公开(公告)号：US5764129A

公开(公告)日：1998-06-09

申请号：US622468

申请日：1996-03-25

申请人： Moritaka Syouji ,  Tadashi Kitami ,  Seiichi Yamada ,  Ken Takahashi ,  Shingo Shirakawa ,  Takeo Yamazaki ,  Shigeru Tanaka ,  Shigehisa Motowaki

发明人： Moritaka Syouji ,  Tadashi Kitami ,  Seiichi Yamada ,  Ken Takahashi ,  Shingo Shirakawa ,  Takeo Yamazaki ,  Shigeru Tanaka ,  Shigehisa Motowaki

IPC分类号： C04B35/453 ,  H01C7/00 ,  H01C7/10 ,  H01C7/112 ,  H01C17/06 ,  H01H33/16 ,  H01H33/64

CPC分类号： H01C7/112 ,  H01H33/165

摘要： A ceramic resistor includes zinc oxide as a main component, and as essential components, aluminum oxide 3.0-40 mol %, magnesium oxide 2.0-40 mol %, silicon oxide 0.1-10 mol %, and at least one kind of compound 0.005-0.5 mol %, selected from a group consisting of calcium oxide, strontium oxide and barium oxide, and has a positive temperature coefficient of resistance. A neutral grounding resistor and a gas circuit breaker, each using the above-mentioned ceramic resistors, are disclosed.

摘要翻译： 陶瓷电阻器包括氧化锌作为主要成分，作为必要成分，氧化铝3.0-40摩尔％，氧化镁2.0-40摩尔％，氧化硅0.1-10摩尔％，至少一种化合物0.005-0.5 mol％，选自氧化钙，氧化锶和氧化钡，并具有正温度系数的电阻。 公开了使用上述陶瓷电阻器的中性点接地电阻器和气体断路器。

公开(公告)号：US5614138A

公开(公告)日：1997-03-25

申请号：US384954

申请日：1995-02-07

申请人： Seiichi Yamada ,  Shigeru Tanaka ,  Moritaka Shoji ,  Shigehisa Motowaki ,  Ken Takahashi ,  Shingo Shirakawa ,  Shinichi Oowada ,  Takeo Yamazaki

发明人： Seiichi Yamada ,  Shigeru Tanaka ,  Moritaka Shoji ,  Shigehisa Motowaki ,  Ken Takahashi ,  Shingo Shirakawa ,  Shinichi Oowada ,  Takeo Yamazaki

IPC分类号： H01C7/112 ,  H01B1/06

CPC分类号： H01C7/112

摘要： A mixture of calcinated metallic oxides are mixed with ZnO and SiO.sub.2, granulated, compacted and then sintered to form a nonlinear resistor. After sintering, the formed ZnO resistor elements are heat treated, preferably in a two-step heat treating process.

摘要翻译： 将煅烧的金属氧化物的混合物与ZnO和SiO 2混合，造粒，压实，然后烧结形成非线性电阻。 在烧结之后，形成的ZnO电阻元件被热处理，优选在两步热处理过程中。

公开(公告)号：US5610570A

公开(公告)日：1997-03-11

申请号：US547793

申请日：1995-10-25

申请人： Seiich Yamada ,  Shigeru Tanaka ,  Moritaka Syouji ,  Shigehisa Motowaki ,  Ken Takahashi ,  Shingo Shirakawa ,  Kunihiro Maeda

发明人： Seiich Yamada ,  Shigeru Tanaka ,  Moritaka Syouji ,  Shigehisa Motowaki ,  Ken Takahashi ,  Shingo Shirakawa ,  Kunihiro Maeda

IPC分类号： H01C7/10 ,  H01B1/08 ,  H01C7/102 ,  H01C7/12

CPC分类号： H01C7/102 ,  Y10T29/49082

摘要： A non-linear resistor having a high impulse withstanding ability is obtained by directly applying a crystallized glass to the side surface of a sintered body of a ZnO element, and then bake-attaching the crystallized glass to the side surface of the ZnO element by heat treatment. Since the impulse withstanding ability is improved by applying the crystallized glass as the side surface high-resistivity layer of the voltage non-linear resistor, the performance and reliability of an arrester including the resistor is improved.

摘要翻译： 通过在ZnO元件的烧结体的侧面直接施加结晶化玻璃，通过加热将结晶化玻璃与ZnO元件的侧面进行烘烤附着，得到具有高脉冲耐受能力的非线性电阻体 治疗。 由于通过使用结晶化玻璃作为电压非线性电阻器的侧面高电阻率层来提高耐冲击能力，所以提高了包括电阻器的避雷器的性能和可靠性。

公开(公告)号：US07183650B2

公开(公告)日：2007-02-27

申请号：US10483175

申请日：2002-07-12

申请人： Osamu Shiono ,  Takao Ishikawa ,  Takashi Namekawa ,  Yasutaka Suzuki ,  Takashi Naito ,  Hiroki Yamamoto ,  Daigoro Kamoto ,  Ken Takahashi ,  Tadanori Segawa ,  Toshiya Sato ,  Takao Miwa ,  Shigehisa Motowaki

发明人： Osamu Shiono ,  Takao Ishikawa ,  Takashi Namekawa ,  Yasutaka Suzuki ,  Takashi Naito ,  Hiroki Yamamoto ,  Daigoro Kamoto ,  Ken Takahashi ,  Tadanori Segawa ,  Toshiya Sato ,  Takao Miwa ,  Shigehisa Motowaki

IPC分类号： H01L23/21 ,  H01L23/053

CPC分类号： H05K3/4061 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/426 ,  H05K2201/0116 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09981 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.

