公开(公告)号：US09333369B2

公开(公告)日：2016-05-10

申请号：US13503520

申请日：2010-10-22

Applicant: Robert Ivkov ,  Ananda Kumar

Inventor： Robert Ivkov ,  Ananda Kumar

IPC: A61N2/02 ,  A61B5/055 ,  A61B5/00 ,  A61N1/40 ,  G01R33/422

CPC classification number: A61N2/02 ,  A61B5/055 ,  A61B5/416 ,  A61N1/403 ,  G01R33/422

Abstract: An apparatus for exposing a region of interest of an object, animal or person to an alternating magnetic field has a source of radio-frequency electromagnetic radiation arranged to provide the alternating magnetic field in an exposure volume defined by the apparatus, and a shield arranged between the source of radio-frequency electromagnetic radiation and the exposure volume. The shield includes a material that has a sufficient thickness and arrangement to reduce power deposition to at least regions outside of the region of interest of the object, animal or person during exposure in the exposure volume.

Abstract translation: 用于将物体，动物或人的感兴趣区域暴露于交变磁场的装置具有放射频率电磁辐射源，用于在由装置限定的曝光体积中提供交变磁场，并且屏蔽层布置在 射频电磁辐射源和曝光量。 护罩包括具有足够的厚度和布置的材料，以在曝光量期间曝光期间减少对物体，动物或人的感兴趣区域外的至少区域的功能沉积。

公开(公告)号：US20120265000A1

公开(公告)日：2012-10-18

申请号：US13503520

申请日：2010-10-22

Applicant: Robert Ivkov ,  Ananda Kumar

Inventor： Robert Ivkov ,  Ananda Kumar

IPC: A61N2/02 ,  H05K9/00

CPC classification number: A61N2/02 ,  A61B5/055 ,  A61B5/416 ,  A61N1/403 ,  G01R33/422

Abstract: An apparatus for exposing a region of interest of an object, animal or person to an alternating magnetic field has a source of radio-frequency electromagnetic radiation arranged to provide the alternating magnetic field in an exposure volume defined by the apparatus, and a shield arranged between the source of radio-frequency electromagnetic radiation and the exposure volume. The shield includes a material that has a sufficient thickness and arrangement to reduce power deposition to at least regions outside of the region of interest of the object, animal or person during exposure in the exposure volume.

Abstract translation: 用于将物体，动物或人的感兴趣区域暴露于交变磁场的装置具有放射频率电磁辐射源，用于在由装置限定的曝光体积中提供交变磁场，并且屏蔽层布置在 射频电磁辐射源和曝光量。 护罩包括具有足够的厚度和布置的材料，以在曝光量期间曝光期间减少对物体，动物或人的感兴趣区域外的至少区域的功能沉积。

公开(公告)号：US07778682B2

公开(公告)日：2010-08-17

申请号：US11761561

申请日：2007-06-12

Applicant: Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

Inventor： Ananda Kumar ,  Ergin Atalar ,  Ogan Ocali

IPC: A61B5/055

CPC classification number: G01R33/287 ,  A61B5/055 ,  A61B10/0275 ,  A61B34/20 ,  A61B2034/2051 ,  A61B2090/374 ,  A61B2090/3958 ,  G01R33/34084 ,  G01R33/341 ,  G01R33/3628 ,  G01R33/3657

Abstract: Herein is disclosed a magnetic resonance imaging antenna, including an inner conductor, an outer shield slideably displaceable with respect to the inner conductor, and an insulator electrically insulating the inner conductor from the outer shield. Herein is disclosed a biopsy needle antenna, including a magnetic resonance imaging antenna, having an outer shield, and an inner conductor electrically insulated from the outer shield by a dielectric; and a biopsy needle electrically connected to the inner conductor and electrically insulated from the outer shield by the dielectric. Herein is disclosed a method of obtaining a sample with magnetic resonance imaging guidance, including providing a sampling needle magnetic resonance imaging antenna, advancing the antenna to a structure from which the sample is to be taken, detecting magnetic resonance data by the antenna, and coupling the sample to the antenna.

