公开(公告)号：US5305130A

公开(公告)日：1994-04-19

申请号：US53884

申请日：1993-04-27

Applicant: Tatsushi Yamawaki

Inventor： Tatsushi Yamawaki

IPC: G02F1/1345 ,  G02F1/13 ,  H01L21/60 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K3/361 ,  G02F1/13452 ,  H01L23/4985 ,  H05K1/0293 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15173 ,  H05K1/117 ,  H05K1/118 ,  H05K2201/09127 ,  H05K2201/09409 ,  H05K2201/0979 ,  H05K2201/09954 ,  H05K2201/09972 ,  H05K2201/10136 ,  H05K2201/10681 ,  H05K2203/0228 ,  H05K2203/175 ,  H05K3/0052 ,  H05K3/0097

Abstract: A connecting tape for interconnecting wiring lines on a liquid crystal display panel and those on a driver IC is constituted by an insulating tape having wiring layers provided thereon. The wiring layers have a plurality of first pitch group wiring layers on an upper surface of one of end sides of the insulating tape and a plurality of second pitch group wiring layers on an upper surface of the other of the end sides of the insulating tape, with the second pitch group having pitches different from those of the first pitch group wiring layers. The first pitch group wiring layers are adapted to be aligned and connected with wiring lines of the liquid crystal display panel which lines are arranged in the same pitches as those of the first pitch group wiring layers, and the second pitch group wiring layers are adapted to be aligned and connected with wiring lines of the driver IC. There can be a number of different pitch group wiring layers and of different pitch group wiring lines. It is possible to connect one given kind of film carrier type liquid crystal display driver IC with a number of liquid crystal display panels having wiring lines whose pitches are different from those in the liquid crystal display driver IC. This can save costs and time in the fabrication of the product concerned.

Abstract translation: 用于互连液晶显示面板上的布线和驱动器IC上的布线的连接带由其上设置有布线层的绝缘带构成。 布线层在绝缘带的一个端面的上表面和绝缘带的另一个端面的上表面上的多个第二间距组布线层上具有多个第一间距组布线层， 第二间距组具有与第一间距组布线层不同的间距。 第一间距组布线层适于与液晶显示面板的布线对齐并与第一间距组布线层的间距相同的间距布置，并且第二间距组布线层适于 对准并与驱动器IC的布线相连。 可以有多个不同的音调组布线层和不同的音调组布线。 可以将一种给定种类的胶片载体型液晶显示驱动器IC与具有与液晶显示驱动器IC中的间距不同的布线的多个液晶显示面板连接。 这可以节省制造相关产品的成本和时间。

公开(公告)号：US5101324A

公开(公告)日：1992-03-31

申请号：US486430

申请日：1990-02-28

Applicant: Eiichi Sato

Inventor： Eiichi Sato

IPC: H01L21/60 ,  H01L21/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/31 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L21/67144 ,  H01L21/56 ,  H01L21/67126 ,  H01L23/3121 ,  H01L24/97 ,  H05K1/181 ,  H01L2224/50 ,  H01L2224/97 ,  H05K2201/09072 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10681 ,  H05K2203/1316 ,  H05K2203/1572 ,  H05K3/284 ,  Y02P70/611

Abstract: Semiconductor devices are each arranged such that a semiconductor chip is disposed on a film carrier, fingers of the film carrier are respectively connected to a multiplicity of electrodes provided on the semiconductor chip, and the fingers are then trimmed, or the fingers are trimmed after the semiconductor chip and parts of the fingers are sealed with a resin or the like. The semiconductor devices thus arranged are respectively mounted on both obverse and reverse surfaces of a substrate at mutually opposing positions thereof, the substrate having electrically conductive patterns formed on both surfaces thereof. The semiconductor devices are sealed with a resin or the like so as to be formed integrally with the substrate.

公开(公告)号：US20240314929A1

公开(公告)日：2024-09-19

申请号：US18588633

申请日：2024-02-27

Applicant: Kioxia Corporation

Inventor： Kiyokazu ISHIZAKI

IPC: H05K1/11 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H05K1/18

CPC classification number: H05K1/117 ,  H01L23/3128 ,  H01L23/49816 ,  H01L25/0652 ,  H05K1/111 ,  H05K1/181 ,  H01L2225/06506 ,  H01L2225/06562 ,  H01L2225/06586 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/10734 ,  H05K2201/10984

Abstract: A semiconductor storage device includes a wiring pattern on an insulating base material; an insulating film covering partially the wiring pattern; and an electronic component. The wiring pattern includes a first pad having an edge in an arc shape, and a first wire. The insulating film has a first opening larger than the first pad. The first wire has a first portion, a second portion, and a third portion. The first portion is connected to the first pad inside the first opening extends in a first direction. The second portion is connected to the first pad inside the first opening and extends in a second direction. The third portion is connected to the first portion and the second portion. The first wire is connected with the first pad in an angular range of not more than 90 degrees in a circumferential direction of the first pad.

公开(公告)号：US12061500B2

公开(公告)日：2024-08-13

申请号：US17346749

申请日：2021-06-14

Applicant: Whoborn, Inc.

Inventor： Youngsik Bae ,  WonSuk Do

IPC: G06F1/16 ,  G06F1/26 ,  H01Q1/24 ,  H05K1/03 ,  H05K1/18

CPC classification number: G06F1/1698 ,  G06F1/266 ,  H01Q1/243 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/09409 ,  H05K2201/10098

Abstract: A communication system includes a substrate, a plurality of antennas disposed on the substrate, and a radio frequency (RF) tag. A distance between the RF tag and at least one antenna among the plurality of antennas is detected based on a signal emitted by the RF tag and received by the at least one antenna.