摘要翻译： 布线玻璃基板包括由玻璃形成的玻璃基板，在预定位置形成有多个孔，凸起形成为与填充孔的导电材料连接，形成在与形成有凸点的表面相对的表面上的布线 并且将与间隔不同的间隔布置的多个连接端子电连接到导电材料上。 导电材料的形状是多孔的，并且多孔电极通过锚固效应结合到孔的内壁表面，以增加玻璃基底的强度。

公开(公告)号：US07535106B2

公开(公告)日：2009-05-19

申请号：US11657280

申请日：2007-01-24

申请人： Osamu Shiono ,  Takao Ishikawa ,  Takashi Namekawa ,  Yasutaka Suzuki ,  Takashi Naito ,  Hiroki Yamamoto ,  Daigorou Kamoto ,  Ken Takahashi ,  Tadanori Segawa ,  Toshiya Satoh ,  Takao Miwa ,  Shigehisa Motowaki

发明人： Osamu Shiono ,  Takao Ishikawa ,  Takashi Namekawa ,  Yasutaka Suzuki ,  Takashi Naito ,  Hiroki Yamamoto ,  Daigorou Kamoto ,  Ken Takahashi ,  Tadanori Segawa ,  Toshiya Satoh ,  Takao Miwa ,  Shigehisa Motowaki

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/4061 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/426 ,  H05K2201/0116 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09981 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.

摘要翻译： 布线玻璃基板包括由玻璃形成的玻璃基板，在预定位置形成有多个孔，凸起形成为与填充孔的导电材料连接，形成在与形成有凸点的表面相对的表面上的布线 并且将与间隔不同的间隔布置的多个连接端子电连接到导电材料上。 导电材料的形状是多孔的，并且多孔电极通过锚固效应结合到孔的内壁表面，以增加玻璃基底的强度。

公开(公告)号：US20070114653A1

公开(公告)日：2007-05-24

申请号：US11657280

申请日：2007-01-24

申请人： Osamu Shiono ,  Takao Ishikawa ,  Takashi Namekawa ,  Yasutaka Suzuki ,  Takashi Naito ,  Hiroki Yamamoto ,  Daigoro Kamoto ,  Ken Takahashi ,  Tadanori Segawa ,  Toshiya Sato ,  Takao Miwa ,  Shigehisa Motowaki

发明人： Osamu Shiono ,  Takao Ishikawa ,  Takashi Namekawa ,  Yasutaka Suzuki ,  Takashi Naito ,  Hiroki Yamamoto ,  Daigoro Kamoto ,  Ken Takahashi ,  Tadanori Segawa ,  Toshiya Sato ,  Takao Miwa ,  Shigehisa Motowaki

IPC分类号： H01L23/12

CPC分类号： H05K3/4061 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/426 ,  H05K2201/0116 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09981 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.

公开(公告)号：US07520742B2

公开(公告)日：2009-04-21

申请号：US10801579

申请日：2004-03-17

申请人： Shigehisa Motowaki ,  Akihiro Miyauchi ,  Masahiko Ogino ,  Kosuke Kuwabara

发明人： Shigehisa Motowaki ,  Akihiro Miyauchi ,  Masahiko Ogino ,  Kosuke Kuwabara

IPC分类号： B29C33/00 ,  B29C59/02

CPC分类号： B82Y10/00 ,  B29C33/58 ,  B29C37/0067 ,  B29C37/0075 ,  B29C59/022 ,  B29C59/025 ,  B29C2059/023 ,  B82Y40/00 ,  G03F7/0002 ,  G11B5/74 ,  G11B5/743 ,  G11B5/82 ,  G11B5/84 ,  H05K3/12 ,  Y10S977/887

摘要： A pillar with a high aspect ratio is transferred by a nanoprinting method. In order to form a fine structure on a substrate, a nanoprinting apparatus heats and presses the substrate and a mold with a fine concave-convex pattern formed thereon, the mold having a mechanism for transferring and applying a mold-releasing agent. A method for transferring a fine structure using the aforementioned nanoprinting apparatus.

