公开(公告)号：US20120228564A1

公开(公告)日：2012-09-13

申请号：US13395013

申请日：2010-09-07

申请人： Kazuhiko Hashimoto ,  Kazunori Terada ,  Masafumi Kuramoto ,  Motohisa Kitani

发明人： Kazuhiko Hashimoto ,  Kazunori Terada ,  Masafumi Kuramoto ,  Motohisa Kitani

IPC分类号： C08G69/26 ,  G02B5/26

CPC分类号： C08G69/26 ,  C08K3/22 ,  C08K5/3435 ,  C08K2003/2237 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/01322 ,  C08L77/06 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention relates to a reflector for a light-emitting device consisting of (A) an polyamide composition comprising a polyamide polymerized from (a) a dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and (b) a diamine comprising at least 50 mol % of a diamine with a branched main chain.

摘要翻译： 本发明涉及一种用于发光装置的反射器，其由（A）聚酰胺组合物组成，该聚酰胺组合物包含由（a）包含至少50摩尔％的脂环族二羧酸的二羧酸聚合的聚酰胺和（b）二胺， 至少50mol％具有支链主链的二胺。

公开(公告)号：US08883048B2

公开(公告)日：2014-11-11

申请号：US13395013

申请日：2010-09-07

申请人： Kazuhiko Hashimoto ,  Kazunori Terada ,  Masafumi Kuramoto ,  Motohisa Kitani

发明人： Kazuhiko Hashimoto ,  Kazunori Terada ,  Masafumi Kuramoto ,  Motohisa Kitani

IPC分类号： F21V9/00 ,  G02B5/02 ,  G02C7/10 ,  G02F1/361 ,  G03B11/00 ,  H01L33/60 ,  C08K5/3435 ,  F21V7/00 ,  C08G69/26 ,  C08K3/22 ,  H01L33/48

CPC分类号： C08G69/26 ,  C08K3/22 ,  C08K5/3435 ,  C08K2003/2237 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/01322 ,  C08L77/06 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention relates to a reflector for a light-emitting device consisting of (A) an polyamide composition comprising a polyamide polymerized from (a) a dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and (b) a diamine comprising at least 50 mol % of a diamine with a branched main chain.

摘要翻译： 本发明涉及一种用于发光装置的反射器，其由（A）聚酰胺组合物组成，该聚酰胺组合物包含由（a）包含至少50摩尔％的脂环族二羧酸的二羧酸聚合的聚酰胺和（b）二胺， 至少50mol％具有支链主链的二胺。

公开(公告)号：US08426879B2

公开(公告)日：2013-04-23

申请号：US11992670

申请日：2006-09-29

申请人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

发明人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An object of the present invention is to provide a light emitting device that shows high adhesion between a sealing member and a package member. A light emitting device 100 of the present invention comprises a package 20 with a recess 60 having a bottom face 20a and a side wall 20b, a light emitting element 10 mounted on the bottom face 20a of the recess 60 of the package 20, and a sealing member 40 filled in the recess 60 of the package 20, with which the light emitting element 10 is coated, wherein the package 20 contains, against the entire monomer component, from 5 to 70% by weight of potassium titanate fibers and/or wollastonite, from 10 to 50% by weight of titanium oxide, and from 15 to 85% by weight of a semiaromatic polyamide containing 20 mol % or more of an aromatic monomer, a part of the side wall 20b of the recess 60 of the package 20 has a thickness of 100 μm or less, and the sealing member 40 is made of silicone.

