公开(公告)号：US08269356B2

公开(公告)日：2012-09-18

申请号：US12973410

申请日：2010-12-20

申请人： Rajendra D. Pendse ,  Byung Joon Han ,  Hun Teak Lee

发明人： Rajendra D. Pendse ,  Byung Joon Han ,  Hun Teak Lee

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/13 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48458 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/4554

摘要： A semiconductor package has a semiconductor die disposed on a substrate. A bond wire is connected between a first bonding site on the semiconductor die and a second bonding site on the substrate. The first bonding site is a die bond pad; the second bonding site is a stitch bond. The second bonding site has a bond finger formed on the substrate, a conductive layer in direct physical contact with the bond finger, and a bond stud coupled to the bond wire and in direct physical contact with the conductive layer to conduct an electrical signal from the semiconductor die to the bond finger. The bond finger is made of copper. The conductive layer is made of copper or gold. The bond stud is made of gold and overlies a side portion and top portion of the copper layer.

摘要翻译： 半导体封装具有设置在基板上的半导体管芯。 接合线连接在半导体管芯上的第一接合部位和基板上的第二接合部位之间。 第一个结合位置是一个管芯焊盘; 第二粘结部位是针迹。 第二结合部位具有形成在基板上的粘结指状物，与粘结指状物直接物理接触的导电层和耦合到接合线的接合柱，并与导电层直接物理接触以传导电信号 半导体裸片粘到手指上。 键指由铜制成。 导电层由铜或金制成。 接合柱由金制成，并覆盖铜层的侧部和顶部。

公开(公告)号：US20160300799A1

公开(公告)日：2016-10-13

申请号：US15091049

申请日：2016-04-05

申请人： Byung Joon Han ,  Il Kwon Shim ,  KyoungHee Park ,  Yaojian Lin ,  KyoWang Koo ,  In Sang Yoon ,  SeungYong Chai ,  SungWon Cho ,  SungSoo Kim ,  Hun Teak Lee ,  DeokKyung Yang

发明人： Byung Joon Han ,  Il Kwon Shim ,  KyoungHee Park ,  Yaojian Lin ,  KyoWang Koo ,  In Sang Yoon ,  SeungYong Chai ,  SungWon Cho ,  SungSoo Kim ,  Hun Teak Lee ,  DeokKyung Yang

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/486 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L2221/68327 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/141 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/01029 ,  H01L2224/81

摘要： An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

摘要翻译： 集成电路封装系统及其制造方法包括：衬底，其具有在衬底顶侧，衬底底侧和垂直侧之间的内部电路; 耦合到所述内部电路的集成电路; 直接形成在集成电路和基板的基板顶侧上的模制封装体; 以及直接施加在模制封装主体，垂直侧上并且在衬底底侧下方连接到内部电路的导电保形屏蔽结构。

公开(公告)号：US09693455B1

公开(公告)日：2017-06-27

申请号：US14227346

申请日：2014-03-27

申请人： Seong Won Park ,  Hun Teak Lee ,  WoonJae Beak ,  MinJung Kim ,  ChangHwan Kim ,  ByungHyun Kwak ,  GwangTae Kim ,  HeeSoo Lee

发明人： Seong Won Park ,  Hun Teak Lee ,  WoonJae Beak ,  MinJung Kim ,  ChangHwan Kim ,  ByungHyun Kwak ,  GwangTae Kim ,  HeeSoo Lee

IPC分类号： H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H05K1/09 ,  H05K1/18 ,  H05K1/14 ,  H05K3/32 ,  H05K3/46

CPC分类号： H05K1/112 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/09 ,  H05K1/113 ,  H05K1/14 ,  H05K1/18 ,  H05K1/186 ,  H05K3/32 ,  H05K3/36 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/46 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/04 ,  H05K2203/061 ,  H05K2203/0733

摘要： A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.

公开(公告)号：US07759783B2

公开(公告)日：2010-07-20

申请号：US11608123

申请日：2006-12-07

申请人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

发明人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

IPC分类号： H01L23/538 ,  H01L23/02 ,  H01L23/495 ,  H01L23/522 ,  H01L23/52 ,  H01L25/065 ,  H01L23/28 ,  H01L23/31 ,  H05K7/00

CPC分类号： H01L25/03 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.

摘要翻译： 一种集成电路封装系统，包括：提供包括第一引线指系统和第二引线指系统的电互连系统; 在第一引线指系统和第二引指系统之间的第一器件上堆叠第二器件; 将所述第二装置连接到具有凸块接合的所述第二引线指系统; 在第二设备上堆叠虚拟设备; 以及用引线键将所述第一装置连接到所述第一引线指系统。

公开(公告)号：US07731078B2

公开(公告)日：2010-06-08

申请号：US11162617

申请日：2005-09-16

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

IPC分类号： B23K31/00 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package system includes providing a die having a plurality of contact pads. A leadframe is formed having a plurality of lead fingers with the plurality of lead fingers having a fine pitch and each having a substantially trapezoidal cross-section. A plurality of bumps is formed on the plurality of lead fingers, the plurality of bumps are on the tops and extend down the sides of the plurality of lead fingers. A plurality of bond wires is attached to the plurality of contact pads and to the plurality of bumps. An encapsulant is formed over the plurality of lead fingers, the die, and the plurality of bond wires, the encapsulant leaving lower surfaces of the plurality of lead fingers exposed.

