公开(公告)号：WO2017011049A2

公开(公告)日：2017-01-19

申请号：PCT/US2016/028702

申请日：2016-04-21

Applicant: INVENSAS CORPORATION

Inventor： CO, Reynaldo ,  SUBIDO, Willmar ,  NGUYEN, Hoang ,  CARA, Marjorie ,  ZOHNI, Wael ,  LATTIN, Christopher, W.

CPC classification number: H01L24/49 ,  B81B7/007 ,  B81B7/0074 ,  B81B2207/05 ,  B81C1/00301 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces.

Abstract translation: 一种设备通常涉及微机电系统组件。 在这种装置中，微机电系统部件具有下表面，上表面，第一侧表面和第二侧表面。 第一侧表面的表面积大于第二侧表面的表面积。 微机电系统部件具有多个接合线，所述多个接合线附接到第一侧表面的第一侧表面并且远离第一侧表面的第一侧表面延伸。 丝焊线是自支撑的并且相对于第一侧表面的第一侧表面是悬臂式的。

公开(公告)号：WO2015073409A1

公开(公告)日：2015-05-21

申请号：PCT/US2014/064960

申请日：2014-11-11

Applicant: INVENSAS CORPORATION

Inventor： HABA, Belgacem ,  CO, Reynaldo ,  SAGA CIZEK, Rizza Lee ,  ZOHNI, Wael

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/005 ,  B23K20/007 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49811 ,  H01L24/43 ,  H01L24/78 ,  H01L2224/04105 ,  H01L2224/056 ,  H01L2224/432 ,  H01L2224/4382 ,  H01L2224/43985 ,  H01L2224/783 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/78822 ,  H01L2224/85 ,  H01L2224/85345 ,  H01L2224/85399 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electrically conductive lead (137) is formed using a bonding tool (104). After bonding the wire (115) to a metal surface (112) and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink (116) to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element (334), e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Optionally, twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end (138). The lead then extends from the metal surface (112) to the end (138), and may exhibits a sign of the torsional force applied thereto.

Abstract translation: 使用接合工具（104）形成导电引线（137）。 在将金属丝（115）接合到金属表面（112）上并且将一段长度的金属丝延伸超过接合工具之后，电线被夹紧。 接合工具的移动在线材与除了接合工具之外的任何金属元件完全分离的位置处向线材（116）施加扭结（116）。 形成元件（334），例如设置在接合工具的外表面处的边缘或叶片裙部可以帮助扭结线。 可选地，在使用接合工具张紧线材的同时扭绞线可能导致线断裂并限定端部（138）。 然后，引线从金属表面（112）延伸到端部（138），并且可以表现出施加到其上的扭转力的符号。

公开(公告)号：WO2013126269A1

公开(公告)日：2013-08-29

申请号：PCT/US2013/026126

申请日：2013-02-14

Applicant: INVENSAS CORPORATION

Inventor： CO, Reynaldo ,  MIRKARIMI, Laura

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L23/3128 ,  H01L21/4853 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/06 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/32145 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05599

Abstract: A microelectronic assembly (10) includes a substrate (12) having a first and second opposed surfaces. A microelectronic element (22) overlies the first surface and first electrically conductive elements (28) can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements (28) are electrically connected to the microelectronic element (22). Wire bonds (32) have bases (34) joined to the conductive elements (28) and end surfaces (38) remote from the substrate and the bases, each wire bond defining an edge surface (37) extending between the base and the end surface. An encapsulation layer (42) can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds (32) are defined by at least portions of the end surfaces (38) of the wire bonds that are uncovered by the encapsulation layer (42).

