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    MICROELECTRONIC BONDING WITH LEAD MOTION
    83.
    发明申请
    MICROELECTRONIC BONDING WITH LEAD MOTION 审中-公开
    微电子与铅运动结合

    公开(公告)号：WO1996009745A1

    公开(公告)日：1996-03-28

    申请号：PCT/US1995011899

    申请日：1995-09-19

    Applicant: TESSERA, INC.

    Inventor： TESSERA, INC. ,  DISTEFANO, Thomas, H. ,  KOVAC, Zlata ,  GRANGE, John

    IPC: H05K01/00

    CPC classification number: H01L21/67144 ,  H01L24/86 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/4913 ,  Y10T29/49135

    Abstract: A method of connecting a semiconductor chip assembly (12) having at least first and second contacts (18) to a connection component (20) including at least first and second connection leads (30) by means of a tool (60) consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component (20) is juxtaposed with the semiconductor chip assembly (12) so that the first and second connection leads (30) are aligned with the first and second contacts (18) in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool (60) substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space (A1) is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool (60) substantially downwardly and towards the second contact in the second direction.

    Abstract translation: 一种将具有至少第一和第二触点（18）的半导体芯片组件（12）连接到包括至少第一和第二连接引线（30）的连接部件（20）的方法，所述工具（60）包括： 将引线并排连接到相应的触点的步骤。 连接部件（20）与半导体芯片组件（12）并置，使得第一和第二连接引线（30）与第一和第二触点（18）对准，使得第一连接引线偏离 第一方向上的第一接触和第二连接引线在相同的第一方向上偏离第二接触。 第一连接引线通过工具（60）基本上向下并且沿与第一方向相反的第二方向朝向第一接触件移动，使得在第一连接引线和第二连接引线之间形成开放空间（A1） 并且导致便于工具（60）沿着第二方向大致向下并朝着第二接触件移动第二连接引线。

    METHOD OF FORMING INTERFACE BETWEEN DIE AND CHIP CARRIER
    86.
    发明申请
    METHOD OF FORMING INTERFACE BETWEEN DIE AND CHIP CARRIER 审中-公开
    形成DIE和芯片载体之间的界面的方法

    公开(公告)号：WO1995008856A1

    公开(公告)日：1995-03-30

    申请号：PCT/US1994008812

    申请日：1994-08-05

    Applicant: TESSERA, INC.

    Inventor： TESSERA, INC. ,  SWEIS, Jason ,  GILLEO, Kenneth, Burton

    IPC: H01R43/00

    CPC classification number: G06K19/07745 ,  H01L21/54 ,  H01L23/24 ,  H01L2924/0002 ,  Y10T29/49144 ,  H01L2924/00

    Abstract: A method for creating an interface between a chip (10) and chip carrier (26) includes spacing the chip (10) a given distance above the chip carrier (26), and then introducing a liquid (50) in the gap (34) between the chip (10) and carrier (26). Preferably, the liquid (50) is an elastomer which is hardened into a resilient layer after its introduction into the gap (34). In another preferred embodiment, the terminals (331-34) on a chip carrier (326) are planarized or otherwise vertically positioned by deforming the terminals (331-34) into set vertical locations with a plate (380), and then hardening a liquid (350) between the chip carrier (326) and chip (310).

    Abstract translation: 一种用于在芯片（10）和芯片载体（26）之间创建界面的方法包括将芯片（10）与芯片载体（26）上方给定的距离间隔开，然后将液体（50）引入间隙（34） 在芯片（10）和载体（26）之间。 优选地，液体（50）是在其引入间隙（34）之后被硬化成弹性层的弹性体。 在另一优选实施例中，芯片载体（326）上的端子（331-34）通过使端子（331-34）变形成具有板（380）的设定垂直位置而被平坦化或以其它方式垂直定位，然后使液体 （350）在芯片载体（326）和芯片（310）之间。

    ELECTROHYDRODYNAMIC (EHD) AIR MOVER CONFIGURATION WITH FLOW PATH EXPANSION AND/OR SPREADING FOR IMPROVED OZONE CATALYSIS
    87.
    发明申请
    ELECTROHYDRODYNAMIC (EHD) AIR MOVER CONFIGURATION WITH FLOW PATH EXPANSION AND/OR SPREADING FOR IMPROVED OZONE CATALYSIS 审中-公开
    电动气动（EHD）空气动力学配置与流路膨胀和/或扩展改进的臭氧催化

    公开(公告)号：WO2013106448A1

    公开(公告)日：2013-07-18

    申请号：PCT/US2013/020856

    申请日：2013-01-09

    Applicant: TESSERA, INC.

