公开(公告)号：US06326239B1

公开(公告)日：2001-12-04

申请号：US09287016

申请日：1999-04-06

申请人： Yasutomi Asai ,  Hirokazu Imai ,  Yuji Ootani ,  Takashi Nagasaka

发明人： Yasutomi Asai ,  Hirokazu Imai ,  Yuji Ootani ,  Takashi Nagasaka

IPC分类号： H01L2328

CPC分类号： H01L23/544 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/245 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10992 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A mounting structure includes a laminated ceramic capacitor mounted on a mounting substrate. The laminated ceramic capacitor includes a main body chip made by a ceramic dielectric, internal layer electrodes, and pair of terminal electrodes. The mounting substrate is made by alumina substrate, and has a pair of substrate electrodes made by copper plating. The laminated ceramic capacitor is mounted on the mounting substrate by using an Ag paste. Here, the substrate electrode is set to be smaller than the Ag paste. That is, the Ag paste is extruded from the terminal electrodes and the substrate electrode so as to contact to both of the main body chip and the mounting substrate. Because the Ag paste has a high adhesive strength compared to that when it is bonded with a metal, total adhesive strength can be improved. Consequently, the reliability of mounting can be improved.

摘要翻译： 安装结构包括安装在安装基板上的层叠陶瓷电容器。 层叠陶瓷电容器包括由陶瓷电介质制成的主体芯片，内层电极和一对端子电极。 安装基板由氧化铝基板制成，并具有通过镀铜制成的一对基板电极。 层叠陶瓷电容器通过使用Ag浆料安装在安装基板上。 这里，将基板电极设定为小于Ag糊料。 也就是说，Ag膏从端子电极和基板电极挤出，以便与主体芯片和安装基板接触。 由于Ag糊料与金属粘合时的粘合强度高，所以可以提高总的粘合强度。 因此，可以提高安装的可靠性。

公开(公告)号：US06731001B2

公开(公告)日：2004-05-04

申请号：US09918803

申请日：2001-08-01

申请人： Kan Kinouchi ,  Mitsuhiro Saitou ,  Takashi Nagasaka ,  Yuji Ootani ,  Hiroyuki Yamakawa ,  Koji Takeuchi ,  Hirokazu Imai ,  Yukihiro Maeda ,  Atsushi Kanamori

发明人： Kan Kinouchi ,  Mitsuhiro Saitou ,  Takashi Nagasaka ,  Yuji Ootani ,  Hiroyuki Yamakawa ,  Koji Takeuchi ,  Hirokazu Imai ,  Yukihiro Maeda ,  Atsushi Kanamori

IPC分类号： H01L2352

CPC分类号： H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/20753 ,  H01L2924/2076 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/284 ,  H05K3/366 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2924/00

摘要： Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.

摘要翻译： 几个电子部件安装在半导体器件中的多个陶瓷基板上，并且通过接合线引线接合到相应的陶瓷基板。 电子部件和接合线在每个陶瓷基板上被封闭构件覆盖，并且封装构件的内部填充有用于密封的硅凝胶。 陶瓷基板一起结合到散热片上，并垂直于母板安装在母板上。

公开(公告)号：US06645606B2

公开(公告)日：2003-11-11

申请号：US10120527

申请日：2002-04-12

申请人： Tetsuo Nakano ,  Yukihiro Maeda ,  Yasutomi Asai ,  Takashi Nagasaka

发明人： Tetsuo Nakano ,  Yukihiro Maeda ,  Yasutomi Asai ,  Takashi Nagasaka

IPC分类号： B32B1500

CPC分类号： H05K3/244 ,  H01L23/49811 ,  H01L23/538 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/245 ,  H05K3/328 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48744

摘要： A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

公开(公告)号：US06376906B1

公开(公告)日：2002-04-23

申请号：US09021989

申请日：1998-02-11

申请人： Yasutomi Asai ,  Shinji Ota ,  Takashi Nagasaka

发明人： Yasutomi Asai ,  Shinji Ota ,  Takashi Nagasaka

IPC分类号： H01L2304

CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a mounting structure of a flip chip IC, the flip chip IC is mounted on an alumina laminated substrate through conductive lands of the substrate and bumps of the flip chip IC. A space between the flip chip IC and the substrate is filled with resin. Further, inspection lands are provided on the substrate for inspecting the flip chip IC, and are electrically connected to the conductive lands through vias and inside wires provided in the substrate. That is, the inspection lands are connected to the conductive lands to bypath an edge portion of the resin. As a result, separation of the resin from the substrate can be prevented.

