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公开(公告)号：US20160143157A1
公开(公告)日：2016-05-19
申请号：US15004395
申请日：2016-01-22
发明人： Yi-Li Hsiao , Su-Chun Yang , Chih-Hang Tung , Da-Yuan Shih , Chen-Hua Yu
IPC分类号： H05K3/42
CPC分类号： H05K3/422 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/43 , H01L24/45 , H01L24/742 , H01L24/745 , H01L2224/0401 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13016 , H01L2224/13147 , H01L2224/13562 , H01L2224/13578 , H01L2224/13644 , H01L2224/13655 , H01L2224/43125 , H01L2224/45147 , H01L2224/4556 , H01L2224/45578 , H01L2224/45644 , H01L2224/45655 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/742 , H01L2224/745 , H05K3/4015 , H05K2201/10318 , Y10T29/49208 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , Y10T29/49222 , Y10T29/49149
摘要： A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
摘要翻译： 一种方法包括形成多个金属柱。 多个金属柱相互连接以通过在多个金属柱中的相邻金属柱之间的弱部分形成金属柱。 弱部包括与多个金属柱相同的金属。 多个金属柱中的每一个的大部分与多个金属柱中的相应的相邻的金属柱分离。 多个金属柱中的每一个的端部镀有金属。 多个金属柱设置在金属后储存器中。 该方法还包括从金属柱储存器中取出一个金属柱，并将金属柱中的一个接合在金属垫上。
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公开(公告)号：US20160118351A1
公开(公告)日：2016-04-28
申请号：US14987491
申请日：2016-01-04
发明人： Chen-Hua Yu , Da-Yuan Shih
IPC分类号： H01L23/00
CPC分类号： H01L23/562 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/81 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/0347 , H01L2224/0361 , H01L2224/0401 , H01L2224/05012 , H01L2224/05013 , H01L2224/05014 , H01L2224/05015 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05583 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/1131 , H01L2224/1134 , H01L2224/114 , H01L2224/1145 , H01L2224/1146 , H01L2224/11462 , H01L2224/1147 , H01L2224/1161 , H01L2224/11616 , H01L2224/11825 , H01L2224/11849 , H01L2224/13011 , H01L2224/13012 , H01L2224/13014 , H01L2224/13076 , H01L2224/13078 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/13671 , H01L2224/13672 , H01L2224/1601 , H01L2224/16237 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/81191 , H01L2224/81193 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81815 , H01L2924/15787 , H01L2924/3512 , H01L2924/00014 , H01L2924/01029 , H01L2924/01074 , H01L2924/00012 , H01L2224/10125 , H01L2224/10155 , H01L2924/00
摘要： A system and method for preventing cracks is provided. An embodiment comprises placing crack stoppers into a connection between a semiconductor die and a substrate. The crack stoppers may be in the shape of hollow or solid cylinders and may be placed so as to prevent any cracks from propagating through the crack stoppers.
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公开(公告)号：US20140263583A1
公开(公告)日：2014-09-18
申请号：US13866858
申请日：2013-04-19
发明人： Yi-Li Hsiao , Da-Yuan Shih , Chih-Hang Tung , Chen-Hua Yu
IPC分类号： H05K13/04
CPC分类号： H05K13/0465 , H01L24/75 , H01L24/81 , H01L24/97 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/16227 , H01L2224/75102 , H01L2224/75251 , H01L2224/757 , H01L2224/75703 , H01L2224/7598 , H01L2224/75985 , H01L2224/75987 , H01L2224/75988 , H01L2224/81065 , H01L2224/8109 , H01L2224/81093 , H01L2224/81193 , H01L2224/81203 , H01L2224/97 , H01L2224/81 , H01L2924/00014 , H01L2924/01029 , H01L2924/01013
摘要： A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal connectors in the first package components are aligned to respective second metal connectors of the second package components. After the plurality of first package components is placed, a metal-to-metal bonding is performed to bond the first metal connectors to the second metal connectors.
