公开(公告)号：US08446003B2

公开(公告)日：2013-05-21

申请号：US12785764

申请日：2010-05-24

申请人： Atsushi Komura ,  Yasuhiro Kitamura ,  Nozomu Akagi ,  Yasutomi Asai

发明人： Atsushi Komura ,  Yasuhiro Kitamura ,  Nozomu Akagi ,  Yasutomi Asai

IPC分类号： H01L23/485 ,  H01L23/367

CPC分类号： H01L24/05 ,  H01L23/3677 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/06181 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24226 ,  H01L2224/25171 ,  H01L2224/25174 ,  H01L2224/2518 ,  H01L2224/80855 ,  H01L2224/81203 ,  H01L2224/8184 ,  H01L2224/82 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19043 ,  H05K1/0204 ,  H05K1/186 ,  H05K3/4617 ,  H05K3/4644 ,  H05K2201/10416 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a multilayer wiring substrate and a double-sided multi-electrode chip. The double-sided multi-electrode chip includes a semiconductor chip and has multiple electrodes on both sides of the semiconductor chip. The double-sided multi-electrode chip is embedded in the multilayer wiring substrate in such a manner that the double-sided multi-electrode chip is not exposed outside the multilayer wiring substrate. The electrodes of the double-sided multi-electrode chip are connected to wiring layers of the multilayer wiring substrate.

摘要翻译： 半导体器件包括多层布线基板和双面多电极芯片。 双面多电极芯片包括半导体芯片，并且在半导体芯片的两侧具有多个电极。 双面多电极芯片以这样的方式嵌入多层布线基板中，使得双面多电极芯片不暴露在多层布线基板的外部。 双面多电极芯片的电极连接到多层布线基板的布线层。

公开(公告)号：US20100295170A1

公开(公告)日：2010-11-25

申请号：US12785764

申请日：2010-05-24

申请人： Atsushi KOMURA ,  Yasuhiro Kitamura ,  Nozomu Akagi ,  Yasutomi Asai

发明人： Atsushi KOMURA ,  Yasuhiro Kitamura ,  Nozomu Akagi ,  Yasutomi Asai

IPC分类号： H01L23/485 ,  H01L23/367

CPC分类号： H01L24/05 ,  H01L23/3677 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/06181 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24226 ,  H01L2224/25171 ,  H01L2224/25174 ,  H01L2224/2518 ,  H01L2224/80855 ,  H01L2224/81203 ,  H01L2224/8184 ,  H01L2224/82 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19043 ,  H05K1/0204 ,  H05K1/186 ,  H05K3/4617 ,  H05K3/4644 ,  H05K2201/10416 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a multilayer wiring substrate and a double-sided multi-electrode chip. The double-sided multi-electrode chip includes a semiconductor chip and has multiple electrodes on both sides of the semiconductor chip. The double-sided multi-electrode chip is embedded in the multilayer wiring substrate in such a manner that the double-sided multi-electrode chip is not exposed outside the multilayer wiring substrate. The electrodes of the double-sided multi-electrode chip are connected to wiring layers of the multilayer wiring substrate.

摘要翻译： 半导体器件包括多层布线基板和双面多电极芯片。 双面多电极芯片包括半导体芯片，并且在半导体芯片的两侧具有多个电极。 双面多电极芯片以这样的方式嵌入多层布线基板中，使得双面多电极芯片不暴露在多层布线基板的外部。 双面多电极芯片的电极连接到多层布线基板的布线层。

公开(公告)号：US20070075419A1

公开(公告)日：2007-04-05

申请号：US11515045

申请日：2006-09-05

申请人： Yutaka Fukuda ,  Mitsuhiro Saitou ,  Toshihiro Nagaya ,  Yukihiro Maeda ,  Norihisa Imaizumi ,  Yasutomi Asai ,  Yasutomi Asai

发明人： Yutaka Fukuda ,  Mitsuhiro Saitou ,  Toshihiro Nagaya ,  Yukihiro Maeda ,  Norihisa Imaizumi ,  Yasutomi Asai ,  Yasutomi Asai

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes: first to fourth vertical type semiconductor elements having first and second electrodes; a metallic lead; a resin mold; a circuit board; an electric circuit on the circuit board; and an electronic chip on the circuit board. The electronic chip drives and controls each semiconductor element through the electric circuit. The first to fourth semiconductor elements are arranged to be a stack construction in the resin mold. The first to fourth semiconductor elements provide a H-bridge circuit. Each of the first and second electrodes in each semiconductor element is directly connected to the metallic lead so that heat generated in the semiconductor element is radiated through the metallic lead.

