公开(公告)号：EP1827069A2

公开(公告)日：2007-08-29

申请号：EP07075315.7

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka, c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki, c/o Ibiden Co., Ltd. ,  Minoura, Hisashi, c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu, c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro, c/o Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101~103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 is previously formed in a central portion of the innerlayer conductor circuit 161 located at the bottom of the blind via-hole 141, and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes 141, 142. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits 13, 161 and the blind via-holes 141, 142.

Abstract translation: 在包括布置在绝缘层101〜103之间的内层导体电路161,131和从绝缘层的最外表面朝向内层导体电路形成的盲通孔141,142的印刷线路板的制造中，开孔160是 预先形成在位于盲通孔141底部的内层导体电路161的中心部分，并且从绝缘层的最外表面照射激光束以形成盲通孔141,142。之后， 在内层导体电路13,161和盲通孔141,142的表面上形成金属镀膜。

公开(公告)号：EP1821587A2

公开(公告)日：2007-08-22

申请号：EP07002961.6

申请日：2007-02-12

Applicant: DENSO CORPORATION

Inventor： Ito, Atsushi ,  Honda, Takayoshi ,  Mikura, Hidehiro ,  Tsuruzawa, Tadashi ,  Sakuta, Takuya

IPC: H05K3/34

CPC classification number: H05K3/3421 ,  H05K1/111 ,  H05K3/3426 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10787 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting structure includes a board (110) and an electronic component (130) mounted on a front surface of the board (110). The board (110) includes lands (112). The electronic component (130) includes a body (131) and terminals (132) extending from the body (131). Each terminal (132) is electrically connected to a corresponding one of the lands (112) of the board (110). The terminal (132) has a first terminal portion (132a) extending along the front surface of the board (110) and a second terminal portion (132b) extending toward the front surface of the board (110). Each land (112) includes a land portion electrically soldered to the first terminal portion (132a) and a blind hole (111) for receiving the second terminal portion (132b). The first terminal portion (132a) is soldered to the land portion in a reflow process under the condition that the second terminal portion (132b) is inserted in the blind hole (111).

公开(公告)号：EP1816905A2

公开(公告)日：2007-08-08

申请号：EP07075316.5

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru, c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka, c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki, c/o Ibiden Co., Ltd. ,  Minoura, Hisashi, c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu, c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro, c/o Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: In the production of a printed wiring board comprising innerlayer conductor circuits 161, 131 arranged among insulating layers 101~103 and blind via-holes 141, 142 formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole 160 is previously formed in a central portion of the innerlayer conductor circuit 161 located at the bottom of the blind via-hole 141, and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes 141, 142. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits 13, 161 and the blind via-holes 141, 142.

Abstract translation: 一种在内层导体电路（562）上包括两个或多个绝缘层（516,518）的印刷电路板（501），从绝缘层（516）的最外表面延伸穿过两个或多个隔离层 形成在内层导体电路（562）的层（516,518）和形成在通孔（502）中的内部金属电镀膜（521），以便与内层导体电路（562）电连接到外部导体电路 ），其特征在于，具有围绕所述通孔（502）的开孔（540）的用于加强件的环形虚设焊盘（504）布置在面向所述两个或更多个绝缘层的边界部分（517）中 （516,518）彼此连接并连接到内部金属镀膜（521）。

公开(公告)号：EP1672970A3

公开(公告)日：2007-08-01

申请号：EP06003111.9

申请日：2000-10-10

Applicant: IBIDEN CO., LTD.

Inventor： Kawasaki, Yogo Ogaki-kojou, Ibiden Co., Ltd., ,  Sataki, Hiroaki Aoyagi-kojou, Ibiden Co., Ltd., ,  Iwata, Yukata Aoyagi-kojou, Ibiden Co., Ltd., ,  Tanabe, Tesuya Aoyagi-kojou, Ibiden Co., Ltd.,

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/113 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/3457 ,  H05K3/381 ,  H05K3/382 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0796 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the via holes 66 are arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holes 36 and the via holes 66 to be connected to solder bumps 76 (conductive connection pins 78), respectively, are directly connected to one another, excellent reliability in connection is ensured.

公开(公告)号：EP1796446A2

公开(公告)日：2007-06-13

申请号：EP07006711.1

申请日：1997-09-16

Applicant: IBIDEN CO., LTD.

Inventor： Ono, Yoshitaka ,  Goto, Akihiko ,  Niki, Ayao ,  Asai, Motoo

IPC: H05K3/28 ,  H05K3/38

CPC classification number: H05K3/244 ,  G03F7/032 ,  G03F7/0388 ,  H05K1/112 ,  H05K3/184 ,  H05K3/28 ,  H05K3/287 ,  H05K3/3457 ,  H05K3/384 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/072 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The present invention refers to a printed circuit board comprising a wiring substrate provided with conductor circuits (5) and a solder resist layer (14) formed on a surface of the Substrate, in which a roughened layer (11) is formed on a surface of the conductor circuit (5).

Abstract translation: 本发明涉及一种印刷电路板，其包括布线基板，该布线基板设置有形成在所述基板的表面上的导体电路（5）和阻焊层（14），其中，在所述基板的表面上形成有粗糙层（11） 导体电路（5）。

公开(公告)号：EP1150551B1

公开(公告)日：2007-06-13

申请号：EP99973449.4

申请日：1999-11-17

Applicant: IBIDEN CO., LTD.

