公开(公告)号：EP0800754B1

公开(公告)日：2004-03-10

申请号：EP95933164.6

申请日：1995-09-20

Applicant: TESSERA, INC.

Inventor： KOVAC, Zlata ,  MITCHELL, Craig ,  DISTEFANO, Thomas

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H01L21/60 ,  H01R4/58 ,  H01L21/56

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

Abstract: A method and an apparatus for providing a planar and compliant interface between a semiconductor chip (120) and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads (110) defining channels (117) between adjacent pads. The pads are typically compressed between a flexible film chip carrier (100) and the chip. A compliant filler (170) is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

公开(公告)号：EP1241481A3

公开(公告)日：2004-01-02

申请号：EP02004602.5

申请日：1994-11-16

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor, Y. ,  Mathieu, Gaetan, L.

IPC: G01R1/073 ,  H01L21/66 ,  H01L21/60 ,  H01L23/48

CPC classification number: H05K7/1069 ,  B23K2201/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

公开(公告)号：EP0779772B1

公开(公告)日：2003-06-04

申请号：EP95932236.3

申请日：1995-09-26

Applicant: SEIKO EPSON CORPORATION

Inventor： UCHIYAMA, Kenji Seiko Epson Corporation

IPC: H05K1/02

CPC classification number: G02F1/13452 ,  H01L23/49805 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0032 ,  H05K3/284 ,  H05K3/323 ,  H05K3/361 ,  H05K3/403 ,  H05K3/4084 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/055 ,  H05K2201/10136 ,  H05K2201/10977 ,  H01L2224/0401

Abstract: A notch portion (12) is formed by partly scraping the substrate material along a crease that has been set in advance in the insulating substrate (11), a first portion (14) and a second portion (15) that are divided along the crease are folded and are integrally joined together by using an adhesive or by welding. A conducting pattern (17) is formed on the surface of the insulating substrate (11) at the notch portion between the first portion and the second portion spanning across the crease, and wiring patterns are formed on both surfaces of the printed wiring board (20) being directly conducting to each other without the need to forming a through hole. Use of this printed wiring board makes it possible to realize various electronic devices such as liquid crystal display device, electronic printer, etc., as well as portable information devices in small sizes, reduced weight, decreased thicknesses and at reduced costs.

公开(公告)号：EP1302894A2

公开(公告)日：2003-04-16

申请号：EP02021158.7

申请日：2002-09-24

Applicant: Multitape GmbH

Inventor： Reutner, Ulrich ,  Wendisch, Karl-Heinz

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/10727 ,  H05K2203/1469

Abstract: Chipkarte mit einer Mehrzahl von aneinanderliegenden und durch Wärme und Druck miteinander verbundenen Kartenschichten, wobei eine innere Trägerschicht an einer Oberseite derselben eine Antennenspule mit einer Mehrzahl von Leiterbahnen und an den Enden derselben angeordnete Spulenpads einerseits und eine Ausnehmung zur Aufnahme eines Chipmoduls andererseits aufweist, dass die Spulenpads in einem Kontaktierungsbereich zu beiden Seiten eines durch die nebeneinander verlaufenden Leiterbahnen gebildeten Leiterbahnabschnitts angeordnet sind, wobei die Ausnehmung in dem Leiterbahnabschnitt angeordnet ist, derart, dass das Chipmodul unter direkter Anlage von Chipanschlüssen desselben an den Spulenpads der Antennenspule in die Ausnehmung einsetzbar ist.

Abstract translation: 芯片卡具有层压到外部保护层的内部支撑层。 内部支撑层在其上表面上具有一个天线线圈，该天线线圈通过多个平行的导体轨道连接到线圈板（8）。 焊盘布置在导体轨道的任一端。 另一方面，它有一个包含芯片模块的凹槽（9）。 当芯片模块（10）插入时，导体轨迹通过芯片模块。 本发明还涉及用于制备支撑层的相应方法。 最佳地，芯片模块可以作为表面安装器件生产。 当芯片位于凹槽中时，其触点（12）被定位成使得它们与天线焊盘直接接触。

公开(公告)号：EP1262782A2

公开(公告)日：2002-12-04

申请号：EP02014918.3

申请日：1995-11-15

Applicant: FORMFACTOR, INC.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R1/073 ,  H01L21/66

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: The invention provides a method of testing semiconductor devices (702, 704), prior to their being singulated from a semiconductor wafer. Said method comprises the following steps: permanently mounting a plurality of resilient contact structures (708) directly to a plurality of first terminals on at least one semiconductor device (702, 704) which is resident on a semiconductor wafer, each of said resilient contact structures having a tip and extending from a surface of the semiconductor device; urging a substrate (710) having a plurality of second terminals (712) towards the surface of the semiconductor device to effect a plurality of electrical connections between respective ones of the second terminals and tips of the resilient contact structures; and providing signals to the second terminals of the substrate to exercise the semiconductor device.

