公开(公告)号：EP1705974A2

公开(公告)日：2006-09-27

申请号：EP06251492.2

申请日：2006-03-21

Applicant: Endicott Interconnect Technologies, Inc.

Inventor： Japp, Robert M. ,  Memis, Irving (NMN) ,  Papathomas, Kostas I.

IPC: H05K3/46 ,  H01L23/498

CPC classification number: H01L23/3735 ,  H01L23/145 ,  H01L23/3733 ,  H01L23/4922 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/564 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/068

Abstract: A circuitized substrate (21) including a composite layer (13') including a first dielectric sub-layer (13) including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer (31) of a low moisture absorptivity resin, the second dielectric sub-layer (31) not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof. An electrical assembly (81) and a method of making the substrate are also provided, as is an information handling system (101) (e.g., computer) incorporating the circuitized substrate (21) of the invention as part thereof.

Abstract translation: 电路化衬底（21）包括：包括第一电介质子层（13）的复合层（13“），其包括具有热膨胀和低水分的第二电介质子层（31）的系数低纤维的多元性 吸收性树脂，该第二电介质子层（31）不包括连续的或半连续的纤维等作为其一部分。 基底还包括至少一个导电层作为其组成部分。 因此，为了电气组件（81），使设置在底物，由于是结合了本发明的电路化衬底（21）作为其部分的信息处置系统（101）（例如，计算机）的方法。

公开(公告)号：EP1677585A1

公开(公告)日：2006-07-05

申请号：EP05704388.7

申请日：2005-01-28

Applicant: IBIDEN CO., LTD.

Inventor： KARIYA, Takashi ,  FURUTANI, Toshiki

IPC: H05K3/46

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/111 ,  H05K1/115 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/09881 ,  H05K2201/10674 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A multilayer printed wiring board 10 includes: a core substrate 20; a build-up layer 30 formed on the core substrate 20 and having a conductor pattern 32 on an upper surface; a low elastic modulus layer 40 formed on the build-up layer 30; lands 52 that are disposed on an upper surface of the low elastic modulus layer 40 and connected via solder bumps 66 to a semiconductor chip 70; and conductor posts 50 that are passing through the low elastic modulus layer 40 and electrically connecting lands 52 with conductor patterns 32. The conductor posts 50 are formed to have the diameters of an upper portion and a lower portion of 80µm, the diameter of an intermediate portion of 35µm, the height of 200µm, and the aspect ratio Rasp (height/minimum diameter) of 5.7 and the maximum diameter/minimum diameter of 2.3.

Abstract translation: 多层印刷线路板10包括：芯基板20; 形成在芯基板20上并且在上表面上具有导体图案32的堆积层30; 形成在积层30上的低弹性模量层40; 焊盘52设置在低弹性模量层40的上表面上并通过焊锡凸块66连接到半导体芯片70; 以及导体柱50，其穿过低弹性模量层40和电连接焊盘52与导体图案32.导体柱50形成为具有80μm的上部和下部的直径，中间部分的直径 35μm，高度200μm，纵横比Rasp（高/最小直径）为5.7，最大直径/最小直径为2.3。

公开(公告)号：EP0949067B1

公开(公告)日：2006-06-21

申请号：EP99106126.8

申请日：1999-04-06

Applicant: KURARAY CO., LTD.

Inventor： Tanaka, Yoshinobu ,  Tsudaka, Takeichi ,  Onodera, Minoru ,  Sato, Toshiaki

IPC: B32B37/00 ,  B32B15/08

CPC classification number: B32B15/08 ,  B32B38/10 ,  B32B2305/55 ,  B32B2309/02 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/462 ,  H05K3/4635 ,  H05K2201/0141 ,  H05K2201/0358 ,  H05K2201/068 ,  H05K2203/0264 ,  H05K2203/1536 ,  Y10T156/1059 ,  Y10T156/1911 ,  Y10T428/10 ,  Y10T428/1005 ,  Y10T428/1086 ,  Y10T428/31681

公开(公告)号：EP1668697A2

公开(公告)日：2006-06-14

申请号：EP04784570.6

申请日：2004-09-17

Applicant: MOTOROLA, INC.

Inventor： WALDVOGEL, John M. ,  BIELICK, Brian R. ,  MILLER, Herman J. ,  VAN CANNON, Billy J.

