公开(公告)号：US07193838B2

公开(公告)日：2007-03-20

申请号：US10744695

申请日：2003-12-23

申请人： Gregory J. Dunn ,  Remy J. Chilini ,  Robert T. Croswell ,  Timothy B. Dean ,  Claudia V. Gamboa ,  Jovica Savic

发明人： Gregory J. Dunn ,  Remy J. Chilini ,  Robert T. Croswell ,  Timothy B. Dean ,  Claudia V. Gamboa ,  Jovica Savic

IPC分类号： H01G4/30

CPC分类号： H05K1/162 ,  H05K3/025 ,  H05K3/429 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718

摘要： A dielectric circuit board foil (400, 600) includes a conductive metal foil layer (210, 660), a crystallized dielectric oxide layer (405, 655) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer (414, 664) disposed on the crystallized dielectric oxide layer, and an electrode layer (415, 665) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil (400, 600) may be adhered to a printed circuit board sub-structure (700) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (>1000 pf/mm2).

摘要翻译： 电介质电路板箔（400,600）包括导电金属箔层（210,660），邻近导电金属箔层的第一表面设置的结晶介电氧化物层（405,655），镍酸镧层（414） ，664）和基本上由设置在镍酸镧层上的一种或多种贱金属制成的电极层（415,665）。 箔（400,600）可以粘附到印刷电路板子结构（700）上，并用于经济地制造多个嵌入式电容器，包括具有大电容密度（> 1000pf / mm 2）的隔离电容器， / SUP>）。

公开(公告)号：US06872468B1

公开(公告)日：2005-03-29

申请号：US10682557

申请日：2003-10-09

申请人： Timothy B. Dean ,  Gregory J. Dunn ,  Remy J. Chelini ,  Claudia V. Gamboa

发明人： Timothy B. Dean ,  Gregory J. Dunn ,  Remy J. Chelini ,  Claudia V. Gamboa

IPC分类号： H05K1/16 ,  H05K3/02 ,  H05K3/38 ,  B21C37/02

CPC分类号： H05K1/162 ,  H05K3/025 ,  H05K3/384 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  Y10T428/12493 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/24917

摘要： In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has a an exposed surface (212) that is coated with a high temperature anti-oxidant barrier (220) and has a roughness less than 0.05 microns RMS. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the exposed surface of the conductive metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

摘要翻译： 在一个实施例中，可剥离电路板箔（200）具有通过无机剥离材料（215）粘合的金属支撑层（205）和导电金属箔层（210）。 导电金属箔层具有涂覆有高温抗氧化剂屏障（220）并具有小于0.05微米RMS的粗糙度的暴露表面（212）。 在第二实施例中，可剥离印刷电路箔（200）具有设置在导电金属箔层的暴露表面上的结晶的电介质氧化物层（405）和设置在结晶的电介质氧化物层上的电极层（415），形成 可以粘附到柔性或刚性电路板的层的介电可剥离电路板箔（400），之后金属支撑层可以被剥离，留下包括金属箔层，结晶化电介质氧化物层， 和电极层。

公开(公告)号：US07241510B2

公开(公告)日：2007-07-10

申请号：US11139056

申请日：2005-05-27

申请人： Gregory J. Dunn ,  Remy J. Chelini ,  Timothy B. Dean

发明人： Gregory J. Dunn ,  Remy J. Chelini ,  Timothy B. Dean

IPC分类号： B32B15/00

CPC分类号： H05K3/025 ,  B32B7/06 ,  B32B9/00 ,  B32B9/041 ,  B32B15/00 ,  B32B15/043 ,  B32B15/20 ,  B32B2264/102 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2307/714 ,  B32B2457/08 ,  H05K3/384 ,  H05K2201/0175 ,  H05K2203/0264 ,  Y10T428/12493 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/24917 ,  Y10T428/24926

摘要： In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

摘要翻译： 在一个实施例中，可剥离电路板箔（200）具有通过包含共沉积层（250）的无机高温释放结构（215）结合的金属支撑层（205）和导电金属箔层（210） 和金属氧化物层（260）。 共沉积层包含镍和硼，磷和铬中的一种或多种的混合物。 在第二实施例中，可剥离印刷电路箔（200）具有设置在金属箔层上的结晶化电介质氧化物层（405）和设置在结晶化电介质氧化物层上的电极层（415），形成介电剥离电路板箔 （400），其可以粘附到柔性或刚性电路板的层上，之后金属支撑层可以被剥离，留下包括金属箔层，结晶的电介质氧化物层和电极层的电容结构。

公开(公告)号：US07078796B2

公开(公告)日：2006-07-18

申请号：US10610745

申请日：2003-07-01

申请人： Gregory J. Dunn ,  Owen R. Fay ,  Timothy B. Dean ,  Terance Blake ,  Remy J. Chelini ,  William H. Lytle ,  George A. Strumberger

发明人： Gregory J. Dunn ,  Owen R. Fay ,  Timothy B. Dean ,  Terance Blake ,  Remy J. Chelini ,  William H. Lytle ,  George A. Strumberger

IPC分类号： H01L23/48

CPC分类号： H01L24/12 ,  G01L19/0069 ,  G01L19/147 ,  H01L23/498 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/85013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/00012

摘要： The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.