Abstract translation: 本发明提供一种在从半导体晶片分离之前测试半导体器件（702,704）的方法。 所述方法包括以下步骤：将驻留在半导体晶片上的至少一个半导体器件（702,704）上的多个弹性接触结构（708）直接固定到多个第一端子上，每个所述弹性接触结构 具有尖端并从半导体器件的表面延伸; 将具有多个第二端子（712）的衬底（710）推向半导体器件的表面以实现弹性接触结构的相应的第二端子和尖端之间的多个电连接; 并向衬底的第二端提供信号以锻炼半导体器件。

公开(公告)号：EP1255338A1

公开(公告)日：2002-11-06

申请号：EP02252662.8

申请日：2002-04-15

Applicant: Eldre Corporation

Inventor： Bader, Craig C. ,  Norman, Robert A., Jr.

IPC: H02G5/00

CPC classification number: H05K1/0256 ,  H02G5/005 ,  H05K2201/0397 ,  H05K2201/10272 ,  Y10S439/951

Abstract: A laminated bus bar has thereon a male terminal formed either from only two electric strip conductors separated by a layer of insulation, or from two groups of conductors separated by a layer of insulation. When only two conductors are employed, one may be slightly longer and wider than the other, and the terminal section of the one conductor has a marginal edge portion thereof extending beyond the edge of the registering terminal section of the other conductor. Both terminal sections of the two conductors have exposed outer surfaces forming a male terminal disposed to be inserted releasably into a female receptacle of an electric circuit, and a dielectric insulator barrier is secured on and covers the marginal edge portion of the terminal section of the one conductor and overlies the edge of the other terminal section. When each terminal section constitutes a group of spaced, parallel conductors one of two, like insulator barriers is secured to each side of the insulation separating the two groups, and has in one edge thereof spaced notches for accommodating and covering the edges of all conductors in the registering group thereof.

公开(公告)号：EP1172901A1

公开(公告)日：2002-01-16

申请号：EP01305721.1

申请日：2001-07-02

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Yuasa, Eriko ,  Yamakawa, Shuji ,  Kato, Shinshu

IPC: H01R25/00

CPC classification number: H05K1/0256 ,  H01R4/70 ,  H01R25/00 ,  H05K1/0284 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09045 ,  H05K2201/10272

Abstract: An electrical connection box is provided for a vehicle which has a low-voltage battery of maximum output voltage selected from 14V and 28V, and a high-voltage battery of output voltage higher than that of said first battery structure. The electrical connection box (3) has an insulation plate and, fixed on one face of said insulation plate, first bus bars (10) connected in use to the first battery and second bus bars (11) connected in use to the second battery so that the first and second bus bars are at different potentials. In order to reduce risk of electrical leakage paths on the insulation plate, at least one of the following features is present:-

(i) the first bus bars (10) and the second bus bars (11) are separated on the face of the insulation plate by an air insulation zone of width in the range 1 to 30 mm,
(ii) an insulation wall stands up on the insulation plate between the first bus bars and the second bus bars,
(iii) the second bus bars (11) are embedded in the insulating material.

Abstract translation: 为车辆提供电气接线盒，该车辆具有选自14V和28V的最大输出电压的低压电池，以及输出电压高于所述第一电池结构的高压电池。 电连接盒（3）具有绝缘板，并且固定在所述绝缘板的一个面上，使用中连接到第一电池的第一母线（10）和与第二电池相连接的第二母线（11） 第一和第二母线处于不同的电位。 为了减少绝缘板上的漏电路径的风险，存在以下特征中的至少一个： - （i）第一母线（10）和第二母线（11）在 绝缘板由宽度范围为1至30mm的空气绝缘区，（ii）绝缘壁在第一母线和第二母线之间的绝缘板上竖立，（iii）第二母线（11） 嵌入绝缘材料中。

公开(公告)号：EP1035573A1

公开(公告)日：2000-09-13

申请号：EP00400630.0

申请日：2000-03-08

Applicant: SAGEM S.A.

