公开(公告)号：US20130214397A1

公开(公告)日：2013-08-22

申请号：US13674138

申请日：2012-11-12

Applicant: FUJITSU LIMITED

Inventor： Kenichi KAWAI

IPC: H05K1/02 ,  H01L23/66

CPC classification number: H05K1/0251 ,  H01L2924/0002 ,  H05K1/0245 ,  H05K1/116 ,  H01L2924/00

Abstract: A ground layer of a multilayer wiring board includes: a first clearance through which a first differential via is inserted without coming into contact with the ground layer; and a second clearance through which a second differential via is inserted without coming into contact with the ground layer. A distance between an outer edge of the first clearance on the side of the second differential via and the first differential via is set shorter than a distance between an outer edge of the first clearance on the side opposite from the second differential via and the first differential via. A distance between an outer edge of the second clearance on the side of the first differential via and the second differential via is set shorter than a distance between an outer edge of the second clearance on the side opposite from the first differential via and the second differential via.

Abstract translation: 多层布线基板的接地层包括：第一间隙，通过该第一间隙插入第一差分通孔而不与接地层接触; 以及第二间隙，通过该第二间隙插入第二差动通路而不与接地层接触。 在第二差动通路一侧的第一间隙的外边缘与第一差动通路之间的距离被设定成比第二间隙的与第二差动通路相反一侧的第一间隙的外边缘之间的距离短， 通过。 在第一差动通路一侧的第二间隙的外边缘与第二差动通路之间的距离设定为短于与第一差动通路相反一侧的第二间隙的外边缘与第二差速通路之间的距离 通过。

公开(公告)号：US08481863B2

公开(公告)日：2013-07-09

申请号：US12061203

申请日：2008-04-02

Applicant: Akinori Shiraishi ,  Kei Murayama ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Mitsutoshi Higashi

Inventor： Akinori Shiraishi ,  Kei Murayama ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Mitsutoshi Higashi

IPC: H05K1/16 ,  H05K1/11 ,  H01K3/10

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1147 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion is connected to a cover to thereby seal a light emitting element. A seal structure is composed of an uneven portion formed on the lower surface side surface of the base, a close contact layer formed on the surface of the uneven portion, a power supply layer formed on the close contact layer, and an electrode layer formed on the surface of the power supply layer. The uneven portion includes a first recessed portion formed at a position spaced in the radial direction from the outer periphery of a through electrode or from the inner wall of a through hole, and a second recessed portion formed at a position spaced further outwardly from the first recessed portion.

Abstract translation: 基板包括由用于安装发光元件的基座和竖立在基座上的壁部分限定的存储部分。 包装被构造成使得形成为围绕存储部分的周边的壁部分的上端连接到盖子上，从而密封发光元件。 密封结构由形成在基底的下表面侧的不平坦部分，形成在不平坦部分的表面上的紧密接触层，形成在紧密接触层上的电源层和形成在电极层上的电极层 电源层的表面。 不平坦部分包括形成在与通孔的外周沿径向间隔开的位置或从通孔的内壁隔开的位置处的第一凹部，以及形成在与第一凹部进一步向外间隔开的位置的第二凹部 凹陷部分。

公开(公告)号：US08471649B2

公开(公告)日：2013-06-25

申请号：US12376738

申请日：2007-09-07

Applicant: Jeff Devereux ,  Fritz Gerd Berger ,  William A. Johnston ,  Mohammad Ali Tassoudji ,  Scott Aldern

Inventor： Jeff Devereux ,  Fritz Gerd Berger ,  William A. Johnston ,  Mohammad Ali Tassoudji ,  Scott Aldern

IPC: H01P3/08 ,  H01P5/12

CPC classification number: H01P5/085 ,  H05K1/0243 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09718 ,  H05K2201/09809 ,  Y10T29/49139

Abstract: A compact Ku band microwave diplexer configured as a three port surface mount component on a miniature alumina substrate. Input signals occurring at a common port having frequencies within a first pass band are passed to a second port while being isolated from signals occurring at a third port. Signals occurring at the third port are passed to the common port while being isolated from the signals at the second port. A microstrip dual spur line filter is used combined with open circuit stubs to provide enhanced second harmonic suppression on the transmit side, while using a coupled line microstrip filter on the receive side. This approach allows for compact size and automated component assembly through pick and place and reflow manufacturing techniques.

