二或第三元件中的两个或更多个。 导电元件可以完全位于另一个基本上平面的元件的表面之下。

公开(公告)号：US08587126B2

公开(公告)日：2013-11-19

申请号：US13051414

申请日：2011-03-18

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/00 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

摘要翻译： 提供了一种微电子组件，其中分别暴露在第一和第二微电子元件的前表面处的第一和第二导电焊盘并置，每个微电子元件体现有源半导体器件。 导电元件可以在从第一微电子元件的后表面延伸到其前表面的第一开口内延伸，在从第一开口朝向第一微电子元件的前表面延伸的第二开口内，并且在第三开口 延伸穿过第一和第二垫中的至少一个以接触第一和第二垫。 第一和第二开口的内表面可分别相对于第一微电子元件的前表面在第一和第二方向上延伸，以限定大致的角度。

公开(公告)号：US20130014978A1

公开(公告)日：2013-01-17

申请号：US13183870

申请日：2011-07-15

申请人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H05K1/09 ,  B05D1/36 ,  B05D5/12

CPC分类号： H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

摘要： Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

摘要翻译： 用于电气应用的阻隔层。 在一些实施例中，阻挡层是层压阻挡层。 在一些实施例中，阻挡层包括梯度阻挡层。

公开(公告)号：US20120319282A1

公开(公告)日：2012-12-20

申请号：US13164448

申请日：2011-06-20

申请人： Cyprian Uzoh ,  Belgacem Haba ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Belgacem Haba ,  Craig Mitchell

IPC分类号： H01L23/522 ,  H01L21/768

CPC分类号： H01L23/528 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/76802 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76831 ,  H01L21/76834 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76852 ,  H01L21/76868 ,  H01L21/76873 ,  H01L21/76879 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/53209 ,  H01L23/53238 ,  H01L24/13 ,  H01L24/14 ,  H01L2221/1094 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/14181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552

摘要： Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a top surface and portions of the side walls of the interconnect structure covered in a dissimilar material. In some embodiments, the dissimilar material can be a conductive material or a nano-alloy. The interconnect structure can be formed by removing a portion of the interconnect structure, and covering the interconnect structure with the dissimilar material. The interconnect structure can comprise a damascene structure, such as a single or dual damascene structure, or alternatively, can comprise a silicon-through via (TSV) structure.

摘要翻译： 提供了用于形成半导体器件的方法和装置，其可以包括任何数量的特征。 一个特征是形成互连结构的方法，其导致互连结构具有覆盖在不同材料中的互连结构的顶表面和侧壁的部分。 在一些实施例中，异种材料可以是导电材料或纳米合金。 互连结构可以通过去除互连结构的一部分并且用不同材料覆盖互连结构来形成。 互连结构可以包括镶嵌结构，例如单镶嵌结构或双镶嵌结构，或者可以包括硅通孔（TSV）结构。

公开(公告)号：US20120199924A1

公开(公告)日：2012-08-09

申请号：US13020328

申请日：2011-02-03

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/1464 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L2224/13

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a semiconductor region adjacent a rear face. The semiconductor region has a first region of material overlying the first light sensing element and a second region of material overlying the second light sensing element such that the first and second wavelengths are able to pass through the first and second regions, respectively, and reach the first and second light sensing elements with substantially the same intensity.

摘要翻译： 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和布置成通过邻近后表面的半导体区域接收不同波长的光的光感测元件。 半导体区域具有覆盖第一光感测元件的第一材料区域和覆盖第二光感测元件的第二材料区域，使得第一和第二波长能够分别穿过第一和第二区域并达到 具有基本上相同强度的第一和第二光感测元件。

公开(公告)号：US20120153426A1

公开(公告)日：2012-06-21

申请号：US12970529

申请日：2010-12-16

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L29/06 ,  H01L21/762

CPC分类号： H01L23/562 ,  B81C1/00269 ,  B81C1/00357 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83345 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of bonding first and second microelectronic elements includes pressing together a first substrate containing active circuit elements therein with a second substrate, with a flowable dielectric material between confronting surfaces of the respective substrates, each of the first and second substrates having a coefficient of thermal expansion less than 10 parts per million/° C., at least one of the confronting surfaces having a plurality of channels extending from an edge of such surface, such that the dielectric material between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material flows into at least some of the channels.

