Electronic unit with a substrate where an electronic circuit is fabricated
    3.
    发明授权
    Electronic unit with a substrate where an electronic circuit is fabricated 有权
    具有制造电子电路的基板的电子单元

    公开(公告)号:US07531852B2

    公开(公告)日:2009-05-12

    申请号:US11151660

    申请日:2005-06-14

    IPC分类号: H01L21/82

    摘要: In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. At least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces.

    摘要翻译: 在具有基板的电子单元中,控制电路安装在基板上,并且被配置为执行与负载相关的操作。 封装封装了控制电路和基板。 该封装具有围绕基板周边的侧面。 用于输入外部发送到电子单元的信号的至少一个输入端设置在多个表面中的至少一个表面上。 用于输出用于控制负载的控制信号的至少一个输出端子设置在多个表面中的至少另一个表面上。 至少一个用于输入/输出用于至少检查控制电路的信号的检查端子设置在多个表面中的至少另一个表面上。

    Electronic unit with a substrate where an electronic circuit is fabricated
    6.
    发明申请
    Electronic unit with a substrate where an electronic circuit is fabricated 有权
    具有制造电子电路的基板的电子单元

    公开(公告)号:US20050274982A1

    公开(公告)日:2005-12-15

    申请号:US11151660

    申请日:2005-06-14

    摘要: In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. At least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces.

    摘要翻译: 在具有基板的电子单元中,控制电路安装在基板上,并且被配置为执行与负载相关的操作。 封装封装了控制电路和基板。 该封装具有围绕基板周边的侧面。 用于输入外部发送到电子单元的信号的至少一个输入端设置在多个表面中的至少一个表面上。 用于输出用于控制负载的控制信号的至少一个输出端子设置在多个表面中的至少另一个表面上。 至少一个用于输入/输出用于至少检查控制电路的信号的检查端子设置在多个表面中的至少另一个表面上。

    ELECTRONIC CONTROL DEVICE
    7.
    发明申请
    ELECTRONIC CONTROL DEVICE 有权
    电子控制装置

    公开(公告)号:US20110231032A1

    公开(公告)日:2011-09-22

    申请号:US13050103

    申请日:2011-03-17

    IPC分类号: G06F17/00

    CPC分类号: H05K7/20881 H05K5/0065

    摘要: A control circuit board has a plurality of connectors that can connect each control module circuit board to control a plurality of in-vehicle equipment. A power supply circuit board has a power supply circuit that controls a power supply from a battery to a controlled equipment of the control module circuit boards connected with each connector. The control circuit board and the power supply circuit board are electrically connected and accommodated in a case. When the control module circuit boards are connected with any connector of the control circuit board, the power supply circuit is controlled by the control module and it becomes possible to control the controlled equipment such as engines.

    摘要翻译: 控制电路板具有可连接各个控制模块电路板以控制多个车载设备的多个连接器。 电源电路板具有电源电路,其控制从电池到与每个连接器连接的控制模块电路板的受控设备的电力供应。 控制电路板和电源电路板电连接并容纳在壳体中。 当控制模块电路板与控制电路板的任何连接器连接时,电源电路由控制模块控制,可以控制发动机等受控设备。

    Method for manufacturing semiconductor device having element isolation structure

    公开(公告)号:US06524890B2

    公开(公告)日:2003-02-25

    申请号:US09987798

    申请日:2001-11-16

    IPC分类号: H01L2144

    摘要: When a semiconductor device having an element isolation structure is formed, first, a trench is formed in a wafer from a principal surface of the wafer, and the trench is filled with an insulating film. Then, the back surface of the wafer is polished so that the insulating film is exposed on the back surface. Accordingly, the insulating film penetrates the wafer from the principal surface to the back surface, thereby performing element isolation of the wafer. It is not necessary to use a bonding wafer. Thus, the method for manufacturing the semiconductor device is simplified.

    Electronic control device for controlling a plurality of in-vehicle equipment
    10.
    发明授权
    Electronic control device for controlling a plurality of in-vehicle equipment 有权
    用于控制多个车载设备的电子控制装置

    公开(公告)号:US08417418B2

    公开(公告)日:2013-04-09

    申请号:US13050103

    申请日:2011-03-17

    IPC分类号: G06F7/00

    CPC分类号: H05K7/20881 H05K5/0065

    摘要: A control circuit board has a plurality of connectors that can connect each control module circuit board to control a plurality of in-vehicle equipment. A power supply circuit board has a power supply circuit that controls a power supply from a battery to a controlled equipment of the control module circuit boards connected with each connector. The control circuit board and the power supply circuit board are electrically connected and accommodated in a case. When the control module circuit boards are connected with any connector of the control circuit board, the power supply circuit is controlled by the control module and it becomes possible to control the controlled equipment such as engines.

    摘要翻译: 控制电路板具有可连接各个控制模块电路板以控制多个车载设备的多个连接器。 电源电路板具有电源电路,其控制从电池到与每个连接器连接的控制模块电路板的受控设备的电力供应。 控制电路板和电源电路板电连接并容纳在壳体中。 当控制模块电路板与控制电路板的任何连接器连接时,电源电路由控制模块控制,并且可以控制诸如发动机的受控设备。