公开(公告)号：US20050040540A1

公开(公告)日：2005-02-24

申请号：US10901407

申请日：2004-07-28

申请人： Belgacem Haba ,  Jae Park ,  Teck-Gyu Kang ,  Nicholas Colella

发明人： Belgacem Haba ,  Jae Park ,  Teck-Gyu Kang ,  Nicholas Colella

IPC分类号： H01L21/60 ,  H01L23/48

CPC分类号： H01L24/16 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13655 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.

摘要翻译： 诸如半导体芯片的微电子元件具有弹簧，例如键合到触点的螺旋弹簧，使得弹簧用作与电路板的电连接。 该单元可以容易地测试，并且可以通过将远离微电子元件的弹簧的远端粘合到面板上而被表面安装到电路板。 弹簧也可以用作天线，以便提供小型化的相控阵列。

公开(公告)号：US20050279916A1

公开(公告)日：2005-12-22

申请号：US11120711

申请日：2005-05-03

申请人： Teck-Gyu Kang ,  Michael Estrella ,  Jae Park ,  Kenneth Thompson ,  Craig Mitchell ,  Belgacem Haba

发明人： Teck-Gyu Kang ,  Michael Estrella ,  Jae Park ,  Kenneth Thompson ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L27/00 ,  H01L27/146 ,  H01L31/0203 ,  H04N5/225

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H04M2250/52 ,  H04N5/2253 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/00

摘要： An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.

摘要翻译： 公开了一种降低已知图像传感器封装的总体尺寸的图像传感器封装。 图像传感器封装包括图像传感器和图像传感器控制器，其布置在基板上，使得图像传感器和图像传感器控制器的表面彼此直接相邻。 根据本发明的包装通过允许图像传感器控制器的至少一个表面和图像传感器的至少一个表面直接附接或彼此连接来减少包装中的空间量。 各向异性导电材料性质的导电材料也优选以粘合剂层的形式施加到基底上，以允许图像传感器控制器和图像传感器彼此电连通。

公开(公告)号：US20080003402A1

公开(公告)日：2008-01-03

申请号：US11717587

申请日：2007-03-13

申请人： Belgacem Haba ,  Yoichi Kubota ,  Teck-Gyu Kang ,  Jae Park

发明人： Belgacem Haba ,  Yoichi Kubota ,  Teck-Gyu Kang ,  Jae Park

IPC分类号： C23F1/00 ,  B32B7/00

CPC分类号： H01L24/14 ,  H01L21/4828 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/061 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0369 ,  H05K2203/0597 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T428/24174 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.

摘要翻译： 一种方法包括将最终的耐蚀刻材料施加到工艺衬底，使得最终耐蚀刻材料至少部分地覆盖与衬底成一体的第一微接触部分并从衬底的表面向上突出，并且蚀刻表面 衬底，以便将第二微接触部分留在第一微接触部分下方并与之成一体，最后的抗蚀刻材料在另外的蚀刻步骤期间至少部分地保护第一微接触部分免受蚀刻。 微电子单元包括衬底以及从衬底沿垂直方向突出的多个微接点，每个微接触器包括邻近衬底的基极区域和远离衬底的尖端区域，每个微接触体具有作为第一功能的水平尺寸 在基部区域中垂直位置，并且其是尖端区域中垂直位置的第二函数。

公开(公告)号：US20050284658A1

公开(公告)日：2005-12-29

申请号：US11166982

申请日：2005-06-24

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae Park ,  Belgacem Haba

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。

公开(公告)号：US08618659B2

公开(公告)日：2013-12-31

申请号：US13462158

申请日：2012-05-02

申请人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L23/48

CPC分类号： H01L21/4885 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

摘要翻译： 微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。 微电子元件覆盖在第一表面上，并且第一导电元件暴露在第一表面和第二表面中的一个处。 一些第一导电元件电连接到微电子元件。 线接合具有连接到远离基板和基座的导电元件和端表面的基部，每个引线接合限定在基部和端表面之间延伸的边缘表面。 封装层从第一表面延伸并填充引线键合之间的空间，使得引线键合被封装层分离。 引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。

公开(公告)号：US08329581B2

公开(公告)日：2012-12-11

申请号：US13183122

申请日：2011-07-14

申请人： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

发明人： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

IPC分类号： H01L21/44

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.

摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。

公开(公告)号：US20120280386A1

公开(公告)日：2012-11-08

申请号：US13462158

申请日：2012-05-02

申请人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

发明人： Hiroaki Sato ,  Teck-Gyu Kang ,  Belgacem Haba ,  Philip R. Osborn ,  Wei-Shun Wang ,  Ellis Chau ,  Ilyas Mohammed ,  Norihito Masuda ,  Kazuo Sakuma ,  Kiyoaki Hashimoto ,  Kurosawa Inetaro ,  Tomoyuki Kikuchi

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L21/50 ,  H01L23/48

CPC分类号： H01L21/4885 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

摘要翻译： 微电子组件包括具有第一表面和远离第一表面的第二表面的衬底。 微电子元件覆盖在第一表面上，并且第一导电元件暴露在第一表面和第二表面中的一个处。 一些第一导电元件电连接到微电子元件。 线接合具有连接到远离基板和基座的导电元件和端表面的基部，每个引线接合限定在基部和端表面之间延伸的边缘表面。 封装层从第一表面延伸并填充引线键合之间的空间，使得引线键合被封装层分离。 引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。

公开(公告)号：US08133808B2

公开(公告)日：2012-03-13

申请号：US11522885

申请日：2006-09-18

申请人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

发明人： Teck-Gyu Kang ,  Belgacem Haba ,  Guilian Gao

IPC分类号： H01L21/44

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11334 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2224/29099

摘要： Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.

摘要翻译： 公开了包括具有倾斜侧壁的立管和制造这种芯片封装的方法的晶片级芯片封装。 本发明的晶片级芯片封装可有利地用于各种微电子组件中。

公开(公告)号：US20100193970A1

公开(公告)日：2010-08-05

申请号：US12759196

申请日：2010-04-13

申请人： Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

发明人： Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

摘要： A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

摘要翻译： 微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：US20090133254A1

公开(公告)日：2009-05-28

申请号：US12321210

申请日：2009-01-16

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

IPC分类号： H05K3/02

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。