公开(公告)号：US06364796B1

公开(公告)日：2002-04-02

申请号：US09482223

申请日：2000-01-13

申请人： Kensuke Nakamura ,  Ryohei Adachi ,  Naosumi Tada ,  Shinji Tsuruta

发明人： Kensuke Nakamura ,  Ryohei Adachi ,  Naosumi Tada ,  Shinji Tsuruta

IPC分类号： F16H700

CPC分类号： F16H7/08 ,  F16H2007/0804 ,  F16H2007/0872

摘要： A blade-type tensioner for chain drives which is suitable for use as a tensioner on the timing chain of a motor vehicle engine. The present invention is a chain tensioner particularly suited for use in confined spaces having a blade spring element mechanically interlocked with a plastic shoe. The shoe may be of rigid filled nylon and engages the chain to be tensioned. The spring element is interlocked to the plastic shoe by having ends inserted into grooves formed in the opposite ends of the shoe. The shoe is rotatably fixed to a base by way of a pin. The groove at the fixed end of the shoe extends towards the tip of the fixed end of the shoe past the pin attachment point. The groove at the free end of the shoe extends toward the tip of the free end of the shoe past the point at which the free end of the shoe bears upon a sliding surface formed on the base.

摘要翻译： 一种用于链条驱动器的叶片式张紧器，其适合用作机动车辆发动机的正时链条上的张紧器。 本发明是一种特别适用于具有与塑料鞋机械联锁的叶片弹簧元件的密闭空间中的链条张紧器。 该鞋可以是刚性填充的尼龙并且与待张紧的链接合。 弹簧元件通过将端部插入形成在鞋的相对端中的槽中而与塑料鞋互锁。 鞋通过销可转动地固定在基座上。 鞋的固定端处的凹槽朝着穿过销连接点的鞋的固定端的尖端延伸。 鞋的自由端处的槽朝着鞋的自由端的尖端延伸穿过鞋的自由端承载在形成在底座上的滑动表面上的点。

公开(公告)号：US5803854A

公开(公告)日：1998-09-08

申请号：US813240

申请日：1997-03-07

申请人： Naosumi Tada ,  Kensuke Nakamura ,  Kazushige Yakubo ,  Yoshiyuki Ohtaka

发明人： Naosumi Tada ,  Kensuke Nakamura ,  Kazushige Yakubo ,  Yoshiyuki Ohtaka

IPC分类号： F16G13/02 ,  F16G13/04 ,  F16G13/06

CPC分类号： F16G13/04

摘要： A silent chain having multiple links each having a pair of teeth and apertures, which are connected by connecting pins inserted into the apertures. The links have an sheared link bearing surface which further reduces the wear of the sprocket tooth surface and further prevents defective bending of the silent chain. The bearing surface of the link tooth has a shear surface which may be formed by shaving or fine-blanking. The shear surface length may be at least approximately 70% or at least approximately 90% of the link thickness.

摘要翻译： 具有多个链节的无声链路，每个链路具有一对齿和孔，它们通过插入孔中的连接销连接。 连杆具有剪切的链节承载面，其进一步减小链轮齿面的磨损，并进一步防止无声链的有缺陷的弯曲。 连杆齿的轴承表面具有剪切面，该剪切表面可以通过剃刮或精细冲裁而形成。 剪切表面长度可以为链节厚度的至少约70％或至少约90％。

公开(公告)号：US06808467B2

公开(公告)日：2004-10-26

申请号：US10147710

申请日：2002-05-17

申请人： Hiroyuki Takeda ,  Shinji Tsuruta ,  Hiroyoshi Mitsuhashi ,  Sadao Kojima ,  Akira Terao ,  Kensuke Nakamura ,  Hajime Maeda ,  Masashi Yamada

发明人： Hiroyuki Takeda ,  Shinji Tsuruta ,  Hiroyoshi Mitsuhashi ,  Sadao Kojima ,  Akira Terao ,  Kensuke Nakamura ,  Hajime Maeda ,  Masashi Yamada

IPC分类号： F16H708

CPC分类号： F16H7/08 ,  F16H2007/0804 ,  F16H2007/0872

摘要： A blade tensioner of a blade tensioner system for a chain that drivingly connects a drive shaft to a driving shaft in an engine, that improves the chain-damping efficiency in a blade tensioner applied to the chain within an engine, prevents the sideways tilt of the blade tensioner during operation, in a blade tensioner applied to the chain in an engine, and provides a blade tensioner with a functionality that allows it to transversely guide a chain along the chain sliding face in a blade shoe, while maintaining the flexural deformability (i.e., the flexibility) of the blade shoe.