IPC: H01L23/10 ,  H01L23/12 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/0061 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/341 ,  H05K3/386 ,  H05K3/44 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2203/1178 ,  H01L2924/00

Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture (322) and at least one solder aperture (324), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract translation: 1。一种电路装置（300），包括：具有接地层（336），至少一个热孔径（332）和至少一个焊料孔（334）的基板（330）; 散热器（310）; 以及用于将所述散热器机械地耦合到所述基板的所述接地层的粘合剂层（320），使得所述至少一个基板热孔径的至少一部分与所述散热器重叠，所述粘合剂层具有至少一个热孔径（322 ）和至少一个焊料孔（324），其中将所述至少一个基板焊料孔与所述至少一个粘合剂层焊料孔对准并且将所述至少一个基板热孔与所述至少一个粘合剂层热孔对准使得焊料润湿 在散热器和基板的接地层之间的预定区域中。

公开(公告)号：EP1566263A1

公开(公告)日：2005-08-24

申请号：EP03769893.3

申请日：2003-10-09

Applicant: KANEKA CORPORATION

Inventor： KIKUCHI, Takashi ,  HASE, Naoki ,  TSUJI, Hiroyuki ,  FUSHIKI, Yasuo

IPC: B32B15/08

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B37/0007 ,  B32B37/26 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2309/105 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/068 ,  Y10T156/10 ,  Y10T428/31678 ,  Y10T428/31721

Abstract: A method for manufacturing a heat resistant flexible laminate effectively enabling avoidance of not only visual defects but occurrence of dimensional changes, and a heat resistant flexible laminate are provided. In a process for laminating a heat resistant adhesive material and a metallic foil by thermal lamination, a film-like protective material is disposed between a pressurized surface and the metallic foil at the time of thermal lamination. At this time, coefficients of linear expansion in a temperature range of 200 degree C to 300 degree C of the heat resistant adhesive material and the protective material are within a range of a coefficient of linear expansion of the metallic foil ± 10 ppm/degrees C. Thereby, occurrence of visual defects is not only effectively avoidable, but excellent dimensional change after etching may be exhibited.

Abstract translation: 本发明提供一种用于制造耐热柔性层压有效使不仅视觉缺陷但尺寸变化发生，耐热性软性层压板的避免方法。 在用于层压耐热粘合材料并通过热层合金属箔的方法，薄膜状保护材料的加压表面上并在热层压的时间内的金属箔之间布置。 此时，在一个温度范围内的耐热粘合材料200℃至300摄氏度和保护材料的线性膨胀系数是一个范围中的金属箔+/- 10ppm的的线性膨胀系数的内/ 摄氏度由此，视觉缺陷的发生是不仅有效可以避免的，但是蚀刻后优良的尺寸变化可以被显示出来。

公开(公告)号：EP1286579A4

公开(公告)日：2005-03-23

申请号：EP02705111

申请日：2002-03-13

Applicant: IBIDEN CO LTD

Inventor： TOYODA YUKIHIKO ,  KAWAMURA YOICHIRO ,  IKEDA TOMOYUKI

IPC: H01L21/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/116 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09745 ,  H01L2924/00

Abstract: A multilayer printed wiring board (100) which is excellent in reliability because of the short wiring distance of a conductor circuit, high freedom of conductor circuit design, and little possibility of cracks developing in an interlayer resin insulation layer in the vicinity of a via hole, and which comprises conductor circuits (105) and interlayer resin insulation layers (102) sequentially laminated on a substrate (101), conductor circuits sandwiching an interlayer resin insulation layer being connected via a via hole (107), characterized in that via holes in different hierarchies out of all the via holes are formed to be in a stack via structure, and at least one via hole (1072) out of the above via holes in different hierarchies has a land diameter different from those of other via holes (1071, 1073).

Abstract translation: 由于导体电路的布线距离短，导体电路设计的自由度高，在通孔附近的层间树脂绝缘层中产生裂纹的可能性小，因此可靠性优异的多层印刷布线板（100） （101）上依次层叠有导体电路（105）和层间树脂绝缘层（102），夹着层间树脂绝缘层的导体电路通过通孔（107）连接，其特征在于， 所有通孔中的不同层次形成为堆叠通孔结构，并且不同层次中的上述通孔中的至少一个通孔（1072）具有不同于其他通孔（1071， 1073）。

公开(公告)号：EP1473329A1

公开(公告)日：2004-11-03

申请号：EP03737474.1

申请日：2003-02-04

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： AKAHO, Kazunori ,  YONEZAWA, Koji ,  YAGI, Motohiro ,  FUJIWARA, Akihiko ,  SHIBAYAMA, Koichi ,  DEGUCHI, Hidenobu

IPC: C08L101/00 ,  C08K3/00 ,  B32B15/08 ,  H05K3/46 ,  H05K1/03

CPC classification number: C08K3/346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269

Abstract: Aresin composition, substratematerial, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties.
A resin composition containing 100 parts by weight of a thermosetting resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17 x 10 -3 [°C -1 ] over the temperature range from a temperature 10 °C higher than a glass transition temperature of the resin composition to a temperature 50 °C higher than the glass transition temperature of the resin composition.