Abstract translation: 在微型氧化铝基板上构造为三端口表面安装部件的紧凑型Ku波段微波双工器。 在具有第一通带内的频率的公共端口处发生的输入信号被传递到第二端口，同时与在第三端口处发生的信号隔离。 在第三个端口发生的信号被传递到公共端口，同时与第二个端口的信号隔​​离。 微带双支路线路滤波器与开路短路结合使用，以在接收侧使用耦合线路微带滤波器，在发射侧提供增强的二次谐波抑制。 这种方法允许通过拾取和放置和回流制​​造技术实现紧凑的尺寸和自动部件组装。

公开(公告)号：US20130115790A1

公开(公告)日：2013-05-09

申请号：US13652065

申请日：2012-10-15

Applicant: SUMITOMO WIRING SYSTEMS, LTD.

Inventor： Akira BABA ,  Tatsuya OKA

IPC: H01R12/58

CPC classification number: H01R12/58 ,  H01R9/28 ,  H01R13/112 ,  H05K1/0296 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/10295

Abstract: A board terminal has a flat-plate shaped connection portion to be connected to an electric component at one end and an insertion portion to be inserted in and soldered to a through-hole of a printed circuit board at the other end and is formed in a crank shape by being provided with a support plate portion protruding in a plate thickness direction of the connection portion between the connection portion and the insertion portion. Also, the insertion portion is formed in a location on only one side in a width direction of the support plate portion.

Abstract translation: 板端子具有平板形连接部分，该平板形连接部分在一端连接到电气部件，插入部分插入并焊接到另一端的印刷电路板的通孔中，并形成在 通过设置有在连接部分和插入部分之间的连接部分的板厚度方向上突出的支撑板部分的曲柄形状。 此外，插入部形成在仅在支撑板部的宽度方向上的一侧的位置。

公开(公告)号：US20130112468A1

公开(公告)日：2013-05-09

申请号：US13553414

申请日：2012-07-19

Applicant: Thomas S. COHEN ,  Marc B. Cartier, JR. ,  Mark W. Gailus

Inventor： Thomas S. COHEN ,  Marc B. Cartier, JR. ,  Mark W. Gailus

IPC: H05K1/11

CPC classification number: H01R13/646 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6587 ,  H01R23/688 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/116 ,  H05K1/14 ,  H05K3/429 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189 ,  H05K2203/1572

Abstract: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the second side, with the vias providing first signal launches on the first side and second signal launches on the second side. The first signal launches are provided in a plurality of rows, with each row having first signal launches along a first line and first signal launches along a second line substantially parallel to the first line. The second signal launches are provided in a plurality of columns, with each column having second signal launches along a third line and second signal launches along a fourth line substantially parallel to the third line.

公开(公告)号：US20130112465A1

公开(公告)日：2013-05-09

申请号：US13673986

申请日：2012-11-09

Applicant: SANMINA-SCI CORPORATION

Inventor： Vladimir Duvanenko

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/182 ,  H05K3/00 ,  H05K2201/09781 ,  Y10T29/49146

Abstract: A printed circuit board (PCB) is provided comprising a plurality of non-conductive layers with conductive or signal layers in between. The PCB includes a first conductive via traversing the plurality of non-conductive and conductive or signal layers as well as a second conductive via traversing the plurality of non-conductive layers and conductive or signal layers, the second conductive via located substantially parallel to the first conductive via. An embedded electro-optical passive element is also provided that extends perpendicular to and between the first conductive via and the second conductive via. The electro-optical passive element embedded is located within a selected layer at a first depth in the printed circuit board, wherein such first depth is selected to reflect an incident electromagnetic wave back into the printed circuit board to enhance or diminish an electrical signal in the first conductive via by creating a positive or negative electromagnetic interference.