摘要翻译： 半导体器件包括：具有第一和第二电极的第一至第四垂直型半导体元件; 金属铅; 树脂模具; 电路板; 电路板上的电路; 和电路板上的电子芯片。 电子芯片通过电路驱动和控制每个半导体元件。 第一至第四半导体元件被布置为树脂模具中的堆叠结构。 第一至第四半导体元件提供H桥电路。 每个半导体元件中的每个第一和第二电极直接连接到金属引线，使得半导体元件中产生的热量通过金属引线辐射。

公开(公告)号：US08749055B2

公开(公告)日：2014-06-10

申请号：US13449484

申请日：2012-04-18

申请人： Tetsuto Yamagishi ,  Tohru Nomura ,  Norihisa Imaizumi ,  Yasutomi Asai

发明人： Tetsuto Yamagishi ,  Tohru Nomura ,  Norihisa Imaizumi ,  Yasutomi Asai

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/15 ,  H01L23/315 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49506 ,  H01L23/49531 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.

摘要翻译： 电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。 树脂模具进一步密封基板的第二表面上的第二电子元件。 基板的第二表面具有从树脂模露出的部分。 第二电子元件不设置在第二表面的部分上。

公开(公告)号：US06645606B2

公开(公告)日：2003-11-11

申请号：US10120527

申请日：2002-04-12

申请人： Tetsuo Nakano ,  Yukihiro Maeda ,  Yasutomi Asai ,  Takashi Nagasaka

发明人： Tetsuo Nakano ,  Yukihiro Maeda ,  Yasutomi Asai ,  Takashi Nagasaka

IPC分类号： B32B1500

CPC分类号： H05K3/244 ,  H01L23/49811 ,  H01L23/538 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/245 ,  H05K3/328 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48744

摘要： A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

公开(公告)号：US20070278550A1

公开(公告)日：2007-12-06

申请号：US11806340

申请日：2007-05-31

申请人： Yasutomi Asai ,  Hiroshi Ishino

发明人： Yasutomi Asai ,  Hiroshi Ishino

IPC分类号： H01L29/94

CPC分类号： H01L24/40 ,  H01L21/6835 ,  H01L24/32 ,  H01L24/33 ,  H01L24/41 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/03003 ,  H01L2224/03013 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0603 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A semiconductor device includes: a semiconductor element having first and second surfaces, wherein the semiconductor element includes at least one electrode, which is disposed on one of the first and second surfaces; and first and second metallic layers, wherein the first metallic layer is disposed on the first surface of the semiconductor element, and wherein the second metallic layer is disposed on the second surface of the semiconductor element. The one electrode is electrically coupled with one of the first and second metallic layers, which is disposed on the one of the first and second surfaces. The one electrode is coupled with an external circuit through the one of the first and second metallic layers.

摘要翻译： 半导体器件包括：具有第一和第二表面的半导体元件，其中所述半导体元件包括设置在所述第一表面和所述第二表面中的一个上的至少一个电极; 以及第一和第二金属层，其中第一金属层设置在半导体元件的第一表面上，并且其中第二金属层设置在半导体元件的第二表面上。 一个电极与第一和第二金属层中的一个电耦合，第一和第二金属层设置在第一和第二表面之一上。 一个电极通过第一和第二金属层之一与外部电路耦合。

公开(公告)号：US6048424A

公开(公告)日：2000-04-11

申请号：US4924

申请日：1998-01-09

申请人： Yasutomi Asai ,  Takashi Nagasaka ,  Kenichi Gohara ,  Takashi Yamasaki ,  Yoshiaki Shimojo

发明人： Yasutomi Asai ,  Takashi Nagasaka ,  Kenichi Gohara ,  Takashi Yamasaki ,  Yoshiaki Shimojo

IPC分类号： H05K1/03 ,  H01L21/48 ,  H01L23/12 ,  H05K3/46 ,  B32B31/26

CPC分类号： H05K3/4629 ,  H01L21/4857 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/10378 ,  H05K3/462 ,  Y10T156/1056 ,  Y10T29/49163

摘要： Via portions are formed in a first green sheet for a first layer of a laminated substrate. Then, conductive lands are formed on a surface of the first green sheet and a wiring pattern is formed on a back face of the first green sheet to be connected to the conductive lands through the via portions. The thus formed first green sheet is joined to a second green sheet having via portions therein so that the wiring pattern of the first green sheet contacts the via portions of the second green sheet. In this case, by forming the wiring pattern on the back face of the first green sheet, lamination slippage of the wiring pattern caused by lamination of the first and second green sheets can be prevented.