Inventor： HIROSE, Naohiro Ogaki-kita-kojou Ibiden K.K. ,  ITO, Hitoshi Ogaki-kita-kojou Ibiden K.K. ,  IWATA, Yoshiyuki Ogaki-kita-kojou Ibiden K.K. ,  KAWADE, Masanori Ogaki-kita-kojou Ibiden K.K. ,  YAZU, Hajime Ogaki-kojou Ibiden Kabushiki Kaisha

IPC: H05K1/11 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K1/111 ,  H05K1/112 ,  H05K3/28 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T428/239

Abstract: On the board provided with a conductive layer (5), a pad (16) is formed to fix a conductive connecting pin (100) on a package board (310). The conduction connecting pin (100) serves as electrical connection to a motherboard. The pad (16) is coated with an organic-resin insulating layer (15) having an opening section (18) from which the pad (16) is partially exposed. The conductive connecting pin (100) is fixed to the pad exposed from the opening section using a conductive adhesive (17), preventing the conductive connecting pin (100) from separating off the board at the time of mounting.

公开(公告)号：EP1768474A1

公开(公告)日：2007-03-28

申请号：EP05755665.6

申请日：2005-06-24

Applicant: IBIDEN CO., LTD.

Inventor： KARIYA, Takashi; c/o IBIDEN CO., LTD., ,  MOCHIDA, Akira; c/o IBIDEN CO., LTD.,

IPC: H05K3/46 ,  H01L23/12

CPC classification number: H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09718 ,  H05K2203/0353 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: In a printed wiring board 10 , an upper electrode connecting portion 52 penetrates through a capacitor portion 40 in top to bottom direction so that an upper electrode connecting portion first part 52a is not in contact with the capacitor portion 40, passes through an upper electrode connecting portion third part 52c provided at the upper portion of the capacitor portion 40, and then connects from the upper electrode connecting portion second part 52b to an upper electrode 42. Furthermore, a lower electrode connecting portion 51 penetrates through the capacitor portion 40 in top to bottom direction so that it is not in contact with the upper electrode 42 of the capacitor portion 40, but is in contact with a lower electrode 41. Therefore, the upper electrode connecting portion 52 and the lower electrode connecting portion 51 can be formed even after in process of build-up, the whole surface is covered by a high dielectric capacitor sheet that has a structure that a high dielectric layer is sandwiched between two metal foils and will afterwards serve as the capacitor portion 40.

Abstract translation: 在印刷电路板10中，上电极连接部52从上下方向贯通电容器部40，使上电极连接部第一部52a与电容部40不接触，通过上电极连接 部分第三部分52c设置在电容器部分40的上部，然后从上电极连接部分第二部分52b连接到上电极42.此外，下电极连接部分51穿过电容器部分40顶部到 使得它不与电容器部分40的上电极42接触，而是与下电极41接触。因此，上电极连接部分52和下电极连接部分51即使在 在堆积过程中，整个表面被具有高介电层结构的高介电电容片覆盖 夹在两个金属箔之间，然后用作电容器部分40。

公开(公告)号：EP1139705B1

公开(公告)日：2006-11-22

申请号：EP00956887.4

申请日：2000-09-01

Applicant: IBIDEN CO., LTD.

Inventor： INAGAKI, Yasushi, Ogaki-Kita-Kojou, Ibiden Co Ltd. ,  ASAI, Motoo, Ogaki-Kita-Kojou, Ibiden Co., Ltd. ,  WANG, Dongdong, Ogaki-Kita-Kojou, Ibiden Co. Ltd. ,  YABASHI, Hideo, Ogaki-Kita-Kojou, Ibiden Co., Ltd. ,  SHIRAI, Seiji, Ogaki-Kita-Kojou, Ibiden Co., Ltd.

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

公开(公告)号：EP1137332B1

公开(公告)日：2006-11-22

申请号：EP00956889.0

申请日：2000-09-01

Applicant: IBIDEN CO., LTD.

Inventor： INAGAKI, Yasushi, Ogaki-Kita-Kojou, Ibiden Co Ltd ,  ASAI, Motoo, Ogaki-Kita-Kojou, Ibiden Co Ltd ,  WANG, Dongdong, Ogaki-Kita-Kojou, Ibiden Co Ltd ,  YABASHI, Hideo, Ogaki-Kita-Kojou, Ibiden Co Ltd ,  SHIRAI, Seiji, Ogaki-Kita-Kojou, Ibiden Co Ltd

IPC: H05K1/18

CPC classification number: H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

Abstract: Arranging chip capacitors (20) in a printed wiring board (10) makes it possible to reduce the distance between an IC chip (90) and the chip capacitor (20) and to reduce the loop inductance. Further, since the chip capacitors (20) are received in a thick core board (30), there is no possibility of thickening the printed wiring board.

公开(公告)号：EP0776150B1

公开(公告)日：2006-06-07

申请号：EP96916328.6

申请日：1996-06-06

Applicant: IBIDEN CO, LTD.

Inventor： ASAI, Motoo, Ibiden Co., Ltd. ,  KAWADE, Masato, Ibiden Co., Ltd. ,  HIRATUKA, Shinji, Ibiden Co., Ltd.

IPC: H05K3/28

CPC classification number: H05K3/3457 ,  H05K1/112 ,  H05K3/184 ,  H05K3/3452 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2203/0588

Abstract: A printed wiring board suitable for reliable connections and reliable high-density mounting of components by using solder bumps. The printed wiring board has a mounting surface on which are formed pads coated with solder resist and having solder bumps. The position of the solder bump is coincident with the position of a via-hole, or the size of an opening disposed in the solder resist is made greater than a land diameter of the via-hole so that the solder resist does not overlap with the via-hole.