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    HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
    散热基板及其制造方法

    公开(公告)号：US20110114369A1

    公开(公告)日：2011-05-19

    申请号：US12717855

    申请日：2010-03-04

    申请人： Sang Youp LEE ,  Joung Gul Ryu ,  Dong Sun Kim ,  Jae Hoon Choi ,  In Ho Seo

    发明人： Sang Youp LEE ,  Joung Gul Ryu ,  Dong Sun Kim ,  Jae Hoon Choi ,  In Ho Seo

    IPC分类号： H05K7/20 ,  C25D5/00

    CPC分类号： H05K3/4007 ,  C25D5/02 ,  C25D5/12 ,  C25D5/48 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0338 ,  H05K2203/0361 ,  Y10T29/302 ,  Y10T29/417 ,  H01L2924/00

    摘要： Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin.

    摘要翻译： 本发明公开了一种散热基板，其特征在于，包括：散热电路层，其由形成在所述凹凸层的两面上的不锈钢层和电解铜镀层构成， 绝热层，形成在散热电路层的两侧，使得散热电路层插入在绝缘层之间; 形成在绝缘层上的第一和第二电路层; 以及将散热电路层与第一电路层连接的第一凸块和将散热电路层与第二电路层连接的第二凸块。 散热基板表现出优异的散热效率并且可以变薄。

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20110127073A1

    公开(公告)日：2011-06-02

    申请号：US12755825

    申请日：2010-04-07

    申请人： Joung-Gul Ryu ,  Sang-Youp Lee ,  Dong-Sun Kim ,  Jae-Hoon Choi ,  In-Ho Seo ,  Joon-Sung Lee

    发明人： Joung-Gul Ryu ,  Sang-Youp Lee ,  Dong-Sun Kim ,  Jae-Hoon Choi ,  In-Ho Seo ,  Joon-Sung Lee

    IPC分类号： H05K1/09 ,  H05K3/46

    CPC分类号： H05K3/4608

    摘要： A printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a metal core having Invar layers formed on either surface of a copper layer, an insulation layer, which is formed on one surface of the metal core, and a circuit pattern, which is coupled to one surface of the insulation layer. Thus, the printed circuit board can improve thermal conductivity and deformation resistance against warpage.

    摘要翻译： 公开了印刷电路板及其制造方法。 根据本发明的实施例，印刷电路板包括在铜层的任一表面上形成的具有殷钢层的金属芯，形成在金属芯的一个表面上的绝缘层和电路图案， 其耦合到绝缘层的一个表面。 因此，印刷电路板可以提高导热性和抗翘曲变形性。

    CORE SUBSTRATE AND METHOD OF MANUFACTURING CORE SUBSTRATE
    7.
    发明申请
    CORE SUBSTRATE AND METHOD OF MANUFACTURING CORE SUBSTRATE 审中-公开
    核心基板及制造核心基板的方法

    公开(公告)号：US20110123772A1

    公开(公告)日：2011-05-26

    申请号：US12755857

    申请日：2010-04-07

    申请人： Sang-Youp Lee ,  Joung-Gul Ryu ,  Dong-Sun Kim ,  Jae-Hoon Choi ,  In-Ho Seo ,  Joon-Sung Lee

    发明人： Sang-Youp Lee ,  Joung-Gul Ryu ,  Dong-Sun Kim ,  Jae-Hoon Choi ,  In-Ho Seo ,  Joon-Sung Lee

    IPC分类号： B32B3/28 ,  B44C3/02

    CPC分类号： B32B7/12 ,  B32B3/266 ,  B32B15/08 ,  B32B27/06 ,  B32B27/34 ,  Y10T156/1039 ,  Y10T428/24479

    摘要： A core substrate and a method of manufacturing the core substrate are disclosed. In accordance with an embodiment of the present invention, the core substrate includes an adhesive resin layer having a mineral filler added therein, a metal sheet, which is patterned and embedded in the adhesive resin layer, and an insulation layer, which is stacked on both surfaces of the adhesive resin layer. Since a through-hole is formed to correspond to the number of via holes in accordance with a higher density of a printed circuit board, no conventional land is required to be formed, thereby reducing the defect of eccentricity.