Abstract translation: 提供了具有改进的机械性能，尺寸稳定性，耐热性和阻燃性，特别是高的耐热性和阻燃性的树脂组合物，基材，片材，层压板，含树脂铜箔，覆铜箔层压板，TAB带，印刷板， 温度物理性质。 树脂组合物含有100重量份热固性树脂和0.1-65重量份无机化合物，树脂组合物的平均线性膨胀系数（α2）高达17×10-3 [℃-1] 在比树脂组合物的玻璃化转变温度高10℃的温度至比树脂组合物的玻璃化转变温度高50℃的温度范围内。

公开(公告)号：EP1447846A2

公开(公告)日：2004-08-18

申请号：EP04010749.2

申请日：1995-11-13

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin, N. ,  Grube, Gary, W. ,  Dozier, Thomas, H.

IPC: H01L23/48 ,  H05K7/10 ,  H01R43/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: According to the invention a socket is provided for removably connecting a first electronic component (304) to a second electronic component (302). The socket comprises a plurality of elongate, resilient contact structures (320) extending away from a first surface (310a) of a support substrate (310), contact regions (320b) of said elongate, resilient contact structures (320) deflecting to form pressure connections with terminals (308) of the first electronic component (304); and a plurality of contact structures (314) disposed on the opposing surface (310b) of the support substrate (310), the plurality of contact structures permanently connected to terminals of the second electronic component (302), selected ones of the contact structures (314) are connected through the support substrate (310) to selected ones of the elongate, resilient contact structures (320). Each of the plurality of elongate contact structures of the socket comprises an elongate element (122) of a first material; and a second material (124) deposited on the first material, wherein the second material has a yield strength that is greater than a yield strength of the first material. Further a method for removably connecting a first electronic component (304) to a second electronic component (302) is provided.

Abstract translation: 根据本发明，提供了用于将第一电子部件（304）可拆卸地连接到第二电子部件（302）的插座。 插座包括从支撑衬底（310）的第一表面（310a）延伸的多个细长的弹性接触结构（320），所述细长弹性接触结构（320）的接触区域（320b）偏转以形成压力 与第一电子部件（304）的端子（308）的连接; 以及设置在所述支撑基板（310）的相对表面（310b）上的多个接触结构（314），所述多个接触结构永久地连接到所述第二电子部件（302）的端子，所述接触结构 314）通过支撑衬底（310）连接到细长的弹性接触结构（320）中的选定的一个。 插座的多个细长接触结构中的每一个包括第一材料的细长元件（122） 和沉积在第一材料上的第二材料（124），其中第二材料的屈服强度大于第一材料的屈服强度。 此外，提供了一种用于可拆卸地将第一电子部件（304）连接到第二电子部件（302）的方法。

公开(公告)号：EP1281299A1

公开(公告)日：2003-02-05

申请号：EP01923364.2

申请日：2001-04-03

Applicant: INTEL CORPORATION

Inventor： Searls Damion T. ,  SEARLS, Damion, T. ,  LIAN, Bin ,  DUJARI, Prateek

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/185 ,  H05K2201/068 ,  H05K2201/10083 ,  H05K2201/10151

Abstract: Piezoelectric material (120) is embedded in epoxy layers (220) of circuit cards (102) to control thermal expansion and contraction as a function of temperature changes. A temperature sensor (212) and thermostat (214) generates a controlled voltage as a function of temperature and applies the voltage to piezoelectric blocks (120) within the circuit card. Local areas of the circuit card can have different amounts of piezoelectric material (120) or different thermostats (214). Piezoelectric blocks (120) can be arranged in regular patterns or can be randomly or pseudorandomly placed.

公开(公告)号：EP1014766A3

公开(公告)日：2003-02-05

申请号：EP99125418.6

申请日：1999-12-20

Applicant: Sony Chemicals Corporation

Inventor： Takahashi, Satoshi ,  Namiki, Hidetsugu

IPC: H05K1/03 ,  B32B15/08

CPC classification number: H05K1/0346 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A flexible board comprises metal foil 1 and provided thereon a laminated polyimide-based resin layer 2 of a three-layer structure comprising a first polyimide-based resin layer 2a, a second polyimide-based resin layer 2b, and a third polyimide-based resin layer 2c, wherein the following equation is satisfied.k1 > k3 > k2, where k 1 is the coefficient of linear thermal expansion of the first polyimide-based resin layer 2a on the side of the metal foil 1, k 2 is the coefficient of linear thermal expansion of the second polyimide-based resin layer 2b, and k 3 is the coefficient of linear thermal expansion of the third polyimide-based resin layer 2c.

Abstract translation: 柔性基板包括金属箔1，并且在其上提供三层结构的叠层的聚酰亚胺基树脂层2，其包括第一聚酰亚胺基树脂层2a，第二聚酰亚胺基树脂层2b和第三聚酰亚胺基树脂 层2c，其中满足以下等式。 其中，k1是金属箔1侧的第一聚酰亚胺系树脂层2a的线性热膨胀系数，k2是第二聚酰亚胺系树脂层2b的线热膨胀系数，k3 是第三聚酰亚胺系树脂层2c的线热膨胀系数。