公开(公告)号：US20130085650A1

公开(公告)日：2013-04-04

申请号：US13701165

申请日：2011-06-06

申请人： Kensuke Nakamura ,  Noriaki Fujiki ,  Keigo Ajiro

发明人： Kensuke Nakamura ,  Noriaki Fujiki ,  Keigo Ajiro

IPC分类号： B60T8/17 ,  B60T8/176 ,  B60T8/1755

CPC分类号： B60T8/17 ,  B60T1/10 ,  B60T8/1755 ,  B60T8/176 ,  B60T13/745 ,  B60T2270/604 ,  B60W10/08 ,  B60W10/188 ,  B60W30/18127 ,  B60W2050/0052

摘要： A vehicle brake control system includes a regenerative braking control component, a frictional braking control component, a calculating component and a controlling component. The regenerative braking control component controls a regenerative braking device to provide a regenerative braking torque. The frictional braking control component controls a frictional braking device to provide a frictional braking torque. The calculating component calculates a regenerative braking torque filter processing value based on a fluctuation frequency of the regenerative braking torque. The controlling component, during a first condition, operates a motorized power assist control device based on the regenerative braking torque filter processing value, instead of the regenerative braking torque, to moderate the frictional braking torque, such that the regenerative braking torque and the moderated frictional braking torque provide a target braking torque based on a braking operation.

摘要翻译： 车辆制动控制系统包括再生制动控制部件，摩擦制动控制部件，计算部件和控制部件。 再生制动控制部件控制再生制动装置，以提供再生制动转矩。 摩擦制动控制部件控制摩擦制动装置以提供摩擦制动转矩。 计算部件基于再生制动转矩的变动频率来计算再生制动转矩滤波处理值。 控制部件在第一状态下，基于再生制动转矩滤波器处理值而不是再生制动转矩来操作电动助力控制装置，以调节摩擦制动转矩，使得再生制动转矩和调节摩擦 制动力矩基于制动操作提供目标制动转矩。

公开(公告)号：US20080289865A1

公开(公告)日：2008-11-27

申请号：US11659948

申请日：2005-08-09

申请人： Kensuke Nakamura ,  Kazuhiro Yamazaki

发明人： Kensuke Nakamura ,  Kazuhiro Yamazaki

IPC分类号： H01G4/06 ,  H05K1/16

CPC分类号： H05K1/162 ,  H05K1/0366 ,  H05K3/002 ,  H05K3/0044 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2203/025 ,  H05K2203/0554 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

摘要： An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, “a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted” is adopted. Then as a process for manufacturing a capacitor circuit forming piece, the dielectric layer constituting material obtained above is used and a process for forming a second electrode at a position facing the first electrode is conducted.

摘要翻译： 除了提高多层印刷电路板中的嵌入式电容器电路的位置的精度的电容器电路部分之外，其目的是获得除去不需要的介电层的电介质层构成材料，电容器电路形成片等。 为了实现该目的，“制造介电层构成材料的方法的特征在于步骤a是通过在包含导体层的金属包覆电介质的一侧蚀刻导体层来形成第一电极电路的步骤 电介质层的每一侧;步骤b是用于去除在第一电极电路之间暴露的介电层以制造介电层构成材料的步骤，并且进行步骤a然后进行步骤b“。 然后，作为制造电容器电路形成件的工艺，使用上述得到的电介质层构成材料，并且在与第一电极相对的位置上形成第二电极的工艺被进行。

公开(公告)号：US20100078201A1

公开(公告)日：2010-04-01

申请号：US12523320

申请日：2008-02-07

申请人： Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

发明人： Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

IPC分类号： H05K1/03 ,  B32B5/12 ,  B32B37/00

CPC分类号： H05K1/0366 ,  B32B5/024 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/12 ,  B32B27/281 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B29/005 ,  B32B29/02 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/30 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/036 ,  H05K2201/029 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/24124 ,  Y10T442/2951 ,  Y10T442/3179 ,  Y10T442/3301 ,  Y10T442/3415 ,  Y10T442/3431 ,  Y10T442/3463 ,  Y10T442/3496

摘要： There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.