    摘要翻译： 公开了芯基板和芯基板的制造方法。 根据本发明的实施例，芯基板包括其中添加有矿物填料的粘合树脂层，被图案化并嵌入粘合树脂层中的金属片和层叠在两者上的绝缘层 粘合树脂层的表面。 由于根据印刷电路板的较高密度形成通孔以对应于通孔的数量，所以不需要形成常规的焊盘，从而减少偏心的缺陷。

    Metal core package substrate and method for manufacturing the same
    8.
    发明申请
    Metal core package substrate and method for manufacturing the same 审中-公开
    金属芯封装基板及其制造方法

    公开(公告)号：US20090288293A1

    公开(公告)日：2009-11-26

    申请号：US12232995

    申请日：2008-09-26

    申请人： Sang Youp Lee ,  Keung Jin Sohn ,  Joung Gul Ryu ,  Jung Hwan Park ,  Ho Sik Park ,  Jun Hyeong Park

    发明人： Sang Youp Lee ,  Keung Jin Sohn ,  Joung Gul Ryu ,  Jung Hwan Park ,  Ho Sik Park ,  Jun Hyeong Park

    IPC分类号： H01R43/16

    CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K2201/0355 ,  H05K2203/1189 ,  H05K2203/1461 ,  Y10T29/49204

    摘要： A metal core package substrate and a method for manufacturing the same. A method for manufacturing a metal core package substrate may include: forming a plurality of holes in a metal core; forming a plurality of paste bumps piercing into insulation layers of a first copper foil layer and a second copper foil layer; positioning the first and second copper foil layers at positions corresponding to the holes of the metal core so that the paste bumps are opposed to each other around the metal core; allowing each paste bump to pierce into the holes of the metal core by pressing the first and second copper foil layers; and forming inner circuits in the metal core pierced with the paste bumps.

    摘要翻译： 金属芯封装基板及其制造方法。 金属芯封装基板的制造方法可以包括：在金属芯中形成多个孔; 形成穿过第一铜箔层和第二铜箔层的绝缘层的多个焊料凸块; 将第一和第二铜箔层定位在与金属芯的孔对应的位置处，使得焊膏凸起彼此围绕金属芯相对; 通过按压第一和第二铜箔层，允许每个焊膏凸起穿入金属芯的孔中; 并且在金属芯中形成用该焊膏凸起的内部电路。

    Method of manufacturing a printed circuit board
    10.
    发明授权
    Method of manufacturing a printed circuit board 有权
    印刷电路板的制造方法

    公开(公告)号：US08499441B2

    公开(公告)日：2013-08-06

    申请号：US12010645

    申请日：2008-01-28

    申请人： Jung-Hwan Park ,  Keungjin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Ho-Sik Park ,  Joung-Gul Ryu

    发明人： Jung-Hwan Park ,  Keungjin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Ho-Sik Park ,  Joung-Gul Ryu

    IPC分类号： H01R9/00 ,  H05K3/00

    CPC分类号： H05K3/4614 ,  H05K1/113 ,  H05K3/108 ,  H05K3/205 ,  H05K3/243 ,  H05K3/281 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2203/0152 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier onto an insulation layer stacked in an inner substrate, such that the conductive post faces the insulation layer; and removing the carrier. As the conductive posts are pressed into the insulation layers to implement interlayer connections, certain drilling processes for forming via holes may be omitted, so that the degree of freedom can be increased in designing the circuits, and the circuits can be made to have greater densities. As the circuit patterns are buried in the insulation layers, the board can be made thinner, and the attachment areas can be increased, to allow greater adhesion.

    摘要翻译： 制造印刷电路板的方法包括在载体的一侧上堆叠阻焊层; 在阻焊层上形成包括第一电极焊盘的第一电路图案; 在所述第一电极焊盘上形成导电柱; 将载体堆叠并压制在层叠在内基板中的绝缘层上，使得导电柱面向绝缘层; 并移除载体。 由于导电柱被压入绝缘层以实现层间连接，因此可以省略用于形成通孔的某些钻孔工艺，从而可以在设计电路时增加自由度，并且可以使电路具有更大的密度 。 由于电路图案被埋在绝缘层中，所以可以使板更薄，并且可以增加附接区域，以允许更大的附着力。