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    Method of fabricating selectively applied flowable solder joints
    81.
    发明授权
    Method of fabricating selectively applied flowable solder joints 失效
    制造选择性流动的焊接接头的方法

    公开(公告)号：US3849870A

    公开(公告)日：1974-11-26

    申请号：US30649872

    申请日：1972-11-14

    Applicant: AMP INC

    Inventor： COBAUGH R ,  PARMER K

    IPC: B23K1/20 ,  B23K3/06 ,  H01R4/02 ,  H05K3/34

    CPC classification number: B23K1/20 ,  B23K3/0676 ,  B23K2201/36 ,  H01R4/028 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10984 ,  H05K2201/2081 ,  Y10T29/49149

    Abstract: An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shape of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.

    Abstract translation: 公开了一种电气端子结构，其具有粘附到端子的选定部分上的流动沉积量或焊料带，并且被限制在端子的表面上通过存在不可焊接材料而不是必须 触摸终端 还公开了将带状电端子安装在设置在基板中的电镀孔中的方法，其中根据上述应用技术将焊带施加到端子。 还公开了使焊接条平坦化的技术，并且所得到的端接结构具有粘附在其上的扁平焊接带。 焊接带的平坦化有助于通过改变焊接带的形状并通过减少其结构完整性来将带状端子插入电镀孔中，同时产生许多发条断裂。

    Process for soldering electronic components to a printed circuit board
    83.
    发明授权
    Process for soldering electronic components to a printed circuit board 失效
    将电子部件焊接到印刷电路板的工艺

    公开(公告)号：US6145733A

    公开(公告)日：2000-11-14

    申请号：US180130

    申请日：1998-11-06

    Applicant: Herbert Streckfuss ,  Volker Liedke

    Inventor： Herbert Streckfuss ,  Volker Liedke

    IPC: B23K1/08 ,  H05K3/34 ,  B23K31/02

    CPC classification number: B23K1/085 ,  H05K3/3468 ,  B23K2201/36 ,  H05K2203/0557 ,  H05K2203/304 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/3452

    Abstract: The invention concerns a method for soldering of additional electronic components onto a circuit board having components which have already been soldered and mounted thereto, wherein the additional components are plugged through the circuit board and soldered thereto. In order to be able to subsequently solder the components in a simple and reliable fashion, a template, having a pattern of holes corresponding to the soldering points and locations which are to be subsequently formed on the circuit board, is lowered and pressed onto the surface of a solder bath in such a fashion that the solder displaces into the holes and rises up within same. The circuit board having the previously mounted additional components is placed onto the template in such a fashion that the regions which are to be soldered are disposed within the openings of the template and dipped into the solder located therein. After this soldering process, the circuit board and the template are lifted from the surface of the soldering bath and this surface can be subsequently cleaned.

    Abstract translation: PCT No.PCT / EP97 / 02199 Sec。 371日期：1998年11月6日 102（e）日期1998年11月6日PCT 1997年4月29日PCT PCT。 出版物WO97 / 41991 日期1997年11月13日本发明涉及一种用于将附加电子部件焊接到具有已经被焊接和安装到其上的部件的电路板上的方法，其中附加部件通过电路板插入并焊接到其上。 为了能够以简单且可靠的方式随后焊接部件，具有对应于焊接点的孔的图案的模板和随后在电路板上形成的位置的模板被降低并压到表面上 焊料槽以这样一种方式使焊料置于孔中并在同样的内部升高。 将具有先前安装的附加部件的电路板以这样的方式放置在模板上，即要被焊接的区域设置在模板的开口内并浸入位于其中的焊料中。 在该焊接工艺之后，将电路板和模板从焊接槽的表面提起，并且该表面可以随后被清洁。

    Method and machine for wave soldering or tinning
    84.
    发明授权
    Method and machine for wave soldering or tinning 失效
    用于波峰焊或镀锡的方法和机器

    公开(公告)号：US6082606A

    公开(公告)日：2000-07-04

    申请号：US968448

    申请日：1997-11-12

    Applicant: Marc Leturmy

    Inventor： Marc Leturmy

    IPC: B23K3/06 ,  B23K1/08 ,  B23K31/02 ,  C23C2/08 ,  H05K3/34

    CPC classification number: B23K1/085 ,  B23K2201/36 ,  B23K2201/42

    Abstract: The invention relates to a machine for wave soldering or tinning comprisinga solder reservoir (9);means that can form at least one solder wave with a so-called laminar form (8b);a conveyor system (2) that can bring a piece (1) to be soldered or tinned into contact with said laminar wave; andmeans for injecting (12) a gas in the vicinity of the wave;characterized in that the said injection means includes an injector located in a position adjacent to and downstream from the wave and provided with a wall (17) facing the solder wave, wherein the wall of the injector has at least a first group (15) of openings positioned so as to provide a first gas jet directed toward the flat surface of the solder wave.