摘要翻译： 提供了一种层叠体，其包括由第一纤维基材和树脂构成的第一树脂层和由第二纤维基材和树脂组成的第二树脂层，其中第一树脂层和第二树脂层被设置为 所述第一树脂层和所述第二树脂层至少部分地位于沿所述层叠体的厚度方向由所述中心线分开的分离区域中; 其中所述第一纤维基材和所述第二纤维基材中的至少一个具有弯曲区域，在所述弯曲区域中，所述纤维基材中弯曲区域是较小经纱/纬纱交叉角度小于90°的区域; 并且其中在所述弯曲区域中，由所述第一纤维基材的翘曲和所述第二纤维基材的翘曲形成的角度和由所述第一纤维基材的纬纱和所述第二纤维基材的纬纱形成的角度 以较大者为准，为2°以下。

公开(公告)号：US20080257480A1

公开(公告)日：2008-10-23

申请号：US11659973

申请日：2005-08-09

申请人： Kensuke Nakamura

发明人： Kensuke Nakamura

IPC分类号： H05K3/46 ,  H05K3/30

CPC分类号： H05K1/162 ,  H05K3/002 ,  H05K3/0044 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2203/025 ,  H05K2203/0554 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The object of the present invention is to provide: a method for manufacturing a multilayer printed wiring board which enables the dielectric layers to have excellent thickness uniformity, the capacitor circuits to have high registration accuracy and the unnecessary dielectric layer is removed as large as possible; and a multilayer printed wiring board with an embedded capacitor circuit manufactured by the method. To achieve this object, a method is employed in which a multilayer printed wiring board with an embedded capacitor circuit is manufactured through: a first-conductive-metal-layer laminating step where a dielectric layer and a first conductive metal layer are provided on both sides of a core material having base electrode circuits; an top-electrode forming step where the first conductive metal layer(s) locating as outer layer(s) is(are) processed into top electrodes and the dielectric layer(s) in the area other than those of circuit portions is(are) exposed; a dielectric-layer removing step where the exposed dielectric layer(s), which is(are) in the area other than those of circuit portions, is(are) removed; a second-conductive-metal laminating step where the gaps among the top electrodes are filled in and an insulating layer and a second conductive metal layer are provided on the top electrodes; and an outer layer circuit forming step where the second conductive metal layer(s) is(are) processed into outer layer circuits.

摘要翻译： 本发明的目的是提供一种多层印刷电路板的制造方法，其能够使电介质层具有优异的厚度均匀性，使具有高配准精度的电容器电路和去除尽可能大的不需要的介电层; 以及通过该方法制造的具有嵌入式电容器电路的多层印刷线路板。 为了实现这个目的，采用了一种方法，其中通过以下方式制造具有嵌入式电容器电路的多层印刷线路板：第一导电金属层层压步骤，其两侧设置介电层和第一导电金属层 具有基极电极的芯材料; 其中将第一导电金属层定位为外层的顶电极形成步骤被处理成顶电极，并且除了电路部分之外的区域中的介电层是（） 裸露; 介质层去除步骤，其中除去除了电路部分以外的区域中的暴露介电层; 第二导电金属层叠步骤，其中顶部电极之间的间隙被填充，并且在顶部电极上设置绝缘层和第二导电金属层; 以及外层电路形成步骤，其中将第二导电金属层加工成外层电路。

公开(公告)号：US06620067B1

公开(公告)日：2003-09-16

申请号：US09868896

申请日：2001-07-06

申请人： Kensuke Nakamura ,  Sadao Kojima ,  Atsushi Tanaka ,  Shinji Yamada ,  Hajime Maeda ,  Hidehiko Kamiyama

发明人： Kensuke Nakamura ,  Sadao Kojima ,  Atsushi Tanaka ,  Shinji Yamada ,  Hajime Maeda ,  Hidehiko Kamiyama

IPC分类号： F16H708

CPC分类号： F01L1/024 ,  F16H7/18 ,  F16H2007/0804 ,  F16H2007/0872

摘要： A tensioner device 14 for an engine 1 comprises a support member 16, a blade shoe 17 coming into sliding contact with a timing chain 11 having a base end section 17a held by a cylinder block 3 and a tip end section 17b supported by the support member 16, and a leaf spring 18 held by the blade shoe 1 for pressing the blade shoe 17 against the timing chain 11 elastically. The support member 16 is formed integrally with the cylinder block 3. The tip end section 17b comes into sliding contact with a guide surface 16a formed on the support member 16 to be supported.