摘要翻译： 在倒装芯片IC的安装结构中，倒装芯片IC通过衬底的导电焊盘和倒装芯片IC的凸块安装在氧化铝层压衬底上。 倒装芯片IC和基板之间的空间填充有树脂。 此外，在基板上设置检查台以检查倒装芯片IC，并且通过设置在基板中的通孔和内部电线电连接到导电焊盘。 也就是说，检查台面与树脂的边缘部分连接到导电焊盘。 结果，可以防止树脂与基板分离。

公开(公告)号：US06217990B1

公开(公告)日：2001-04-17

申请号：US09073139

申请日：1998-05-06

申请人： Yasutomi Asai ,  Takashi Nagasaka ,  Shinji Ota ,  Takashi Yamazaki ,  Shinya Terao ,  Syoichi Nakagawa

发明人： Yasutomi Asai ,  Takashi Nagasaka ,  Shinji Ota ,  Takashi Yamazaki ,  Shinya Terao ,  Syoichi Nakagawa

IPC分类号： B32B300

CPC分类号： H05K1/0271 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/09701 ,  H01L2924/15192 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T428/24926

摘要： A multilayer circuit board for holding a flip chip thereon includes laminated first to fourth substrates. A first pattern integrated portion having a locally high pattern density is provided on the second substrate. Further, on the fourth substrate which is disposed on an opposite side of the second substrate with respect to a center in a laminated direction of the circuit board, a second pattern integrated portion having a locally high pattern density is disposed to correspond to the first pattern integrated portion. Accordingly, a local warp can be prevented from being produced on the mounting surface of the multilayer circuit board when the circuit board is manufactured by baking.

摘要翻译： 用于保持倒装芯片的多层电路板包括层叠的第一至第四基板。 具有局部高图案密度的第一图案集成部分设置在第二基板上。 此外，在相对于电路板的层叠方向的中心设置在第二基板的相对侧的第四基板上，具有局部高图案密度的第二图案一体化部分设置成对应于第一图案 集成部分。 因此，当通过烘烤制造电路板时，可以防止在多层电路板的安装表面上产生局部翘曲。

公开(公告)号：US6048424A

公开(公告)日：2000-04-11

申请号：US4924

申请日：1998-01-09

申请人： Yasutomi Asai ,  Takashi Nagasaka ,  Kenichi Gohara ,  Takashi Yamasaki ,  Yoshiaki Shimojo

发明人： Yasutomi Asai ,  Takashi Nagasaka ,  Kenichi Gohara ,  Takashi Yamasaki ,  Yoshiaki Shimojo

IPC分类号： H05K1/03 ,  H01L21/48 ,  H01L23/12 ,  H05K3/46 ,  B32B31/26

CPC分类号： H05K3/4629 ,  H01L21/4857 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/10378 ,  H05K3/462 ,  Y10T156/1056 ,  Y10T29/49163

摘要： Via portions are formed in a first green sheet for a first layer of a laminated substrate. Then, conductive lands are formed on a surface of the first green sheet and a wiring pattern is formed on a back face of the first green sheet to be connected to the conductive lands through the via portions. The thus formed first green sheet is joined to a second green sheet having via portions therein so that the wiring pattern of the first green sheet contacts the via portions of the second green sheet. In this case, by forming the wiring pattern on the back face of the first green sheet, lamination slippage of the wiring pattern caused by lamination of the first and second green sheets can be prevented.