Abstract translation: 微电子组件（10）包括具有第一和第二相对表面的衬底（12）。 微电子元件（22）覆盖在第一表面上，并且第一导电元件（28）可以在第一表面或第二表面中的至少一个处露出。 一些第一导电元件（28）电连接到微电子元件（22）。 线接合（32）具有接合到导电元件（28）和远离基板和基座的端表面（38）的基部（34），每个引线接合限定在基部和端面之间延伸的边缘表面（37） 。 封装层（42）可以从第一表面延伸并填充引线键合之间的空间，使得引线键合可以被封装层分离。 线接合（32）的未封装的部分由未被封装层（42）覆盖的引线接合的端面（38）的至少一部分限定。

公开(公告)号：WO2015184152A3

公开(公告)日：2015-12-03

申请号：PCT/US2015/033004

申请日：2015-05-28

Applicant: INVENSAS CORPORATION

Inventor： CO, Reynaldo ,  ZOHNI, Wael ,  SAGA CIZEK, Rizza Lee ,  KATKAR, Rajesh

IPC: H01L23/498 ,  H01L21/683

Abstract: A microelectronic package may include a substrate (40) having first and second regions (46,48), a first surface (42) and a second surface (44) remote from the first surface; at least one microelectronic element (18) overlying the first surface (42) within the first region (46); electrically conductive elements (52) at the first surface within the second region (48); a support structure (20) having a third surface (24) and a fourth surface (22) remote from the third surface and overlying the first surface (42) within the second region (48) in which the third surface (42) faces the first surface (42), second and third electrically conductive elements (28, 26) exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements (52) at the first surface (42) in the first region; and wire bonds (14) defining edge surfaces (36) and having bases (32) electrically connected through ones of the third conductive elements (26) to respective ones of the second conductive elements (28) and ends (34) remote from the support structure and the bases.

公开(公告)号：WO2014107301A1

公开(公告)日：2014-07-10

申请号：PCT/US2013/075672

申请日：2013-12-17

Applicant: INVENSAS CORPORATION

Inventor： HABA, Belgacem ,  MOHAMMED, Ilyas ,  CASKEY, Terrence ,  CO, Reynaldo ,  CHAU, Ellis

IPC: H01L23/498 ,  H01L25/10 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A structure (10) may include bond elements (24) having bases joined to conductive elements (18) at a first portion of a first surface and end surfaces remote from the substrate (12). A dielectric encapsulation element (40) may overlie and extend from the first portion and fill spaces between the bond elements (24) to separate the bond elements (24) from one another. The encapsulation element (40) has a third surface facing away from the first surface. Unencapsulated portions of the bond elements (24) are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element (40) at least partially defines a second portion (210) of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element (602). Some conductive elements (18) are at the second portion and configured for connection with such microelectronic element (602).

Abstract translation: 结构（10）可以包括在第一表面的第一部分和远离基底（12）的端表面处具有连接到导电元件（18）的基底的结合元件（24）。 电介质封装元件（40）可以从第一部分覆盖并延伸并填充接合元件（24）之间的空间，以将接合元件（24）彼此分离。 封装元件（40）具有背离第一表面的第三表面。 粘合元件（24）的未封装的部分由在第三表面处被封装元件未覆盖的端面的至少一部分限定。 封装元件（40）至少部分地限定第一表面的除第一部分之外的第二部分（210），并且具有尺寸适于容纳微电子元件（602）的整个区域的区域。 一些导电元件（18）位于第二部分并被配置为与这种微电子元件（602）连接。

公开(公告)号：WO2015184152A2

公开(公告)日：2015-12-03

申请号：PCT/US2015/033004

申请日：2015-05-28

Applicant: INVENSAS CORPORATION

Inventor： CO, Reynaldo ,  ZOHNI, Wael ,  SAGA CIZEK, Rizza Lee ,  KATKAR, Rajesh

IPC: H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5226 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15312 ,  H01L2924/15321 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A microelectronic package may include a substrate (40) having first and second regions (46,48), a first surface (42) and a second surface (44) remote from the first surface; at least one microelectronic element (18) overlying the first surface (42) within the first region (46); electrically conductive elements (52) at the first surface within the second region (48); a support structure (20) having a third surface (24) and a fourth surface (22) remote from the third surface and overlying the first surface (42) within the second region (48) in which the third surface (42) faces the first surface (42), second and third electrically conductive elements (28, 26) exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements (52) at the first surface (42) in the first region; and wire bonds (14) defining edge surfaces (36) and having bases (32) electrically connected through ones of the third conductive elements (26) to respective ones of the second conductive elements (28) and ends (34) remote from the support structure and the bases.