摘要翻译： 用于发动机1的张紧装置14包括支撑构件16，与具有由气缸体3保持的基端部17a的正时链11滑动接触的叶片靴17和由支撑构件支撑的前端部17b 由叶片1保持的板簧18，用于将刀片17弹性地压靠正时链11。 支撑构件16与气缸体3一体地形成。前端部17b与形成在支撑构件16上的引导面16a滑动接触以被支撑。

公开(公告)号：US5788381A

公开(公告)日：1998-08-04

申请号：US795276

申请日：1997-02-04

申请人： Masakazu Yamazaki ,  Fuminori Kawashima ,  Chiharu Shimizu ,  Kensuke Nakamura ,  Nobuyoshi Takamatsu ,  Toru Kano ,  Tomoki Okita ,  Hideo Ueshima

发明人： Masakazu Yamazaki ,  Fuminori Kawashima ,  Chiharu Shimizu ,  Kensuke Nakamura ,  Nobuyoshi Takamatsu ,  Toru Kano ,  Tomoki Okita ,  Hideo Ueshima

IPC分类号： F01M1/06 ,  F01M1/02 ,  F02B67/00 ,  F16C33/10 ,  F16F15/26 ,  F16C33/66

CPC分类号： F16C33/1085 ,  F01M1/02 ,  F02B67/00 ,  F16F15/265 ,  F01M2001/0276

摘要： An engine has two balancer shafts supported on two bearing bushings which are made of the same material and mounted to a balancer holder. Lubricating oil passages for supplying oil to the bearing bushings are defined offset upwards from the centers O of the bearing bushings and by a distance .delta.. Each of the bearing bushings has two oil bores having a center angle .theta. other than 180.degree.. The two oil bores in the bearing bushing of one balancer shaft communicate with the lubricating oil passage, and one of the oil bores in the bearing bushing of another balancer shaft communicates with the lubricating oil passage, while the other oil bore of that another balancer shaft is closed to keep out of the lubricating oil passage. Thus, downstream ends of the lubricating oil passages for supplying the oil to the bearing bushings of the plurality of rotary shafts can be closed without use of a special closing member such as a blind plug.

摘要翻译： 发动机具有两个平衡轴，该平衡轴支撑在由相同材料制成并安装到平衡器支架上的两个轴承衬套上。 用于向轴承衬套供油的润滑油通道被限定为从轴承衬套的中心O向上偏移并且距离增量。 每个轴承衬套具有两个中心角度θ为180°的油孔。 一个平衡轴的轴承衬套中的两个油孔与润滑油通道连通，另一个平衡轴的轴承衬套中的一个油孔与润滑油通道连通，另一个平衡轴的另一个油孔 关闭以防止润滑油通道。 因此，用于将油供给到多个旋转轴的轴承衬套的润滑油通道的下游端可以不使用诸如盲塞等特殊的关闭构件而关闭。

公开(公告)号：US20140183758A1

公开(公告)日：2014-07-03

申请号：US14239960

申请日：2012-08-24

申请人： Kensuke Nakamura ,  Toru Meura ,  Yoji Ishimura

发明人： Kensuke Nakamura ,  Toru Meura ,  Yoji Ishimura

IPC分类号： H01L25/00 ,  H01L25/065

CPC分类号： H01L25/50 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7598 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81209 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2224/05552

摘要： A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.

摘要翻译： 提供一种制造半导体器件的方法，其能够提高生产率和可靠性。 制造本发明的半导体器件（1）的方法包括顺序堆叠工艺，单独的层叠体获得工艺和基材粘合工艺。 在顺序堆叠处理中，获得块堆叠体。 块状堆叠体是在未焊接的状态下层叠有半导体块（10B，12B，14B，16B）的块状堆叠体（2B）。 在半导体块（10B，12B，14B，16B）中，配置有多个半导体元件。 在各个层叠体取得工序中，获得堆叠的半导体部件的端子被焊接并且从堆叠的半导体部件单元中的块状堆叠体（2B）切断的单个层叠体（2）。