摘要翻译： 一种方法包括将多个第一包装部件放置在包括在第三包装部件中的第二包装部件上。 第一包装部件中的第一金属连接器与第二包装部件的相应的第二金属连接器对准。 在放置多个第一封装部件之后，执行金属对金属接合以将第一金属连接器接合到第二金属连接器。
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公开(公告)号：US20130273698A1
公开(公告)日：2013-10-17
申请号：US13918767
申请日：2013-06-14
发明人： Tung-Liang Shao , Chih-Hang Tung , Chen-Hua Yu , Hao-Yi Tsai , Mirng-Ji Lii , Da-Yuan Shih
IPC分类号： H01L21/768
CPC分类号： H01L21/76802 , B29C43/04 , B29C43/18 , H01L21/565 , H01L23/3121 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/20 , H01L2224/0401 , H01L2224/04105 , H01L2224/05572 , H01L2224/12105 , H01L2224/13022 , H01L2224/131 , H01L2224/19 , H01L2224/2939 , H01L2224/32225 , H01L2224/73267 , H01L2924/00014 , H01L2924/181 , H01L2924/014 , H01L2224/05552 , H01L2924/00 , H01L2224/83005
摘要： Methods for forming through vias in an integrated circuit package are disclosed. A substrate having a first surface is covered with an encapsulation layer of uncured material; the method includes inserting an upper mold tool having a first plurality of pillars into the encapsulation layer to imprint through vias extending to the first surface of the substrate; curing the encapsulation layer and the through vias; removing the upper mold tool from the encapsulation layer; and disposing conductor material within the through vias to make electrical connectors within the through vias. In additional methods, a method for forming an encapsulation layer using an upper and lower mold tool to form through vias and a mold cavity is disclosed.
摘要翻译： 公开了用于在集成电路封装中形成通孔的方法。 具有第一表面的基板被未固化材料的封装层覆盖; 该方法包括将具有第一多个柱的上模具插入到封装层中以通过延伸到基板的第一表面的通孔进行压印; 固化封装层和通孔; 从封装层移除上模具; 并且在通孔内设置导体材料以在通孔内形成电连接器。 在另外的方法中，公开了一种使用上模具和下模具形成通孔和模腔形成封装层的方法。
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公开(公告)号：US09475145B2
公开(公告)日：2016-10-25
申请号：US13826362
申请日：2013-03-14
发明人： Su-Chun Yang , Chung-Jung Wu , Hsiao-Yun Chen , Yi-Li Hsiao , Chih-Hang Tung , Da-Yuan Shih , Chen-Hua Yu
CPC分类号： H01L24/81 , B23K1/0016 , B23K35/0244 , B23K35/262 , B23K2101/40 , B23K2103/08 , C22C13/00 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13014 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16057 , H01L2224/16058 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16506 , H01L2224/16507 , H01L2224/81121 , H01L2224/81191 , H01L2224/81815 , H01L2224/8193 , H01L2224/81947 , H01L2924/01322 , H01L2924/014 , H01L2924/3841
摘要： A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down to form a solder bump joint in an electrical device.
摘要翻译： 一种方法包括将焊料凸块加热到焊料凸块的熔化温度以上。 焊料凸块被拉伸以增加焊料凸块的高度。 焊料凸块被冷却以在电气装置中形成焊料凸块接头。
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6.发明申请公开(公告)号：US20130221521A1
公开(公告)日：2013-08-29
申请号：US13826362
申请日：2013-03-14
发明人： Su-Chun Yang , Chung-Jung Wu , Hsiao-Yun Chen , Yi-Li Hsiao , Chih-Hang Tung , Da-Yuan Shih , Chen-Hua Yu
IPC分类号： B23K1/00 , H01L23/498
CPC分类号： H01L24/81 , B23K1/0016 , B23K35/0244 , B23K35/262 , B23K2101/40 , B23K2103/08 , C22C13/00 , H01L23/49811 , H01L24/13 , H01L24/16 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13014 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16057 , H01L2224/16058 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16506 , H01L2224/16507 , H01L2224/81121 , H01L2224/81191 , H01L2224/81815 , H01L2224/8193 , H01L2224/81947 , H01L2924/01322 , H01L2924/014 , H01L2924/3841
摘要： A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down to form a solder bump joint in an electrical device.
摘要翻译： 一种方法包括将焊料凸块加热到焊料凸块的熔化温度以上。 焊料凸块被拉伸以增加焊料凸块的高度。 焊料凸块被冷却以在电气装置中形成焊料凸块接头。
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公开(公告)号：US11257767B2
公开(公告)日：2022-02-22
申请号：US16459066
申请日：2019-07-01
发明人： Chen-Hua Yu , Da-Yuan Shih
摘要： A system and method for preventing cracks is provided. An embodiment comprises placing crack stoppers into a connection between a semiconductor die and a substrate. The crack stoppers may be in the shape of hollow or solid cylinders and may be placed so as to prevent any cracks from propagating through the crack stoppers.