Abstract translation: 微电子封装可以包括具有第一和第二区域（46,48），远离第一表面的第一表面（42）和第二表面（44）的衬底（40） 在所述第一区域（46）内覆盖所述第一表面（42）的至少一个微电子元件（18）; 在第二区域（48）内的第一表面处的导电元件（52）; 具有第三表面（24）和远离所述第三表面的第四表面（22）的支撑结构（20），并且在所述第二区域（48）内覆盖所述第一表面（42），所述第三表面（42）面向所述第二表面 第一表面（42），第二和第三导电元件（28,26）分别暴露在第三和第四表面处并且在第一区域中的第一表面（42）处电连接到导电元件（52）; 以及限定边缘表面（36）并且具有通过第三导电元件（26）中的一个电连接到第二导电元件（28）中的相应的第二导电元件（28）和远离支撑件的端部（34）的基座（32） 结构和基础。

公开(公告)号：WO2014022780A1

公开(公告)日：2014-02-06

申请号：PCT/US2013/053437

申请日：2013-08-02

Applicant: INVENSAS CORPORATION

Inventor： CASKEY, Terrence ,  MOHAMMED, Ilyas ,  UZOH, Cyprian, Emeka ,  WOYCHIK, Charles ,  NEWMAN, Michael ,  MONADGEMI, Pezhman ,  CO, Reynaldo ,  CHAU, Ellis ,  HABA, Belgacem

IPC: H01L23/48 ,  H01L23/12

CPC classification number: H01L25/105 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H05K1/0298 ,  H05K3/46 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract translation: 制造插入件的方法包括形成结合到第一元件的一个或多个第一表面的多个引线键合。 形成电介质封装，其接触将引线接合部彼此分隔开的引线接合的边缘表面。 进一步的处理包括去除第一元件的至少一部分，其中插入件具有通过至少封装相互隔开的第一和第二相对侧，并且插入件分别在第一和第二相对侧具有第一接触和第二接触， 分别与第一和第二部件电连接，第一触点通过引线键与第二触点电连接。

公开(公告)号：WO2013059181A1

公开(公告)日：2013-04-25

申请号：PCT/US2012/060402

申请日：2012-10-16

Applicant: INVENSAS CORPORATION

Inventor： CHAU, Ellis ,  CO, Reynaldo ,  ALATORRE, Roseann ,  DAMBERG, Philip ,  WANG, Wei-shun ,  YANG, Se, Young ,  ZHAO, Zhijun

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/85 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/16 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/8518 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

Abstract: A microelectronic package (10) can include wire bonds (32) having bases (34) bonded to respective conductive elements (28) on a substrate (12) and ends (36) opposite the bases (34). A dielectric encapsulation layer (42) extends from the substrate (12) and covers portions of the wire bonds (32) such that covered portions of the wire bonds (32) are separated from one another by the encapsulation layer (42), wherein unencapsulated portions (39) of the wire bonds (32) are defined by portions of the wire bonds (32) which are uncovered by the encapsulation layer (42). Unencapsulated portions (39) can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases (34) of adjacent wire bonds (32).

Abstract translation: 微电子封装（10）可以包括具有接合到衬底（12）上的相应导电元件（28）的基部（34）和与基底（34）相对的端部（36）的引线接合（32）。 电介质封装层（42）从衬底（12）延伸并且覆盖引线接合部分（32），使得引线键合的被覆部分（32）通过封装层（42）彼此分开，其中未封装 引线键合（32）的部分（39）由未被封装层（42）覆盖的引线键合（32）的部分限定。 未包封部分（39）可以布置在具有最小间距的图案的位置处，该最小间距大于相邻引线键合（32）的基部（34）之间的第一最小间距。