摘要翻译： 本发明的目的是提供一种在密封构件和包装构件之间显示高粘合性的发光装置。 本发明的发光器件100包括具有凹部60的封装20，该凹部60具有底面20a和侧壁20b，安装在封装20的凹部60的底面20a上的发光元件10和 密封构件40填充在包装20的凹部60中，发光元件10通过该凹部60被涂覆，其中包装20针对整个单体组分包含5至70重量％的钛酸钾纤维和/或硅灰石 ，10〜50重量％的二氧化钛，15〜85重量％的含有20摩尔％以上的芳香族单体的半芳族聚酰胺，包装体20的凹部60的一部分侧壁20b 厚度为100μm以下，密封部件40为硅树脂。

公开(公告)号：US20090134411A1

公开(公告)日：2009-05-28

申请号：US11992670

申请日：2006-09-29

申请人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

发明人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An object of the present invention is to provide a light emitting device that shows high adhesion between a sealing member and a package member. A light emitting device 100 of the present invention comprises a package 20 with a recess 60 having a bottom face 20a and a side wall 20b, a light emitting element 10 mounted on the bottom face 20a of the recess 60 of the package 20, and a sealing member 40 filled in the recess 60 of the package 20, with which the light emitting element 10 is coated, wherein the package 20 contains, against the entire monomer component, from 5 to 70% by weight of potassium titanate fibers and/or wollastonite, from 10 to 50% by weight of titanium oxide, and from 15 to 85% by weight of a semiaromatic polyamide containing 20 mol % or more of an aromatic monomer, a part of the side wall 20b of the recess 60 of the package 20 has a thickness of 100 μm or less, and the sealing member 40 is made of silicone.

摘要翻译： 本发明的目的是提供一种在密封构件和包装构件之间显示高粘合性的发光装置。 本发明的发光器件100包括具有凹部60的封装20，该凹部60具有底面20a和侧壁20b，安装在封装20的凹部60的底面20a上的发光元件10和 密封构件40填充在包装20的凹部60中，发光元件10通过该凹部60被涂覆，其中包装20针对整个单体组分包含5至70重量％的钛酸钾纤维和/或硅灰石 ，10〜50重量％的二氧化钛，15〜85重量％的含有20摩尔％以上的芳香族单体的半芳族聚酰胺，包装体20的凹部60的一部分侧壁20b 厚度为100μm以下，密封部件40为硅树脂。

公开(公告)号：US20100186999A1

公开(公告)日：2010-07-29

申请号：US12596339

申请日：2009-01-09

申请人： Masafumi Kuramoto ,  Satoru Ogawa ,  Katsuaki Suganuma ,  Keun-Soo Kim

发明人： Masafumi Kuramoto ,  Satoru Ogawa ,  Katsuaki Suganuma ,  Keun-Soo Kim

IPC分类号： H05K1/09 ,  B22F3/10 ,  C22C5/06 ,  B23K31/02 ,  B23K1/20

CPC分类号： H01L33/62 ,  B23K1/0008 ,  B23K1/0016 ,  B23K35/025 ,  H01B1/02 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/092 ,  Y10T29/49144 ,  H01L2924/00

摘要： An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.

摘要翻译： 本发明的目的是提供一种能够产生低电阻的导电材料的制造方法，并且是通过使用不含粘合剂的廉价且稳定的导电材料组合物获得的。 导电材料可以通过包括烧结含有平均粒径（中值粒径）为0.1μm〜15μm的银粒子和金属氧化物的第一导电材料组合物的制造方法来提供，以获得 导电材料。 导电材料也可以通过包括在氧气或臭氧或环境气氛中烧结含有平均粒径（中值粒径）为0.1μm〜15μm的银粒子的第二导电材料组合物的工序的方法 气氛中，在150℃至320℃的温度范围内，以获得导电材料。

公开(公告)号：US20060243947A1

公开(公告)日：2006-11-02

申请号：US10546905

申请日：2004-02-25

申请人： Manabu Tsumura ,  Masahito Ide ,  Katsuya Ouchi ,  Masafumi Kuramoto ,  Tomohide Miki

发明人： Manabu Tsumura ,  Masahito Ide ,  Katsuya Ouchi ,  Masafumi Kuramoto ,  Tomohide Miki