Inventor： Pradel, Denis

IPC: H01L21/60

CPC classification number: H05K1/021 ,  H01L23/367 ,  H01L23/49855 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/77272 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/184 ,  H05K2201/0397 ,  H05K2201/10659 ,  H05K2201/10674 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Le composant électrique de puissance est pourvu d'électrodes (4, 5, 24, 25) dont, sur une (3, 23) des faces (2, 3; 22, 23) du composant (1, 21), une électrode unique (5, 25), les électrodes (4, 5; 24, 25) pouvant être reliées par brasage à un support de raccordement électrique (10, 30), et l'électrode unique (5, 25) pouvant être reliée au support (10, 30) par l'intermédiaire d'une plaque (9, 29) de liaison électrique et thermique.

Abstract translation: 载流电极的电功率成分（1）与上和下侧（2,3）（4,5），上侧（3）设置有单个电极（5）是由电极连接到支撑组装（10） 通过钎焊，其中单个电极连接到由一个板或杆（9）的中介用于电连接和热连接支持。 的电极与包含在所述部件的表面和携带的电连接的支撑件之间的预测。 在卡或板的形式的支撑件设置有键合焊盘（11,12），它们通过焊接到功率分量和单个上部电极的电极由在板的中间相连。 组装程序包括组件的上支撑载置有电极（4）至接合垫（11），其被连接到所述带状导体（13），板的载置到上部件的上侧和单电极（5） 到键合焊盘（12），所有这些被连接到带状导体（14），具有一个焊接层的介入，和治疗在一个烘箱电极中的键合焊盘一个集合连接，这使得板做的电和热连接。 在第二个实施例中，连接板是平的并安装在印刷电路板的电平具有用于在所述板的bothsides功率器件和接合垫的窗口，所述下侧接合垫在柔性舌片延长条形导体 ，

公开(公告)号：EP0964496A1

公开(公告)日：1999-12-15

申请号：EP98954802.9

申请日：1998-11-24

Applicant: The Furukawa Electric Co., Ltd.

Inventor： HASEGAWA, Shin ,  TANAKA, Mitsuo ,  IKEZAWA, Tadashi

IPC: H02G3/16

CPC classification number: H01R9/226 ,  H05K3/202 ,  H05K3/4092 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10424 ,  Y10S439/949

Abstract: An electric connection box of the present invention comprises an upper case, a lower case fitting with the upper case, a connector housing connecting with a connector from the outside, one or a plurality of bus-bars each arranged sandwiched between the upper case and the lower case and having a terminal portion comprised of a plurality of terminal pieces positioned arranged in parallel inside the connector housing and a bus-bar body integrally formed with the terminal portion, and an insulator provided at least between the plurality of terminal pieces to connect and secure the terminal pieces to each other, by which insulator the narrow width terminal pieces are connected with each other and disturbance of the pitch or deformation is prevented.

Abstract translation: 本发明的电连接盒包括上壳体，下壳体与上壳体配合，连接器壳体与外部连接器连接，一个或多个汇流条，每个汇流排布置在上壳体和 并且具有由连接器壳体内的平行配置的多个端子构成的端子部和与端子部一体形成的汇流条体，以及至少在多个端子之间设置的绝缘体， 将端子片彼此固定，通过该绝缘体，窄宽度端子片彼此连接，并且防止了间距或变形的干扰。

公开(公告)号：EP0802711A3

公开(公告)日：1999-08-18

申请号：EP97302538.0

申请日：1997-04-14

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hisazumi, Takao ,  Iwamoto, Hiroshi ,  Shimizu, Kaoru

IPC: H05K13/00

CPC classification number: H05K3/326 ,  H05K1/0203 ,  H05K3/202 ,  H05K3/306 ,  H05K3/386 ,  H05K3/4092 ,  H05K5/0091 ,  H05K2201/0397 ,  H05K2201/09781 ,  H05K2201/1059 ,  H05K2203/063

Abstract: In a compact wiring board of efficient cooling performance allowing a large current to flow, obtain a wiring board capable of preventing parts from slipping out only by inserting lead bases. The constitution comprises a step of individually preparing a metal plate having a wiring pattern and a provisional linking portion for linking the wiring pattern, and an insulating material sheet for reinforcement, a step of laminating and integrating them, and a step of cutting off and removing the provisional linking portion thereafter.