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12 条记录 (耗时 0.031 秒)

    Method for bonding two surfaces together
    1.
    发明授权
    Method for bonding two surfaces together 失效
    将两个表面粘合在一起的方法

    公开(公告)号：US5462628A

    公开(公告)日：1995-10-31

    申请号：US232417

    申请日：1994-04-25

    申请人： Alfred Viehbeck ,  Martin Goldberg ,  Stephen L. Tisdale ,  Stephen L. Buchwalter ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew

    发明人： Alfred Viehbeck ,  Martin Goldberg ,  Stephen L. Tisdale ,  Stephen L. Buchwalter ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew

    IPC分类号： C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38 ,  B32B31/00

    CPC分类号： C23C18/1608 ,  C23C18/166 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/30 ,  H05K3/381 ,  Y10S525/903

    摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

    摘要翻译： 某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。 聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。 该改变可用于改性或蚀刻聚合物材料。 可以通过在受控的深度将金属种子并入材料中来修饰材料。 种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。 随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。 聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。 增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

    Method for etching an organic polymeric material
    3.
    发明授权
    Method for etching an organic polymeric material 失效
    蚀刻有机聚合物材料的方法

    公开(公告)号：US5203955A

    公开(公告)日：1993-04-20

    申请号：US705648

    申请日：1991-05-24

    申请人： Aldred Viehbeck ,  Stephen L. Buchwalter ,  John J. Glenning ,  Martin J. Goldberg ,  Caroline A. Kovac ,  Linda C. Matthew ,  Walter P. Pawlowski ,  Stephen L. Tisdale

    发明人： Aldred Viehbeck ,  Stephen L. Buchwalter ,  John J. Glenning ,  Martin J. Goldberg ,  Caroline A. Kovac ,  Linda C. Matthew ,  Walter P. Pawlowski ,  Stephen L. Tisdale

    IPC分类号： C23C18/16 ,  C23C18/28 ,  H05K3/38

    CPC分类号： C23C18/2086 ,  C23C18/1608 ,  C23C18/30 ,  C23C18/36 ,  C23C18/405 ,  H05K3/381 ,  C25D5/022

    摘要： Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

    摘要翻译： 某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。 聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。 该改变可用于改性或蚀刻聚合物材料。 可以通过在受控的深度将金属种子并入材料中来修饰材料。 种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。 随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。 聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。 增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

    Packages for stacked integrated circuit chip cubes
    9.
    发明授权
    Packages for stacked integrated circuit chip cubes 失效
    堆叠集成电路芯片立方体的封装

    公开(公告)号：US5343366A

    公开(公告)日：1994-08-30

    申请号：US903838

    申请日：1992-06-24

    申请人： Thomas M. Cipolla ,  Paul W. Coteus ,  Ioannis Damianakis ,  Glen W. Johnson ,  Peter G. Ledermann ,  Linda C. Matthew ,  Lawrence S. Mok

    发明人： Thomas M. Cipolla ,  Paul W. Coteus ,  Ioannis Damianakis ,  Glen W. Johnson ,  Peter G. Ledermann ,  Linda C. Matthew ,  Lawrence S. Mok

    IPC分类号： H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R23/68

    CPC分类号： H05K3/363 ,  H01L24/01 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06596 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10484 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2201/10984 ,  H05K3/326 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/366 ,  H05K3/4007 ,  H05K3/4092

    摘要： This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate and within which corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contain solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate surface or the pin-like structures can be adapted for insertion into apertures in a second substrate. The second substrate provides a means for electrically inter-connecting a plurality of these cuboids. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cuboid structures.

    摘要翻译： 本发明涉及将集成电路芯片三维封装成堆栈以形成立方体结构。 在堆叠中的相邻芯片之间，设置有电互连装置，其是具有多个导体的第一基板，其多个导体电连接到芯片接触位置，并且其另一端延伸到芯片堆叠的一侧， 形成多个针状电互连组件。 销状结构可以由在其至少一侧上具有电导体的第一基板的凸起从该侧延伸形成。 或者，销状结构可以由从第一基板的边缘的两侧悬臂的导体形成，并且其中来自两侧的相应导体对准并且间隔开第一基板厚度。 这些空间包含焊料并形成焊料加载的针状结构。 销状结构可以直接焊接到第二衬底表面上的导体上，或者针状结构可以适于插入到第二衬底中的孔中。 第二基板提供用于电连接多个这些长方体的装置。 优选地，第一和第二基底是电路化柔性聚合物膜。 第二基板设置在诸如PC板的第三基板上，其间具有弹性材料，其允许将散热器压紧成与长方体结构的相对侧紧密接触。