摘要翻译： 接合第一和第二微电子元件的方法包括将含有有源电路元件的第一衬底与第二衬底压在一起，在相应衬底的相对表面之间具有可流动介电材料，第一和第二衬底中的每一个具有热系数 膨胀小于10ppm /℃，至少一个相对表面具有从该表面的边缘延伸的多个通道，使得由相对表面限定的平面之间的电介质材料至少基本上不含 空隙并且具有超过一微米的厚度，并且至少一些介电材料流入至少一些通道。

公开(公告)号：US20120139124A1

公开(公告)日：2012-06-07

申请号：US13051414

申请日：2011-03-18

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L25/00 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

摘要翻译： 提供了一种微电子组件，其中分别暴露在第一和第二微电子元件的前表面处的第一和第二导电焊盘并置，每个微电子元件体现有源半导体器件。 导电元件可以在从第一微电子元件的后表面延伸到其前表面的第一开口内延伸，在从第一开口朝向第一微电子元件的前表面延伸的第二开口内，并且在第三开口 延伸穿过第一和第二垫中的至少一个以接触第一和第二垫。 第一和第二开口的内表面可分别相对于第一微电子元件的前表面在第一和第二方向上延伸，以限定大致的角度。

公开(公告)号：US20120139082A1

公开(公告)日：2012-06-07

申请号：US13051424

申请日：2011-03-18

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L27/06 ,  H01L21/82 ,  H01L21/283 ,  H01L23/48

CPC分类号： H01L23/481 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

摘要： A microelectronic assembly is provided which includes a first element consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface facing and attached to a major surface of a microelectronic element at which a plurality of conductive pads are exposed, the microelectronic element having active semiconductor devices therein. A first opening extends from an exposed surface of the first element towards the surface attached to the microelectronic element, and a second opening extends from the first opening to a first one of the conductive pads, wherein where the first and second openings meet, interior surfaces of the first and second openings extend at different angles relative to the major surface of the microelectronic element. A conductive element extends within the first and second openings and contacts the at least one conductive pad.

摘要翻译： 提供了一种微电子组件，其包括基本上由半导体或无机电介质材料中的至少一种构成的第一元件，该介电材料具有面向并附着到微电子元件的主表面的表面，在该电子元件的主表面处暴露多个导电焊盘，该微电子元件具有 其中有源半导体器件。 第一开口从第一元件的暴露表面延伸到附接到微电子元件的表面，并且第二开口从第一开口延伸到第一导电焊盘中，其中第一和第二开口相交，其中内表面 第一和第二开口相对于微电子元件的主表面以不同的角度延伸。 导电元件在第一和第二开口内延伸并接触至少一个导电垫。

公开(公告)号：US20120068327A1

公开(公告)日：2012-03-22

申请号：US12884695

申请日：2010-09-17

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/528 ,  H01L23/02 ,  H01L21/768

CPC分类号： H01L23/49827 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/6622 ,  H01L2224/05009 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/0557 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening extending through the semiconductor element. At least one of the conductive pads can at least partially overlie the opening and can be electrically connected with at least one of the active semiconductor devices. The microelectronic unit can also include a first conductive element exposed at the rear surface for connection with an external component, the first conductive element extending through the opening and electrically connected with the at least one conductive pad, and a second conductive element extending through the opening and insulated from the first conductive element. The at least one conductive pad can overlie a peripheral edge of the second conductive element.

摘要翻译： 微电子单元包括基本上由半导体材料组成的半导体元件，其具有前表面，后表面，与前表面相邻的多个有源半导体器件，在前表面暴露的多个导电焊盘，以及延伸穿过 半导体元件。 至少一个导电焊盘可以至少部分地覆盖开口并且可以与至少一个有源半导体器件电连接。 微电子单元还可以包括在后表面暴露以与外部部件连接的第一导电元件，第一导电元件延伸穿过开口并与至少一个导电焊盘电连接，第二导电元件延伸穿过开口 并与第一导电元件绝缘。 至少一个导电焊盘可以覆盖在第二导电元件的周边边缘上。