Abstract translation: 这里公开了一种磁共振成像天线，其包括内部导体，可相对于内部导体可滑动地移位的外部屏蔽，以及将内部导体与外部屏蔽电绝缘的绝缘体。 本文公开了一种活检针状天线，包括具有外屏蔽的磁共振成像天线和通过电介质与外屏蔽电绝缘的内导体; 以及活组织检查针，其电连接到所述内部导体并且通过所述电介质与所述外部屏蔽层电绝缘。 本文公开了一种获得具有磁共振成像引导的样本的方法，包括提供采样针磁共振成像天线，将天线推进到要从其获取样本的结构，通过天线检测磁共振数据，以及耦合 样品到天线。

公开(公告)号：US20050045585A1

公开(公告)日：2005-03-03

申请号：US10841382

申请日：2004-05-07

Applicant: Gang Zhang ,  Adam Cohen ,  Michael Lockard ,  Ananda Kumar ,  Ezekiel Kruglick ,  Kieun Kim

Inventor： Gang Zhang ,  Adam Cohen ,  Michael Lockard ,  Ananda Kumar ,  Ezekiel Kruglick ,  Kieun Kim

IPC: C25D1/00 ,  C25D5/02 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  C25D5/50 ,  H01L21/288 ,  H01L21/768 ,  H05K3/24 ,  C23F1/00

CPC classification number: C25D5/50 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  H01L21/2885 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

Abstract: Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

公开(公告)号：US07816918B2

公开(公告)日：2010-10-19

申请号：US11807108

申请日：2007-05-24

Applicant: Paul A. Bottomley ,  Ananda Kumar

Inventor： Paul A. Bottomley ,  Ananda Kumar

IPC: G01V3/00

CPC classification number: G01R33/3415 ,  G01R33/3678

Abstract: Featured is a device for NMR or MRI signals from excited nuclei as well as related apparatus, systems and methods. The device includes a strip array antenna including one or more conductor and N reactive tuning components, where N is an integer ≧1 at least one of the N reactive components is electrically coupled to each of the one or more conductors as well as to ground/virtual ground. The apparent electrical length of the conductors is tuned with the reactive tuning components so it is equal to be about nλ/4, where n is an integer ≧1 and λ is the wavelength of the signal to be detected. The length of the strip also is such as to be substantially in the approximate range of 1.3 times the depth of interest. The strip conductors are also combined with loop coils to form quadrature detectors.

Abstract translation: 特色是用于激发核的NMR或MRI信号以及相关设备，系统和方法的设备。 该装置包括带状阵列天线，其包括一个或多个导体和N个非反应调谐组件，其中N是整数≥1，N个无功分量中的至少一个电耦合到一个或多个导体中的每一个以及接地/ 虚拟地面。 导体的表观电长度用无功调谐分量进行调谐，因此等于大约nλ/ 4，其中n是整数≧1，λ是待检测信号的波长。 条的长度也基本上在感兴趣深度的1.3倍的近似范围内。 带状导体也与环形线圈组合以形成正交检测器。

公开(公告)号：US20060226015A1

公开(公告)日：2006-10-12

申请号：US11325405

申请日：2006-01-03

Applicant: Dennis Smalley ,  Adam Cohen ,  Ananda Kumar ,  Michael Lockard

Inventor： Dennis Smalley ,  Adam Cohen ,  Ananda Kumar ,  Michael Lockard

IPC: C25D5/02

CPC classification number: A61N1/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  G01R1/0483 ,  G01R1/06716 ,  G01R1/07357 ,  G01R31/2886 ,  H05K3/467 ,  H05K3/4682

Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least-portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.