摘要翻译： 半导体封装系统包括提供具有多个接触焊盘的管芯。 引导框架形成为具有多个引线指，多个引线指具有细间距，并且每个具有大致梯形的横截面。 多个凸点形成在多个引线指状物上，多个凸块位于顶部并且沿着多个引线指的侧面延伸。 多个接合线附接到多个接触焊盘和多个凸起。 在多个引线指，芯片和多个接合线之间形成密封剂，所述密封剂露出多个引线指的下表面。

公开(公告)号：US20080136005A1

公开(公告)日：2008-06-12

申请号：US11608826

申请日：2006-12-09

申请人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

发明人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/31 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/315 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/48479 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/48471 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.

摘要翻译： 提供了一种堆叠集成电路封装包装系统，包括形成第一外部互连; 在第一外部互连下方安装第一集成电路管芯; 在第一集成电路管芯上以不在第一外部互连上的偏移配置堆叠第二集成电路管芯; 将所述第一集成电路管芯与所述第一外部互连件连接; 并且将所述第二集成电路管芯与所述第一外部互连件封装，并且所述第一集成电路管芯部分地露出。

公开(公告)号：US08410594B2

公开(公告)日：2013-04-02

申请号：US11330930

申请日：2006-01-11

申请人： Kwang Soon Hwang ,  Youngcheol Kim ,  Hun Teak Lee ,  Koo Hong Lee

发明人： Kwang Soon Hwang ,  Youngcheol Kim ,  Hun Teak Lee ,  Koo Hong Lee

IPC分类号： H01L23/02

CPC分类号： H01L25/18 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An inter-stacking module system is provided by mounting an integrated circuit on a first substrate, the first substrate having a first bond pad, mounting an inter-stacking module substrate over the integrated circuit, forming an inter-stacking module bonding pad on the inter-stacking module substrate, and connecting bond wires between the inter-stacking module bonding pad and the first bond pad.

摘要翻译： 通过将集成电路安装在第一基板上来提供堆叠间堆叠模块系统，第一基板具有第一接合焊盘，在集成电路上安装层间堆叠模块基板，在相互之间形成层间堆叠模块焊盘 - 堆叠模块基板，以及在堆叠间模块焊盘和第一焊盘之间的连接接合线。

公开(公告)号：US08256660B2

公开(公告)日：2012-09-04

申请号：US13053141

申请日：2011-03-21

申请人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

发明人： Hun Teak Lee ,  Jong Kook Kim ,  ChulSik Kim ,  Ki Youn Jang

IPC分类号： B23K31/00 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor package system, and method of manufacturing thereof, includes: a die having a contact pad; a lead finger having a substantially trapezoidal cross-section; a bump clamped on a top and a side of the lead finger, the bump connected to the contact pad; and an encapsulant over the lead finger and the die, the encapsulant with a bottom of the lead finger exposed.

摘要翻译： 半导体封装系统及其制造方法包括：具有接触焊盘的管芯; 具有大致梯形截面的引线指; 夹在引线指的顶部和侧面上的凸起，凸起连接到接触垫; 以及在引线指和芯片上的密封剂，具有引线指的底部的密封剂暴露。

公开(公告)号：US20080137312A1

公开(公告)日：2008-06-12

申请号：US11608123

申请日：2006-12-07

申请人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

发明人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

IPC分类号： H05K7/00

CPC分类号： H01L25/03 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.

摘要翻译： 一种集成电路封装系统，包括：提供包括第一引线指系统和第二引线指系统的电互连系统; 在第一引线指系统和第二引指系统之间的第一器件上堆叠第二器件; 将所述第二装置连接到具有凸块接合的所述第二引线指系统; 在第二设备上堆叠虚拟设备; 以及用引线键将所述第一装置连接到所述第一引线指系统。

公开(公告)号：US09385100B1

公开(公告)日：2016-07-05

申请号：US14659905

申请日：2015-03-17

申请人： Hun Teak Lee ,  YoungChul Kim ,  Hyunll Bae ,  HeeSoo Lee ,  HeeJo Chi

发明人： Hun Teak Lee ,  YoungChul Kim ,  Hyunll Bae ,  HeeSoo Lee ,  HeeJo Chi

IPC分类号： H01L21/44 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10175 ,  H01L2224/131 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/8149 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014

摘要： An integrated circuit packaging system, and a method of manufacture thereof, includes: an embedded trace substrate having bonding sites and traces embedded in a base material, an insulation layer on the traces, the insulation layer having a top surface coplanar with the top surface of the base material; and an integrated circuit die connected to the bonding sites.

摘要翻译： 一种集成电路封装系统及其制造方法，包括：嵌入迹线基板，其具有嵌入基材中的接合位置和迹线，迹线上的绝缘层，绝缘层具有与顶表面共面的顶表面 基材; 以及连接到接合位置的集成电路管芯。