摘要翻译： 通过纳米印刷法转移具有高纵横比的支柱。 为了在基板上形成精细结构，纳米印刷装置加热并压制基板和形成有细凹凸图案的模具，该模具具有用于转印和施加脱模剂的机构。 使用上述纳米印刷装置转印精细结构的方法。

公开(公告)号：US06840833B1

公开(公告)日：2005-01-11

申请号：US09890302

申请日：2000-01-28

申请人： Shigehisa Motowaki ,  Tomohiko Murase ,  Michifumi Kawai ,  Ryohei Sato ,  Yasuhiro Matsuoka ,  Yoshihiro Kato ,  Takashi Naito ,  Yasutaka Suzuki

发明人： Shigehisa Motowaki ,  Tomohiko Murase ,  Michifumi Kawai ,  Ryohei Sato ,  Yasuhiro Matsuoka ,  Yoshihiro Kato ,  Takashi Naito ,  Yasutaka Suzuki

IPC分类号： H01J9/26 ,  H01J11/46 ,  H01J11/48 ,  H01J11/54 ,  H01J17/18

CPC分类号： H01J9/261 ,  H01J2217/49 ,  H01J2217/49264

摘要： In the manufacture of a gas discharge type display panel, by applying a sealing operation along with an exhausting operation, the sealing glass 14 is broken down by a pressure difference between the inside and outside of the panel, and thus, the clearance gap between the substrates can be controlled as desired. In addition, the gaseous component that is unnecessary for the discharge operation is exhausted by setting the temperature of the amorphous sealing glass to exceed its softening-point and be no more than its working point. In the structure of the gas discharge type display panel, a protruding portion having a radius of curvature between 0.1 mm and 1 mm is formed on the sealing glass to reduce the dispersion in the thickness direction of the sealing glass, or the cross-sectional shape of the sealing glass is made convex both at its inside end part and its outside end part.

摘要翻译： 在气体放电型显示面板的制造中，通过与排气操作一起进行密封操作，密封玻璃14被面板的内部和外部之间的压力差分解，因此， 可以根据需要控制衬底。 此外，通过将非晶密封玻璃的温度设定为超过其软化点而不超过其工作点，排出不需要的气体成分被排出。 在气体放电型显示面板的结构中，在密封玻璃上形成具有0.1mm〜1mm的曲率半径的突出部，以减小密封玻璃的厚度方向的分散或横截面形状 密封玻璃的内端部和外端部均形成为凸状。

公开(公告)号：US07964975B2

公开(公告)日：2011-06-21

申请号：US12320559

申请日：2009-01-29

申请人： Ryoichi Kajiwara ,  Shigehisa Motowaki ,  Kazutoshi Itou ,  Hiroshi Hozoji

发明人： Ryoichi Kajiwara ,  Shigehisa Motowaki ,  Kazutoshi Itou ,  Hiroshi Hozoji

IPC分类号： H01L23/48 ,  B05D3/02

CPC分类号： H01L23/49582 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2203/121 ,  Y10T428/12493 ,  Y10T428/12868 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012

摘要： A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2) baking the applied solution in an oxidizing atmosphere to form, on the surface of the metal base, a coating containing an oxide of the metal of the organometallic compound; (3) providing the polymer resin on the coating; and (4) hardening the polymer resin to provide the metal-base/polymer-resin bonded structured body.

摘要翻译： 根据本发明的金属基/聚合物 - 树脂结合结构体的制造方法包括以下步骤：（1）向金属基材的表面施加含有可在350℃分解的有机金属化合物的溶液。 或更低; （2）在氧化气氛中烘烤涂布的溶液，在金属基材的表面形成含有有机金属化合物的金属的氧化物的涂层; （3）在涂层上提供聚合物树脂; 和（4）硬化聚合物树脂以提供金属基/聚合物 - 树脂结合体。

公开(公告)号：US07341441B2

公开(公告)日：2008-03-11

申请号：US10804101

申请日：2004-03-19

申请人： Masahiko Ogino ,  Akihiro Miyauchi ,  Shigehisa Motowaki ,  Kosuke Kuwabara

发明人： Masahiko Ogino ,  Akihiro Miyauchi ,  Shigehisa Motowaki ,  Kosuke Kuwabara

IPC分类号： B29C59/04

CPC分类号： B29C59/002 ,  B29C59/022 ,  B29C59/026 ,  B29C2035/0827 ,  B29C2059/023 ,  B29K2033/12 ,  Y10S977/887

摘要： Provided is a nanoprint apparatus in which a substrate and a mold formed on its surface with fine concavities and convexities are heated and pressed with each other through the intermediary of a buffer member interposed therebetwen, including a mechanism for successively replacing the buffer member with new one at each time which the mold and the substate are heated and pressed, thereby it is possible to form a fine structure on the substrate.

摘要翻译： 本发明提供一种纳米打印装置，其中在其表面上形成有细小凹凸的基板和模具通过介于其间的缓冲构件相互加热和相互压制，包括用于将新的缓冲构件连续更换的机构 在模具和基底被加热和压制的每一次，从而可以在基底上形成精细的结构。