METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
    3.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT 有权
    制造半导体发光元件的方法

    公开(公告)号:US20160027956A1

    公开(公告)日:2016-01-28

    申请号:US14774579

    申请日:2014-03-05

    IPC分类号: H01L33/00 H01L33/20 H01L33/16

    摘要: Provided are a highly reliable semiconductor light-emitting element having uniform protrusions that are arranged regularly and have the same size and a method of producing the same. The method of producing a semiconductor light-emitting element according to the present invention includes: forming a mask layer having a plurality of openings that are arranged at equal intervals along a crystal axis of a semiconductor structure layer on the surface of the semiconductor structure layer; performing a plasma treatment on the surface of the semiconductor structure layer exposed from the openings in the mask layer; removing the mask layer; and wet-etching the surface of the semiconductor structure layer to form protrusions on the surface of the semiconductor structure layer.

    摘要翻译: 提供一种高度可靠的半导体发光元件,其具有均匀排列并且具有相同尺寸的均匀突起及其制造方法。 根据本发明的半导体发光元件的制造方法包括:在半导体结构层的表面上形成具有沿半导体结构层的晶轴等间隔设置的多个开口的掩模层; 在从掩模层中的开口露出的半导体结构层的表面上进行等离子体处理; 去除掩模层; 并湿式蚀刻半导体结构层的表面以在半导体结构层的表面上形成突起。

    SEMICONDUCTOR LIGHT EMITTING ELEMENT ARRAY
    4.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING ELEMENT ARRAY 有权
    半导体发光元件阵列

    公开(公告)号:US20130221384A1

    公开(公告)日:2013-08-29

    申请号:US13779694

    申请日:2013-02-27

    IPC分类号: H01L33/44 H01L33/58

    摘要: A semiconductor light emitting element array contains: a support substrate; a plurality of semiconductor light emitting elements disposed on said support substrate, a pair of adjacent semiconductor light emitting elements being separated by street, each of the semiconductor light emitting elements including; a first electrode formed on the support substrate, a semiconductor lamination formed on the first electrode and including a stack of a first semiconductor layer having a first conductivity type, an active layer formed on the first semiconductor layer, and a second semiconductor layer formed on the active layer, and having a second conductivity type different from the first conductivity type, and a second electrode selectively formed on the second semiconductor layer of the semiconductor lamination; and connection member having electrical insulating property and optically propagating property, disposed to cover at least part of the street between a pair of adjacent semiconductor laminations.

    摘要翻译: 半导体发光元件阵列包括:支撑基板; 设置在所述支撑基板上的多个半导体发光元件,被街道隔开的一对相邻的半导体发光元件,每个所述半导体发光元件包括: 形成在所述支撑基板上的第一电极,形成在所述第一电极上并且包括具有第一导电类型的第一半导体层的叠层,形成在所述第一半导体层上的有源层和形成在所述第一半导体层上的第二半导体层的半导体层叠体 有源层,并具有不同于第一导电类型的第二导电类型,以及选择性地形成在半导体层叠体的第二半导体层上的第二电极; 以及具有电绝缘性和光学传播性质的连接构件,被设置成覆盖一对相邻半导体叠片之间的至少部分街道。

    SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME 有权
    半导体发光元件及其制造方法

    公开(公告)号:US20160204309A1

    公开(公告)日:2016-07-14

    申请号:US14910998

    申请日:2014-08-01

    IPC分类号: H01L33/22 H01L33/18 H01L33/00

    摘要: A step of forming, on a surface of a semiconductor structure layer, easily-to-be-etched portions arranged on the basis of crystal directions on the surface of the semiconductor structure layer and a step of subjecting the surface of the semiconductor structure layer to wet etching to form an uneven structure surface including a plurality of protrusions derived from a crystal structure of the semiconductor structure layer on the surface of the semiconductor structure layer are included.