    Abstract translation: 本发明涉及一种用于波峰焊或镀锡的机器，其包括焊料储存器（9）; 意味着可以形成具有所谓的层状（8b）的至少一个焊波; 输送机系统（2），其可以使要焊接或镀锡的片（1）与所述层流接触; 以及用于在波附近注入（12）气体的装置; 其特征在于，所述注射装置包括位于与波浪相邻并且位于下游的位置并且设置有面向焊波的壁（17）的喷射器，其中喷射器的壁具有至少第一组（15） 定位的开口以提供朝向焊波的平坦表面的第一气体射流。

    Method of soldering terminal faces, as well as a method of manufacturing a solder alloy
    85.
    发明授权
    Method of soldering terminal faces, as well as a method of manufacturing a solder alloy 失效
    焊接端子的方法以及制造焊料合金的方法

    公开(公告)号：US6070788A

    公开(公告)日：2000-06-06

    申请号：US809538

    申请日：1997-05-08

    Applicant: Elke Zakel

    Inventor： Elke Zakel

    IPC: B23K1/00 ,  B23K1/20 ,  B23K35/14 ,  C22C1/02 ,  H01L21/60 ,  H05K3/34

    CPC classification number: H05K3/3494 ,  B23K1/203 ,  H05K3/3468 ,  H05K3/3484 ,  B23K2201/36 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/044 ,  H05K2203/0776 ,  H05K3/3478

    Abstract: A method of applying molten solder to connection surfaces on a substrate. The substrate, which has a surface which can be wetted with solder or at least one area which can be wetted while the rest cannot, is immersed in an organic liquid medium whose boiling point is the same as or above the melting point of the solder. Solder is applied to the surface or the area on the substrate where a terminal is to be formed to produce a solder bump, the quantity of solder to be placed on the connection surface is in the liquid medium, at least at the moment when it makes contact with the surface, and the temperature of the liquid medium is at or above the melting point of the solder.

    Abstract translation: PCT No.PCT / DE95 / 01209 Sec。 371日期：1997年5月8日 102（e）日期1997年5月8日PCT提交1995年9月4日PCT公布。 公开号WO96 / 08337 日期1996年3月21日一种将熔融焊料施加到基板上的连接表面的方法。 具有可以用焊料润湿的表面的基材或者其余部分不能润湿的至少一个区域浸渍在沸点相同或高于焊料熔点的有机液体介质中。 将焊料施加到要形成端子的表面或基板上的区域以产生焊料凸块，至少在其形成的时刻，要放置在连接表面上的焊料的量在液体介质中 与表面接触，液体介质的温度等于或高于焊料的熔点。

    Device for soldering a series of connectors and a method of use
    86.
    发明授权
    Device for soldering a series of connectors and a method of use 失效
    用于焊接一系列连接器的装置和使用方法

    公开(公告)号：US6065666A

    公开(公告)日：2000-05-23

    申请号：US54655

    申请日：1998-04-03

    Applicant: David D. Backlund

    Inventor： David D. Backlund

    IPC: B23K3/03 ,  B23K1/00

    CPC classification number: B23K3/0392 ,  B23K2201/36

    Abstract: A soldering member includes an elongated heating element for soldering a series of connectors. The elongated heating element of the soldering member is flexibly supported via a rigid base for adjusting the orientation of the heating element to align with a series of connectors rigidly supported for soldering. A method of using the soldering member is also described.

    Abstract translation: 焊接构件包括用于焊接一系列连接器的细长加热元件。 焊接部件的细长加热元件通过刚性基座灵活地支撑，用于调节加热元件的取向以与刚性支撑用于焊接的一系列连接器对齐。 还描述了使用焊接部件的方法。

    Apparatus for shaping liquid portions of solder in soft soldering semiconductor chips
    87.
    发明授权
    Apparatus for shaping liquid portions of solder in soft soldering semiconductor chips 失效
    用于在软焊接半导体芯片中成形焊料的液体部分的装置

    公开(公告)号：US06056184A

    公开(公告)日：2000-05-02

    申请号：US996654

    申请日：1997-12-23

    Applicant: Christoph B. Luchinger ,  Michael Lothenbach ,  Guido Suter

    Inventor： Christoph B. Luchinger ,  Michael Lothenbach ,  Guido Suter

    IPC: H01L21/60 ,  B23K1/20 ,  B29C65/00 ,  H01L21/52 ,  H05K3/34 ,  B23K1/00 ,  B23K37/00 ,  B23K3/02

    CPC classification number: H01L24/743 ,  B23K1/20 ,  B23K2201/36 ,  H01L2224/743 ,  H05K3/3457

    Abstract: The apparatus, in preparation of soft soldering semiconductor chips to a substrate (6), is for the shaping of spherically domed liquid portions of solder (8) into flat solder applications (8"), as evenly distributed as possible and correctly positioned on the substrate. On a shaft (10) which can be lifted and lowered, a punch (20) with a punch surface (22) is guided vertically, spring mounted and slewable all around the axis of motion (16) and also frictionally engaged. The punch (20) is provided with distance keeping means--e.g. in the form of a circumferential rim (24)--which extends beyond the punch surface (22) and is intended for touching down on the substrate (6). In each operation cycle the punch (20) is automatically aligned to the substrate (6). Since the punch (20) is self-adjusting with respect to the shaft (10), it is unnecessary to maintain an exactly defined height position above the substrate.

    Abstract translation: 该设备在将半导体芯片软焊接到基板（6）时，用于将焊球（8）的球形圆顶液体部分成形为平坦的焊料应用（8“），尽可能均匀分布并且正确定位在 底物。 在能够提升和降低的轴（10）上，具有冲压表面（22）的冲头（20）被垂直地引导，弹簧安装并且绕所述运动轴线（16）旋转并且也摩擦接合。 冲头（20）设置有距离保持装置 - 例如， 圆周边缘（24）的形式，其延伸超过冲头表面（22）并且旨在用于在基底（6）上向下触摸。 在每个操作循环中，冲头（20）自动对准衬底（6）。 由于冲头（20）相对于轴（10）自调节，因此不需要在基板上方保持精确限定的高度位置。

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