摘要翻译： 通过部分形成在层压基板的第一层的第一生片中。 然后，在第一生片的表面上形成导电焊盘，并且在第一生片的背面上形成布线图案，以通过通孔部分连接到导电焊盘。 如此形成的第一生片与其中具有通孔部分的第二生片接合，使得第一生片的布线图案接触第二生片的通孔部分。 在这种情况下，通过在第一生片的背面上形成布线图案，可以防止由第一和第二生片的叠层引起的布线图案的层叠滑动。

公开(公告)号：US5731067A

公开(公告)日：1998-03-24

申请号：US663029

申请日：1996-06-07

申请人： Yasutomi Asai ,  Takashi Nagasaka

发明人： Yasutomi Asai ,  Takashi Nagasaka

IPC分类号： H01L23/367 ,  H01L23/373 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  H05K7/20 ,  B32B3/00

CPC分类号： H05K1/0207 ,  H01L23/3677 ,  H01L23/3736 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/0209 ,  H05K2203/049 ,  H05K3/4053 ,  H05K3/4629 ,  H05K3/4641 ,  Y10S428/901 ,  Y10T428/24926

摘要： A multi-layered substrate capable of lowering transient and steady heat resistances. A metal serving as a heat conductor having good heat conducting property is fitted in the uppermost insulating layer, and a power element is disposed on the fitted metal. The heat generated by the power element is conducted to the metal in the uppermost insulating layer and is radiated. The metal can be composed of a mixture of molybdenum particles or tungsten particle having a high melting point and aluminum particles.

摘要翻译： 能够降低瞬态和稳定耐热性的多层基板。 作为具有良好导热性的导热体的金属装配在最上层的绝缘层中，并且功能元件设置在配合的金属上。 由功率元件产生的热量被传导到最上层绝缘层中的金属并被辐射。 金属可以由具有高熔点的钼颗粒或钨颗粒和铝颗粒的混合物组成。

公开(公告)号：US20120223444A1

公开(公告)日：2012-09-06

申请号：US13449484

申请日：2012-04-18

申请人： Tetsuto YAMAGISHI ,  Tohru Nomura ,  Norihisa Imaizumi ,  Yasutomi Asai

发明人： Tetsuto YAMAGISHI ,  Tohru Nomura ,  Norihisa Imaizumi ,  Yasutomi Asai

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/15 ,  H01L23/315 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49506 ,  H01L23/49531 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.

摘要翻译： 电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。 树脂模具进一步密封基板的第二表面上的第二电子元件。 基板的第二表面具有从树脂模露出的部分。 第二电子元件不设置在第二表面的部分上。

公开(公告)号：US06376906B1

公开(公告)日：2002-04-23

申请号：US09021989

申请日：1998-02-11

申请人： Yasutomi Asai ,  Shinji Ota ,  Takashi Nagasaka

发明人： Yasutomi Asai ,  Shinji Ota ,  Takashi Nagasaka

IPC分类号： H01L2304

CPC分类号： H01L23/49838 ,  H01L23/49822 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a mounting structure of a flip chip IC, the flip chip IC is mounted on an alumina laminated substrate through conductive lands of the substrate and bumps of the flip chip IC. A space between the flip chip IC and the substrate is filled with resin. Further, inspection lands are provided on the substrate for inspecting the flip chip IC, and are electrically connected to the conductive lands through vias and inside wires provided in the substrate. That is, the inspection lands are connected to the conductive lands to bypath an edge portion of the resin. As a result, separation of the resin from the substrate can be prevented.

摘要翻译： 在倒装芯片IC的安装结构中，倒装芯片IC通过衬底的导电焊盘和倒装芯片IC的凸块安装在氧化铝层压衬底上。 倒装芯片IC和基板之间的空间填充有树脂。 此外，在基板上设置检查台以检查倒装芯片IC，并且通过设置在基板中的通孔和内部电线电连接到导电焊盘。 也就是说，检查台面与树脂的边缘部分连接到导电焊盘。 结果，可以防止树脂与基板分离。