    摘要翻译: 在半导体结构层的表面上形成在半导体结构层的表面上基于晶体方向配置的易于蚀刻的部分的步骤,以及将半导体结构层的表面进行 包括湿蚀刻以形成包括在半导体结构层的表面上衍生自半导体结构层的晶体结构的多个突起的不平坦结构表面。

    SEMICONDUCTOR LIGHT EMITTING APPARATUS
    8.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING APPARATUS 有权
    半导体发光装置

    公开(公告)号:US20140319455A1

    公开(公告)日:2014-10-30

    申请号:US14257610

    申请日:2014-04-21

    IPC分类号: H01L33/40 H01L33/08 H01L33/06

    摘要: A semiconductor light emitting apparatus includes semiconductor lamination of n-type layer, active layer, and p-type layer; recess penetrating the lamination from the p-type layer and exposing the n-type layer; n-side electrode formed on the n-type layer at the bottom of the recess and extending upward above the p-type layer; a p-side electrode formed on the p-type layer and having an opening surrounding the recess in plan view, the n-side electrode extending from inside to above the recess; and an insulating layer disposed between the p-side and the n-side electrodes on the p-type layer, the p-side electrode constituting a reflective electrode reflecting light incident from the active layer, the n-side electrode including a reflective electrode layer covering the opening in plan view and reflects light incident from the emission layer side, the reflective electrode layer having peripheral portion overlapping peripheral portion of the p-side electrode in plan view.

    摘要翻译: 半导体发光装置包括n型层,有源层和p型层的半导体层叠; 从p型层穿透层叠并露出n型层的凹部; n侧电极形成在凹部的底部的n型层上并在p型层上方向上延伸; p侧电极,形成在p型层上,在俯视图中具有围绕凹部的开口,n侧电极从内侧延伸到凹部的上方; 以及设置在p型层的p侧和n侧电极之间的绝缘层,p侧电极构成反射从有源层入射的光的反射电极,n侧电极包括反射电极层 在平面图中覆盖开口并且反射从发射层侧入射的光,反射电极层在平面图中具有与p侧电极的周边部分重叠的周边部分。

    SEMICONDUCTOR LIGHT EMITTING DEVICE PROVIDING GRADED BRIGHTNESS
    9.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE PROVIDING GRADED BRIGHTNESS 有权
    提供亮度亮度的半导体发光器件

    公开(公告)号:US20150129922A1

    公开(公告)日:2015-05-14

    申请号:US14600831

    申请日:2015-01-20

    发明人: Takanobu AKAGI

    IPC分类号: H01L33/40 H01L33/58 H01L33/42

    摘要: A semiconductor light emitting device includes a semiconductor lamination including a p-type semiconductor layer, an active semiconductor layer, and an n-type semiconductor layer; opposing electrode structure including a first electrode structure formed above the p-type semiconductor layer, and a second electrode structure formed above the n-type semiconductor layer; and brightness grade producing structure including a surface layer of at least one of the p-type semiconductor layer and the n-type semiconductor layer and producing brightness grade gradually changing from one edge to opposite edge of light output plane.

    摘要翻译: 半导体发光器件包括包括p型半导体层,有源半导体层和n型半导体层的半导体层叠体; 包括形成在p型半导体层上方的第一电极结构的对置电极结构和形成在n型半导体层上方的第二电极结构; 以及亮度等级的制造结构,其包括p型半导体层和n型半导体层中的至少一种的表面层,并且产生从光输出面的一个边缘到相对边缘逐渐变化的亮度等级。

    SEMICONDUCTOR LIGHT EMITTING DEVICE
    10.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
    半导体发光器件

    公开(公告)号:US20140131745A1

    公开(公告)日:2014-05-15

    申请号:US14079382

    申请日:2013-11-13

    IPC分类号: H01L33/08

    摘要: An LED device includes first and second LED elements containing a lower layer of first conductivity type, an active layer, and an upper layer of second conductivity type, wherein the second LED element has third and fourth electrodes on the lower layer, recessed portion having a side surface exposing the upper, active and lower layers, and reaching the third electrode, fifth electrode disposed on the upper layer extending on the side surface of the recessed portion, and connected with the third electrode, and groove extending from the upper layer and reaching the active layer between the third and fourth electrodes to electrically separate the third electrode from the fourth electrode.

    摘要翻译: LED器件包括第一和第二LED元件,其包含第一导电类型的下层,有源层和第二导电类型的上层,其中第二LED元件在下层具有第三和第四电极,凹部具有 侧表面暴露上层,活性层和下层,并到达第三电极,设置在上层上的第五电极,其在凹部的侧表面上延伸并与第三电极连接,并且从上层延伸并到达 第三和第四电极之间的有源层,以将第三电极与第四电极电分离。