    Inventor： JEWELL-LARSEN, Nels ,  LEE, Bong-Sub ,  HONER, Kenneth ,  HUMPSTON, Giles

    IPC: G06F1/20

    CPC classification number: F24F7/007 ,  B01D71/04 ,  B01D2325/48 ,  G06F1/20 ,  G06F1/203 ,  Y10T29/49002

    Abstract: Provision of an expansion region (e.g., a flow path with increasing cross-section downstream of the EHD air mover) can provide operational benefits in EHD air mover-based thermal management systems. In contrast, such a design would generally be disfavored for conventional mechanical air mover-based systems. In some cases, an expansion chamber or volume may be provided between the EHD air mover and heat transfer surfaces. In some cases, expansion of the flow cross-section may be provided (at least in part) within the heat transfer surface volume itself. In some cases, leading surfaces of heat transfer surface (e.g., heat sink fins) may be shaped, disposed or otherwise presented to EHD motivated flow to reduce "laminarity" of the impinging air flow so as to reduce thermal transfer boundary layer effects and/or to divert flow outward in the flow channel so as to more evenly distribute ozone molecules over catalytic sites.

    Abstract translation: 提供扩展区域（例如，EHD空气移动器下游的横截面增加的流路）可以在基于EHD基于空气动力的热管理系统中提供操作益处。 相比之下，这种设计通常对于传统的基于机械空气移动器的系统是不利的。 在一些情况下，可以在EHD鼓风机和传热表面之间设置一个膨胀室或容积。 在一些情况下，可以在传热表面体积本身内（至少部分地）提供流动横截面的膨胀。 在一些情况下，传热表面（例如，散热鳍片）的前表面可以被成形，设置或以其他方式呈现给EHD动力流，以减少冲击空气流的“层叠”，从而减少热传递边界层效应和/ 或者在流动通道中向外转移流体，以便在催化位点上更均匀地分布臭氧分子。

    CLEANING MECHANISM WITH TANDEM MOVEMENT OVER EMITTER AND COLLECTOR SURFACES
    88.
    发明申请
    CLEANING MECHANISM WITH TANDEM MOVEMENT OVER EMITTER AND COLLECTOR SURFACES 审中-公开
    清洁机械与发射机和收集器表面的移动

    公开(公告)号：WO2011162932A3

    公开(公告)日：2013-01-31

    申请号：PCT/US2011039104

    申请日：2011-06-03

    Applicant: TESSERA INC ,  SCHWIEBERT MATTHEW K ,  JEWELL-LARSEN NELS ,  HONER KENNETH A

    Inventor： SCHWIEBERT MATTHEW K ,  JEWELL-LARSEN NELS ,  HONER KENNETH A

    IPC: B08B1/00 ,  B03C3/74 ,  H01T23/00

    CPC classification number: B08B1/008 ,  B03C3/743

    Abstract: An apparatus for tandem cleaning of an emitter electrode (e.g., 106, 206, 306, 308) and collector electrode (e.g., 108, 208, 320) in electrohydrodynamic fluid accelerator (e.g., 201, 301) and precipitator (e.g., 303) devices via movement of a cleaning mechanism (e.g., 200, 300) including respective cleaning surfaces (e.g., 102, 104, 202, 204, 302, 304, 322, 332) positioned to frictionally engage the emitter electrode and collector electrode. The cleaning mechanism causes the respective cleaning surfaces to travel along a longitudinal extent of the emitter electrode and, in tandem, over a major dimension of the collector electrode to remove detrimental material from respective electrode surfaces. Alternatively, the electrodes can be transited in tandem in frictional engagement with a fixed cleaning mechanism in the same or opposite directions. A conditioning material is optionally deposited on an electrode to at least partially mitigate ozone, erosion, corrosion, oxidation, or dendrite formation on the electrodes. The conditioning material can include an ozone reducer.

    Abstract translation: 用于串联清洁电动液体加速器（例如，201,301）和除尘器（例如，303）中的发射电极（例如，106,206,306,308）和集电极（例如，108,208,320）的装置， 通过移动包括相应的清洁表面（例如，102,104,202,204,302,304,322,332）的清洁机构（例如，200,300）的装置，所述清洁机构定位成摩擦地接合发射电极和集电极。 清洁机构使得相应的清洁表面沿着发射电极的纵向延伸，并且串联地超过集电极的主要尺寸，以从相应的电极表面移除有害的材料。 或者，电极可以以相同或相反的方向与固定的清洁机构摩擦接合而串联。 任选地将调理材料沉积在电极上以至少部分地减轻电极上的臭氧，侵蚀，腐蚀，氧化或枝晶形成。 调理材料可以包括臭氧减少剂。

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