摘要:
A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.
摘要:
The invention provides an expansive material that allows for large expansion of concrete at a material age of 2 to 7 days after pouring and permits concrete to have higher initial compressive strength and makes sure good storage stability, and a process for preparing that expansive material.The invention provides an expansive material and a process for preparing that expansive material, characterized in that clinker or pulverized clinker containing free lime, a hydraulic compound and calcium sulfate anhydrite is heat treated in a carbon dioxide gas atmosphere to form calcium carbonate in it. Preferably, the expansive material contains a particle in which the free lime, hydraulic compound, calcium sulfate anhydrite and calcium carbonate are all present; the content of calcium carbonate is 0.5 to 10% by mass; and the expansive material has a Blaine's specific surface area of 1,500 to 90,000 cm2/g. The expansive material is blended with cement into a cement composition. The preparation conditions are preferably a carbon dioxide gas flow rate of 0.01 to 0.1 L/min. and a temperature of 200 to 800° C., under which conditions there is calcium carbonate formed.
摘要:
Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
摘要:
A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.
摘要:
A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.
摘要:
A cement admixture and a cement composition having a carbonation suppressing effect and a heat-of-hydration suppressing effect are provided. A cement admixture containing one or more non-hydraulic compounds selected from the group consisting of γ-2CaO.SiO2, α-CaO.SiO2 and calcium magnesium silicate, a cement composition containing said admixture, and a carbonation suppressing method by use of said cement admixture or cement composition. According to the present invention, a remarkable carbonation suppressing effect can be obtained particularly when used in portland blast-furnace slag cement. This leads to an effective use of steelmaking slag and the like, and the load of clinker can be reduced, so that a cement composition of a low environmental load type can be attained. Further, this is suitable for cements in conformity with the EN standards, which are used in civil engineering and building industries.
摘要:
The invention provides a cement admixture that improves the ability of concrete to bring about high initial strength, works in favor of enhancing the effect on hexavalent chromium reductions, and is less likely to decrease in the effect on hexavalent chromium reductions even upon storage as well as a method for reducing hexavalent chromium. The invention is embodied as (1) A cement admixture, characterized by comprising an expanding material containing free lime, a hydraulic compound and calcium sulfate anhydrite, and a tin sulfate-containing substance; (2) The cement admixture according to (1), characterized in that the tin sulfate-containing substance is contained in an amount of 0.2 to 8 parts by mass—as calculated on a tin sulfate basis—in a total of 100 parts by mass of the expanding material and the tin sulfate-containing substance; (3) The cement admixture according to (1) or (2), characterized in that the expanding material has been treated with carbon dioxide gas to form calcium carbonate therein; (4) The cement admixture according to any one of (1) to (3), characterized in that the expanding material has been surface treated with a shrinkage reducer; (5) A cement composition, characterized by containing cement, and the cement admixture according to any one of (1) to (4); and (6) A method for reducing hexavalent chromium, characterized by use of the cement composition according to (5).
摘要:
An object of the invention is to provide an alumina fiber aggregate which, when used as a filler in various materials such as, e.g., resins, coating materials, metals, and ceramics, enables the mixtures to have reduced viscosity and thereby heightens the productivity of products containing alumina fibers, and which enables cured thermosetting resins to have a sufficiently heightened thermal conductivity.This alumina fiber aggregate, when examined by the electron microscope method, gives a frequency distribution regarding number of fibers, wherein the number of fibers having a fiber length of 50-200 μm is 70% or more (including 100%), the number of fibers having a fiber length smaller than 50 μm is 30% or less (including 0), the number of fibers of 50-100 μm is 30-50%, the number of fibers longer than 100 μm but not longer than 200 μm is 30-50%, and the number of fibers longer than 200 μm is 20% or less (including 0). The fibrous mass comprises 70-100% by mass of Al2O3 and 0-30% by mass of SiO2.
摘要翻译:本发明的目的是提供一种氧化铝纤维聚集体,当用作诸如树脂,涂料,金属和陶瓷的各种材料中的填料时,使得混合物具有降低的粘度,从而提高生产率 含有氧化铝纤维的产品,并且使固化的热固性树脂具有足够高的导热性。 当通过电子显微镜方法检查时,该氧化铝纤维聚集体给出了关于纤维数量的频率分布,其中纤维长度为50-200μm的纤维的数量为70%以上(包括100%),数量 纤维长度小于50μm的纤维为30%以下(包括0),50〜100μm的纤维数为30〜50%,长于100μm且不超过200μm的纤维数为30根 -50%,长于200μm的纤维数为20%以下(包括0)。 纤维质量包含70-100质量%的Al 2 O 3和0〜30质量%的SiO 2。
摘要:
A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.
摘要:
A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.