摘要翻译： 本发明提供了一种具有耐腐蚀的封盖铜焊盘的集成器件。 封装的铜键合焊盘包括半导体衬底上的至少一个铜焊盘。 包含浸渍钯，无电解钴或浸渍铯中的一种的活化层设置在铜键合焊盘上。 化学镀镍 - 硼合金的第一中间层设置在活化层上。 在第一中间层上设置包含非电解镍或无电解钯中的一种的第二中间层，在第二中间层上设置浸金层。 还公开了封盖铜键合焊盘和形成封盖铜键合焊盘的方法。

公开(公告)号：US20070278676A1

公开(公告)日：2007-12-06

申请号：US11422233

申请日：2006-06-05

申请人： Timothy B. Dean ,  Bruce C. Deemer ,  Daniel T. Rooney

发明人： Timothy B. Dean ,  Bruce C. Deemer ,  Daniel T. Rooney

IPC分类号： H01L23/48 ,  H05K1/16

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49716 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a bottom surface (240) of an inner portion (230) of the set of leads is exposed at a peripheral region (235) of the inner portion, cutting (310) approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting (320) the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

摘要翻译： 重塑塑料封装集成电路管芯（100）的方法包括：研磨（305）塑料封装（205）的底侧（210）和位于研磨平面内的一组引线（110）的部分 直到所述一组引线的内部部分（230）的底表面（240）在所述内部部分的周边区域（235）处露出，所述切割（310）大致垂直于所述顶部和底部侧面以去除所述部分 塑料封装和引线组，该组引线位于该组引线的内部部分之外，并适配（320）该组引线的内部部分的底表面以进行可靠的电连接。

公开(公告)号：US07434310B2

公开(公告)日：2008-10-14

申请号：US11422233

申请日：2006-06-05

申请人： Timothy B. Dean ,  Bruce C. Deemer ,  Daniel T. Rooney

发明人： Timothy B. Dean ,  Bruce C. Deemer ,  Daniel T. Rooney

IPC分类号： H05K3/02

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49716 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a bottom surface (240) of an inner portion (230) of the set of leads is exposed at a peripheral region (235) of the inner portion, cutting (310) approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting (320) the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.

摘要翻译： 重塑塑料封装集成电路管芯（100）的方法包括：研磨（305）塑料封装（205）的底侧（210）和位于研磨平面内的一组引线（110）的部分 直到所述一组引线的内部部分（230）的底表面（240）在所述内部部分的周边区域（235）处露出，所述切割（310）大致垂直于所述顶部和底部侧面以去除所述部分 塑料封装和引线组，该组引线位于该组引线的内部部分之外，并适配（320）该组引线的内部部分的底表面以进行可靠的电连接。

公开(公告)号：US06974776B2

公开(公告)日：2005-12-13

申请号：US10611546

申请日：2003-07-01

申请人： Timothy B. Dean ,  William H. Lytle

发明人： Timothy B. Dean ,  William H. Lytle

IPC分类号： C23C18/16 ,  C25D11/18 ,  H01L21/302 ,  H01L21/44 ,  H05K3/24

CPC分类号： H05K3/244 ,  C23C18/1651 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/94 ,  H01L2924/14 ,  H05K2201/10204 ,  H01L2224/03 ,  H01L2924/00

摘要： The invention provides a method of plating an integrated circuit. An activation plate is positioned adjacent to at least one integrated circuit. The integrated circuit includes a plurality of bond pads comprising a bond-pad metal, and the activation plate also comprises the bond-pad metal. A layer of electroless nickel is plated on the bond pads and the activation plate, and a layer of gold is plated over the layer of electroless nickel on the bond pads and the activation plate. An integrated circuit with bond pads plated using the activation plate, and a system for plating an integrated circuit is also disclosed.

公开(公告)号：US07390978B2

公开(公告)日：2008-06-24

申请号：US11021429

申请日：2004-12-23

申请人： Timothy B. Dean ,  Daniel T. Rooney ,  Jeffrey M. Petsinger

发明人： Timothy B. Dean ,  Daniel T. Rooney ,  Jeffrey M. Petsinger

IPC分类号： H01L23/28

CPC分类号： H05K3/284 ,  H01R43/24 ,  H05K1/117 ,  H05K3/0052 ,  H05K2201/09127 ,  H05K2201/10037 ,  H05K2201/10325

摘要： An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

摘要翻译： 包覆成型的电子组件（900,1000,1200）由一个或多个包覆模制的接口部件（300,400,500,420,1750）制成，所述接口部件可以是具有诸如扬声器或传感器之类的物理接口的电触点或电子部件。 包覆模制的界面部件具有牺牲端，在电子组件中包覆成型之后，其余的可包覆模制的界面部件被切掉，从而为包覆模制的电子组件提供了一个密封腔。