摘要翻译： 通过部分形成在层压基板的第一层的第一生片中。 然后，在第一生片的表面上形成导电焊盘，并且在第一生片的背面上形成布线图案，以通过通孔部分连接到导电焊盘。 如此形成的第一生片与其中具有通孔部分的第二生片接合，使得第一生片的布线图案接触第二生片的通孔部分。 在这种情况下，通过在第一生片的背面上形成布线图案，可以防止由第一和第二生片的叠层引起的布线图案的层叠滑动。

公开(公告)号：US5731067A

公开(公告)日：1998-03-24

申请号：US663029

申请日：1996-06-07

申请人： Yasutomi Asai ,  Takashi Nagasaka

发明人： Yasutomi Asai ,  Takashi Nagasaka

IPC分类号： H01L23/367 ,  H01L23/373 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  H05K7/20 ,  B32B3/00

CPC分类号： H05K1/0207 ,  H01L23/3677 ,  H01L23/3736 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/0209 ,  H05K2203/049 ,  H05K3/4053 ,  H05K3/4629 ,  H05K3/4641 ,  Y10S428/901 ,  Y10T428/24926

摘要： A multi-layered substrate capable of lowering transient and steady heat resistances. A metal serving as a heat conductor having good heat conducting property is fitted in the uppermost insulating layer, and a power element is disposed on the fitted metal. The heat generated by the power element is conducted to the metal in the uppermost insulating layer and is radiated. The metal can be composed of a mixture of molybdenum particles or tungsten particle having a high melting point and aluminum particles.

摘要翻译： 能够降低瞬态和稳定耐热性的多层基板。 作为具有良好导热性的导热体的金属装配在最上层的绝缘层中，并且功能元件设置在配合的金属上。 由功率元件产生的热量被传导到最上层绝缘层中的金属并被辐射。 金属可以由具有高熔点的钼颗粒或钨颗粒和铝颗粒的混合物组成。

公开(公告)号：US06174462B1

公开(公告)日：2001-01-16

申请号：US09233153

申请日：1999-01-19

申请人： Kengo Oka ,  Takashi Nagasaka ,  Yuji Ootani ,  Kazumasa Naito ,  Masayuki Miyairi

发明人： Kengo Oka ,  Takashi Nagasaka ,  Yuji Ootani ,  Kazumasa Naito ,  Masayuki Miyairi

IPC分类号： H01B102

CPC分类号： H05K3/28 ,  C03C8/02 ,  C03C8/10 ,  C03C8/24 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/017 ,  H05K2201/0769 ,  H01L2924/00

摘要： A circuit board comprises wiring parts containing silver on a substrate, and a conductivity suppressing agent such as a potassium compound provided between the wiring parts, for preventing the silver attached on the substrate between the wiring parts from being conductive. Therefore, the insulation deterioration between the wiring parts can be suitably suppressed, which usually occurs when a voltage is applied between the wiring parts containing silver on the substrate under a high temperature atmosphere, irrespective of the presence or absence of water or water vapor. That is, the high temperature leakage phenomenon can be suitably suppressed.

摘要翻译： 电路板包括在基板上含有银的布线部分和设置在布线部分之间的诸如钾化合物的导电性抑制剂，以防止在布线部分之间附着在基板上的银导电。 因此，无论存在或不存在水或水蒸气，都可以适当地抑制布线部分之间的绝缘劣化，这通常在高温气氛下在基板上包含银的布线部分之间施加电压时发生。 也就是说，可以适当地抑制高温泄漏现象。

公开(公告)号：US06601752B2

公开(公告)日：2003-08-05

申请号：US09801855

申请日：2001-03-09

申请人： Yukihiro Maeda ,  Yuji Ootani ,  Tetsuo Nakano ,  Takashi Nagasaka

发明人： Yukihiro Maeda ,  Yuji Ootani ,  Tetsuo Nakano ,  Takashi Nagasaka

IPC分类号： B23K2010

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/36 ,  B23K2101/42 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8501 ,  H01L2224/85013 ,  H01L2224/85051 ,  H01L2224/85148 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/1225 ,  H05K3/4015 ,  H01L2924/01001 ,  H01L2924/01046 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.

摘要翻译： 在使用用于安装IC芯片的导电粘合剂或除了IC芯片之外的诸如电容器的部件之类的印刷陶瓷基板的布线部分的步骤中，由金焊接方法或 类似于待接线的布线部分的部分。 在形成焊盘并且在导电粘合剂被印刷之前，进行热处理以在布线部分和焊盘之间引起热扩散以提高它们之间的可接合性。

公开(公告)号：USD605662S1

公开(公告)日：2009-12-08

申请号：US29300312

申请日：2008-03-11

申请人： Hideki Miura ,  Takashi Nagasaka

设计人： Hideki Miura ,  Takashi Nagasaka