Abstract translation: 提供了一种印刷电路板（PCB），包括多个非导电层，其间具有导电层或信号层。 PCB包括穿过多个非导电和导电或信号层的第一导电通孔以及穿过多个非导电层和导电层或信号层的第二导电通孔，第二导电通孔基本上平行于第一导电通孔 导电通孔。 还提供了嵌入的电光无源元件，其垂直于第一导电通孔和第二导电通孔之间延伸。 嵌入的电光无源元件位于印刷电路板的第一深度处的选定层内，其中选择这样的第一深度以将入射的电磁波反射回印刷电路板，以增强或减少印刷电路板中的电信号 通过产生正或负电磁干扰的第一导电通孔。

公开(公告)号：US20130100628A1

公开(公告)日：2013-04-25

申请号：US13655049

申请日：2012-10-18

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Takuto YAMAGUCHI

IPC: H05K1/11

CPC classification number: H01R12/585 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: An electronic device having a press-fit connection for connecting a connector and an electronic part mounted on a printed circuit board which is possible to enable high density mounting. Viewing the printed circuit board from an upper surface, between adjacent through holes on which a compressive force acts upon insertion of the press-fit terminal, among the large number of through holes, a land or a conductor film connected to the conductor film formed on the inner wall surface of the through hole or the conductor film not connected to the conductor film formed on the inner wall surface of the through hole, formed in the circuit board held between the top layer circuit board and the bottom layer circuit board, exists in a width equal to or wider than the diameter of the through hole.

Abstract translation: 具有用于连接连接器的压配合连接器和安装在印刷电路板上的可能实现高密度安装的电子部件的电子设备。 在大量通孔中观察印刷电路板的上表面，相邻通孔之间施加有压缩力作用在压配合端子之间的连接到导体膜上的焊盘或导体膜，形成在 贯通孔的内壁面或导体膜未连接到形成于贯通孔的内壁面的导体膜，形成在保持在顶层电路基板与底层电路基板之间的电路基板中，存在于 宽度等于或大于通孔的直径。

公开(公告)号：US08422248B2

公开(公告)日：2013-04-16

申请号：US13137504

申请日：2011-08-22

Applicant: Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K9/00

CPC classification number: H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

Abstract: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

Abstract translation: 一种电磁带隙结构，包括：第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，其具有连接到所述第一金属层的一个端部; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 以及第二金属层，层叠在第二电介质层中，而通孔的另一端部连接到放置在形成在金属板中的孔中的通孔焊盘，并且通路焊盘通过 金属线。

公开(公告)号：US08418361B2

公开(公告)日：2013-04-16

申请号：US13299685

申请日：2011-11-18

Applicant: Suk Won Lee ,  Chang Gun Oh ,  Mi Sun Hwang

Inventor： Suk Won Lee ,  Chang Gun Oh ,  Mi Sun Hwang

IPC: H05K3/02

CPC classification number: H05K3/421 ,  H05K1/116 ,  H05K3/108 ,  H05K2201/09545 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.

Abstract translation: 制造印刷电路板的方法，包括：提供包括具有通孔下部的第一电路层的基板; 在所述第一电路层上形成绝缘层; 在绝缘层中形成通孔; 用第一金属填充通孔，从而形成通孔; 在绝缘层上形成具有第二金属的种子层和通孔的暴露表面; 在种子层上施加抗蚀剂膜，并且形成具有形成在通孔上的宽度的第二电路层的开口的抗蚀剂图案小于通孔的宽度; 用第三金属电镀由开口限定的电路区域，从而形成由第三金属形成的镀层; 并去除抗蚀剂膜，并且选择性地去除种子层的暴露部分，从而形成第二电路层。

公开(公告)号：US08399774B2

公开(公告)日：2013-03-19

申请号：US13303769

申请日：2011-11-23

Applicant: Yoichi Hitomi ,  Hiroaki Miyazawa ,  Shinji Kumon ,  Terutoshi Momose

Inventor： Yoichi Hitomi ,  Hiroaki Miyazawa ,  Shinji Kumon ,  Terutoshi Momose

IPC: H05K1/00 ,  H05K1/02

CPC classification number: G06F1/182 ,  G11B5/40 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0215 ,  H05K1/056 ,  H05K1/116 ,  H05K3/44 ,  H05K2201/09463 ,  H05K2201/09554

Abstract: A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.

Abstract translation: 悬浮基板包括金属基板，形成在金属基板上的绝缘层，具有用于接地端子的开口和形成在绝缘层上的接地导体。 接地端子形成材料放置在接地端子的开口中，形成连接金属基板和接地导体的接地端子。 接地导体不包围用于接地端子的开口的圆周的一部分。