公开(公告)号：US20240244751A1

公开(公告)日：2024-07-18

申请号：US18621775

申请日：2024-03-29

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ren XIONG ,  Yuanzhang ZHU ,  Qiang TANG ,  Huiqiang SONG ,  Yichen JIANG ,  Hang MIN ,  Fei SHANG ,  Haijun QIU

IPC: H05K1/14 ,  G06F3/041 ,  H05K1/11 ,  H05K1/18 ,  G02F1/1345 ,  G02F1/1368 ,  H01L25/18 ,  H01R12/61 ,  H10K59/131

CPC classification number: H05K1/147 ,  G06F3/04164 ,  H05K1/118 ,  H05K1/189 ,  G02F1/13452 ,  G02F1/1368 ,  G06F2203/04103 ,  G06F2203/04107 ,  H01L25/18 ,  H01R12/61 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/10128 ,  H05K2201/10136 ,  H10K59/131

Abstract: A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.

公开(公告)号：US20240170430A1

公开(公告)日：2024-05-23

申请号：US18515364

申请日：2023-11-21

Applicant: X Display Company Technology Limited

Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

IPC: H01L23/00 ,  H01L21/48 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L24/11 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H05K1/112 ,  H05K3/3436 ,  H01L21/4803 ,  H01L21/4846 ,  H01L2224/1144 ,  H01L2224/11466 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/1412 ,  H01L2224/1418 ,  H01L2224/16227 ,  H01L2224/1624 ,  H01L2224/17107 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1304 ,  H05K3/305 ,  H05K2201/09409 ,  H05K2201/09472 ,  H05K2201/0979 ,  H05K2201/10143

Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

公开(公告)号：US11991828B2

公开(公告)日：2024-05-21

申请号：US17626902

申请日：2021-02-20

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ren Xiong ,  Yuanzhang Zhu ,  Qiang Tang ,  Huiqiang Song ,  Yichen Jiang ,  Hang Min ,  Fei Shang ,  Haijun Qiu

IPC: H05K1/14 ,  G06F3/041 ,  H05K1/11 ,  H05K1/18 ,  G02F1/1345 ,  G02F1/1368 ,  H01L25/18 ,  H01R12/61 ,  H10K59/131

CPC classification number: H05K1/147 ,  G06F3/04164 ,  H05K1/118 ,  H05K1/189 ,  G02F1/13452 ,  G02F1/1368 ,  G06F2203/04103 ,  G06F2203/04107 ,  H01L25/18 ,  H01R12/61 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/10128 ,  H05K2201/10136 ,  H10K59/131

Abstract: A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.

公开(公告)号：US11991825B2

公开(公告)日：2024-05-21

申请号：US16392112

申请日：2019-04-23

Applicant: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yuanda Lu ,  Junjie Ma ,  Shipeng Wang ,  Ming Zhai ,  Jian Sang ,  Haiwei Sun ,  Dongjia Hao

IPC: F21V8/00 ,  H01R12/65 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/118 ,  H01R12/65 ,  H05K1/028 ,  H05K1/111 ,  H05K2201/09372 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/09781 ,  H05K2201/10378

Abstract: The present disclosure provides a flexible circuit board, a light bar, a light source and a display device. The light source includes a flexible circuit board having at least one effective welding portion and a light bar having at least one effective pad, the at least one effective welding portion being in one-to-one correspondence with the at least one effective pad, and the effective welding portion being fixed to a corresponding effective pad to transmit a signal loaded by itself to the corresponding effective pad. The flexible circuit board further includes at least one auxiliary welding portion, the light bar further includes at least one auxiliary pad that is in one-to-one correspondence with the at least one auxiliary welding portion, and the auxiliary welding portion is fixed to a corresponding auxiliary pad to enhance the firm fixing between the flexible circuit board and the light bar.

公开(公告)号：US20230413435A1

公开(公告)日：2023-12-21

申请号：US18242297

申请日：2023-09-05

Applicant: Exro Technologies Inc.

Inventor： Eric HUSTEDT

IPC: H05K1/11 ,  H05K1/18 ,  H02M7/00

CPC classification number: H05K1/111 ,  H05K1/181 ,  H02M7/003 ,  H05K2201/10522 ,  H05K2201/09409 ,  H05K2201/10166 ,  H05K2201/09227

Abstract: An article for a power inverter, includes a multilayer printed circuit board having a first and second electrically conductive wiring layer and at least a first dielectric layer interposed between the first and second electrically conductive wiring layers. Each conductive wiring layer includes a common input and output line, the common input and output lines at least partially overlapping one another in a projection along a thickness of the multilayer printed circuit board. A set of input mounting pads is carried by the first common input line and a set of input mounting pads is carried by the second common input line, the input mounting pads of the second set of input mounting pads are interleaved with the input mounting pads of the first set of input mounting pads along a first axis. The article further includes a set output mounting pads carried by the common output line.

公开(公告)号：US20230371175A1

公开(公告)日：2023-11-16

申请号：US18044869

申请日：2021-09-13

Applicant: TDK Corporation

Inventor： Yu FUKAE ,  Tomoya HANAI ,  Yusuke OBA ,  Kenichi YOSHIDA ,  Katsuharu YASUDA ,  Takashi OHTSUKA

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0298 ,  H05K1/05 ,  H05K2201/0338 ,  H05K2201/09409

Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.