IPC分类号： C09K19/52

CPC分类号： C08G77/452 ,  C08F283/00 ,  C08F290/06 ,  C08F290/14 ,  C08G77/485 ,  C08G77/54 ,  C08K3/22 ,  C08L51/003 ,  C08L53/00 ,  C08L83/04 ,  C08L101/00 ,  H01L23/295 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/31663 ,  Y10T428/31786 ,  C08L2666/02 ,  H01L2924/00

摘要： The invention aims at providing A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components; A light-shielding paste which contains a thermosetting resin and an inorganic member as essential components; A curable composition which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member; The above curable composition which further contains (G) silica; The above curable composition which shows such a flow leveling property that when the composition is allowed to stand on a glass substrate inclined at an angle of 80 degrees at 100° C. for 1 hour, the flow-out distance is not longer than 2 cm; A light-shielding paste which comprises the above curable composition; or, A method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls and formed of a molding resin by a monolithic process with the respective ends of an external positive electrode and an external negative electrode being exposed at a predetermined distance on the aperture bottom which method comprises (1) applying a light-shielding paste to a substrate; (2) bringing the LED package aperture into close contact therewith; and (3) heating the LED package with the aperture facing upward; and thereby the light-shielding paste is allowed to spread along the package sidewalls alone. The curable composition of the invention is excellent in light-shielding ability and is highly resistant to light and, therefore, can be used as a light-shielding paste. Further, the curable composition of the invention is low in fluidity and, therefore, light-emitting diodes with the curing product formed on the LED package sidewalls alone can be obtained by using that curable composition. Furthermore, according to the method of light-shielding resin layer formation according to the invention, it is possible to efficiently apply a light-shielding paste to the LED package sidewalls alone for light-shielding resin layer formation, whereby the productivity is markedly improved.

公开(公告)号：US10090446B2

公开(公告)日：2018-10-02

申请号：US14118176

申请日：2012-05-15

申请人： Masafumi Kuramoto ,  Daisuke Iwakura ,  Kenji Ozeki ,  Tomoaki Tsuruha ,  Satoshi Okada ,  Masaki Hayashi

发明人： Masafumi Kuramoto ,  Daisuke Iwakura ,  Kenji Ozeki ,  Tomoaki Tsuruha ,  Satoshi Okada ,  Masaki Hayashi

IPC分类号： H01L33/54 ,  H01L33/52 ,  H01L23/00 ,  H01L25/075

摘要： To provide a light emitting device having high light extraction efficiency, and a method for manufacturing the light emitting device. A method for manufacturing a light emitting device (100) according to the present invention, includes: forming a sealing member (40) for sealing a light emitting element (10) on a base body (30) by dropping, the base body (30) including a conductive member (20) for connecting to the light emitting element (10), and a molding (25) integrally molded with the conductive member (20); the sealing member (10) being formed such that at least a part of a periphery of the sealing member (40) is located on an outward surface (38) of the conductive member (20) or the molding (25), the outward surface facing outward in a top view.

公开(公告)号：US08968608B2

公开(公告)日：2015-03-03

申请号：US12596339

申请日：2009-01-09

申请人： Masafumi Kuramoto ,  Satoru Ogawa ,  Katsuaki Suganuma ,  Keun-Soo Kim

发明人： Masafumi Kuramoto ,  Satoru Ogawa ,  Katsuaki Suganuma ,  Keun-Soo Kim

IPC分类号： H01B1/02 ,  H01B1/22 ,  H01L33/62 ,  H05K1/09

CPC分类号： H01L33/62 ,  B23K1/0008 ,  B23K1/0016 ,  B23K35/025 ,  H01B1/02 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/092 ,  Y10T29/49144 ,  H01L2924/00

摘要： An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.