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公开(公告)号：US10034390B2
公开(公告)日：2018-07-24
申请号：US15004395
申请日：2016-01-22
发明人： Yi-Li Hsiao , Su-Chun Yang , Chih-Hang Tung , Da-Yuan Shih , Chen-Hua Yu
IPC分类号： H01R43/00 , H05K3/42 , H01L23/00 , H05K3/40 , H01L23/498
摘要： A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
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公开(公告)号：US09521795B2
公开(公告)日：2016-12-13
申请号：US13866858
申请日：2013-04-19
发明人： Yi-Li Hsiao , Da-Yuan Shih , Chih-Hang Tung , Chen-Hua Yu
CPC分类号： H05K13/0465 , H01L24/75 , H01L24/81 , H01L24/97 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/16227 , H01L2224/75102 , H01L2224/75251 , H01L2224/757 , H01L2224/75703 , H01L2224/7598 , H01L2224/75985 , H01L2224/75987 , H01L2224/75988 , H01L2224/81065 , H01L2224/8109 , H01L2224/81093 , H01L2224/81193 , H01L2224/81203 , H01L2224/97 , H01L2224/81 , H01L2924/00014 , H01L2924/01029 , H01L2924/01013
摘要： A method includes placing a plurality of first package components over second package components, which are included in a third package component. First metal connectors in the first package components are aligned to respective second metal connectors of the second package components. After the plurality of first package components is placed, a metal-to-metal bonding is performed to bond the first metal connectors to the second metal connectors.
摘要翻译： 一种方法包括将多个第一包装部件放置在包括在第三包装部件中的第二包装部件上。 第一包装部件中的第一金属连接器与第二包装部件的相应的第二金属连接器对准。 在放置多个第一封装部件之后，执行金属对金属接合以将第一金属连接器接合到第二金属连接器。
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公开(公告)号：US20160155731A1
公开(公告)日：2016-06-02
申请号：US15013669
申请日：2016-02-02
发明人： Chih-Hang Tung , Chun Hui Yu , Chen-Hua Yu , Da-Yuan Shih
IPC分类号： H01L25/00 , H01L23/00 , H01L21/56 , H01L21/48 , H01L21/768 , H01L25/065 , H01L21/78
CPC分类号： H01L25/50 , H01L21/4882 , H01L21/561 , H01L21/563 , H01L21/76879 , H01L21/78 , H01L23/3114 , H01L24/03 , H01L24/09 , H01L24/11 , H01L24/17 , H01L24/19 , H01L24/24 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2224/02311 , H01L2224/02381 , H01L2224/0346 , H01L2224/0401 , H01L2224/04105 , H01L2224/05572 , H01L2224/08146 , H01L2224/12105 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/73217 , H01L2224/73267 , H01L2224/8203 , H01L2224/94 , H01L2224/97 , H01L2225/06524 , H01L2225/06548 , H01L2225/06568 , H01L2225/06589 , H01L2924/00014 , H01L2924/01029 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2224/05552 , H01L2224/03
摘要： A method of multi-chip wafer level packaging comprises attaching a first semiconductor die to a top side of a wafer, forming a first reconfigured wafer by embedding the first semiconductor die into a first photo-sensitive material layer, forming a first group of through assembly vias in the first photo-sensitive material layer, attaching a second semiconductor die to the first photo-sensitive material layer, forming a second photo-sensitive material layer on top of the first photo-sensitive material layer, wherein the second semiconductor die is embedded in the second photo-sensitive material layer and forming a second group of through assembly vias in the second photo-sensitive material layer.
摘要翻译： 多芯片晶片级封装的方法包括：将第一半导体管芯附接到晶片的顶侧，通过将第一半导体管芯嵌入第一光敏材料层中形成第一重新配置的晶片，形成第一组通孔 在第一感光材料层中的通孔，将第二半导体管芯附接到第一感光材料层，在第一光敏材料层的顶部上形成第二感光材料层，其中第二半导体管芯被嵌入 在第二感光材料层中形成第二组通过组装通孔的第二光敏材料层。
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