Abstract translation: 用于生产多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层，包括用于提供绝缘材料的涂层的操作，所述介电材料的涂层隔离第一导电材料的至少一部分 从（1）第一导电材料的其他部分，（2）第二导电材料或（3）另一种介电材料，并且其中电介质涂层的厚度与用于形成结构的层的厚度相比较薄 。 在一些优选实施例中，每个单独层的部分被电介质材料包封，而在其它实施例中，材料的不同区域之间的边界通过电介质屏障彼此隔离。

公开(公告)号：US20050253606A1

公开(公告)日：2005-11-17

申请号：US11029169

申请日：2005-01-03

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

IPC: G01R31/02 ,  H01R12/00 ,  H01R13/187 ,  H01R24/58

CPC classification number: H01R13/187 ,  H01L24/72 ,  H01L2924/15747 ,  H01L2924/00

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

公开(公告)号：US6151203A

公开(公告)日：2000-11-21

申请号：US212000

申请日：1998-12-14

Applicant: Shamouil Shamouilian ,  Ananda Kumar ,  Arnold Kholodenko ,  Dennis S. Grimard ,  Liang Guo Wang ,  Gerhard Schneider ,  Michael G. Chafin ,  Semyon Kats ,  Alexander Veytser ,  Senh Thach

Inventor： Shamouil Shamouilian ,  Ananda Kumar ,  Arnold Kholodenko ,  Dennis S. Grimard ,  Liang Guo Wang ,  Gerhard Schneider ,  Michael G. Chafin ,  Semyon Kats ,  Alexander Veytser ,  Senh Thach

IPC: H01L21/68 ,  H01L21/683 ,  H01R13/05 ,  H02N13/00

CPC classification number: H01L21/6833 ,  H02N13/00 ,  H01R13/052

Abstract: A semiconductor wafer chuck for retaining a semiconductor wafer during semiconductor wafer processing in a semiconductor wafer processing system including a connector connecting DC chucking voltage and RF biasing power to an electrode embedded in the body of the chuck. The connector for the chuck includes two or more members joined by resilient banana connections. The connector may be adapted for use as a high temperature connector for an electrostatic chuck operated at an elevated temperature and such connector includes a thermal impedance for reducing the heat transferred from the chuck to the bottom of the connector.

Abstract translation: 一种用于在半导体晶片处理系统中保持半导体晶片的半导体晶片卡盘，该半导体晶片处理系统包括将DC夹持电压和RF偏压功率连接到嵌入在卡盘的主体中的电极的连接器。 用于卡盘的连接器包括通过弹性香蕉连接件连接的两个或多个构件。 连接器可以适用于用于在高温下操作的静电卡盘的高温连接器，并且这种连接器包括用于减少从卡盘传递到连接器底部的热量的热阻抗。

公开(公告)号：US20090015256A1

公开(公告)日：2009-01-15

申请号：US11807108

申请日：2007-05-24

Applicant: Paul A. Bottomley ,  Ananda Kumar

Inventor： Paul A. Bottomley ,  Ananda Kumar

IPC: G01R33/483

CPC classification number: G01R33/3415 ,  G01R33/3678

Abstract: Featured is a device for NMR or MRI signals from excited nuclei as well as related apparatus, systems and methods. The device includes a strip array antenna including one or more conductor and N reactive tuning components, where N is an integer ≧1 at least one of the N reactive components is electrically coupled to each of the one or more conductors as well as to ground/virtual ground. The apparent electrical length of the conductors is tuned with the reactive tuning components so it is equal to be about nλ/4, where n is an integer ≧1 and λ is the wavelength of the signal to be detected. The length of the strip also is such as to be substantially in the approximate range of 1.3 times the depth of interest. The strip conductors are also combined with loop coils to form quadrature detectors.

Abstract translation: 特色是用于激发核的NMR或MRI信号以及相关设备，系统和方法的设备。 该器件包括带状阵列天线，其包括一个或多个导体和N个无功调谐组件，其中N是整数> = 1，N个无功分量中的至少一个电耦合到一个或多个导体中的每一个以及接地 /虚拟地面。 导体的表观电长度用无功调谐分量调谐，因此它等于大约为nλ/ 4，其中n为≥1的整数，λ为待检测信号的波长。 条的长度也基本上在感兴趣深度的1.3倍的近似范围内。 带状导体也与环形线圈组合以形成正交检测器。

公开(公告)号：US20080093424A1

公开(公告)日：2008-04-24

申请号：US11929539

申请日：2007-10-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: B29C65/00 ,  B23K35/12

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.