摘要翻译： 本发明的目的是提供一种能够产生低电阻的导电材料的制造方法，并且是通过使用不含粘合剂的廉价且稳定的导电材料组合物获得的。 导电材料可以通过包括烧结含有平均粒径（中值粒径）为0.1μm〜15μm的银粒子和金属氧化物的第一导电材料组合物的制造方法来提供，以获得 导电材料。 导电材料也可以通过包括在氧气或臭氧或环境气氛中烧结含有平均粒径（中值粒径）为0.1μm〜15μm的银粒子的第二导电材料组合物的工序的方法 气氛中，在150℃至320℃的温度范围内，以获得导电材料。

公开(公告)号：US08642392B2

公开(公告)日：2014-02-04

申请号：US12691947

申请日：2010-01-22

申请人： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa

发明人： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa

IPC分类号： H01L21/44

CPC分类号： H01L33/44 ,  H01L23/08 ,  H01L23/293 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/2712 ,  H01L2224/2745 ,  H01L2224/275 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29187 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73265 ,  H01L2224/83048 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83207 ,  H01L2224/83439 ,  H01L2224/83487 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0541 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/201 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01S5/0226 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/05599

摘要： An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. A method for producing a semiconductor device in which silver or silver oxide provided on a surface of a base and silver or silver oxide provided on a surface of a semiconductor element are bonded, includes the steps of arranging a semiconductor element on a base such that silver or silver oxide provided on a surface of the semiconductor element is in contact with silver or silver oxide provided on a surface of the base, temporarily bonding the semiconductor element and the base by applying a pressure or an ultrasonic vibration to the semiconductor element or the base, and permanently bonding the semiconductor element and the base by applying heat having a temperature of 150 to 900° C. to the semiconductor device and the base.

摘要翻译： 本发明的目的是提供一种用于制造具有低电阻的导电构件的方法，并且使用不含粘合剂的低成本稳定的导电材料组合物获得导电构件。 一种制造半导体器件的方法，其中设置在基底表面上的银或氧化银和设置在半导体元件的表面上的银或银氧化物结合，包括以下步骤：将半导体元件布置在基底上，使得银 或设置在半导体元件的表面上的氧化银与设置在基板的表面上的银或氧化银接触，通过向半导体元件或基底施加压力或超声波振动来临时接合半导体元件和基座 并且通过向半导体器件和基底施加温度为150至900℃的热而将半导体元件和基底永久地接合。

公开(公告)号：US20110186340A1

公开(公告)日：2011-08-04

申请号：US12991843

申请日：2010-07-21

申请人： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa ,  Katsuaki Suganuma ,  Keun-Soo Kim

发明人： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa ,  Katsuaki Suganuma ,  Keun-Soo Kim

IPC分类号： H05K1/18 ,  H01B1/22

CPC分类号： H01B1/22 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/48455

摘要： The object of the present invention is to provide a method for producing a conductive material that has a low electric resistivity and that is obtained using an inexpensive and stable conductive material composition. A conductive material having a low electric resistivity can be obtained by a method including the step of heating a conductive material composition that contains at least one of a full-cured or semi-cured thermosetting resin and a thermoplastic resin, as well as silver particles. Such a conductive material is a conductive material that includes fused silver particles, and thermosetting resin fine particles that have an average particle diameter of 0.1 μm to 10 μm both inclusive and are dispersed in the fused silver particles. Further, in such a conductive material is a conductive material that includes fused silver particles, and a thermoplastic resin welded among the fused silver particles.

摘要翻译： 本发明的目的是提供一种具有低电阻率且使用廉价且稳定的导电材料组合物获得的导电材料的制造方法。 可以通过包括加热含有全固化或半固化的热固性树脂和热塑性树脂中的至少一种的导电材料组合物以及银颗粒的方法来获得具有低电阻率的导电材料。 这种导电材料是包含熔融银颗粒的导电材料和平均粒径为0.1μm至10μm的热固性树脂细颗粒，并且分散在熔融银颗粒中。 此外，这种导电材料是包含熔融银颗粒的导电材料和在熔融银颗粒之间焊接的热塑性树脂。