公开(公告)号：US07589400B2

公开(公告)日：2009-09-15

申请号：US11206166

申请日：2005-08-18

申请人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

发明人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H02M7/003 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L24/95 ,  H01L25/072 ,  H01L2224/16245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/0401

摘要： The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer.Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.

摘要翻译： 逆变器具有用于导通或切断电流的多个臂，并且每个臂具有开关装置和用于连接开关装置的第一和第二布线层。 每个臂的第一和第二布线层分别形成在绝缘基板上，并且开关装置的一个面固定到第一布线层，并且第二布线层和开关装置的另一个面通过层叠电连接 导体和层状导体具有第一和第二连接，并且所述层叠导体的第一连接固定到所述开关装置的另一面，并且所述层叠导体的第二连接固定到所述第二布线层。 由此，可以实现逆变器的大电流，并且可以提高逆变器或车辆驱动单元的组装能力。

公开(公告)号：US20060071860A1

公开(公告)日：2006-04-06

申请号：US11206166

申请日：2005-08-18

申请人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

发明人： Hiroshi Hozoji ,  Toshiaki Morita ,  Satoru Shigeta ,  Tokihito Suwa

IPC分类号： H01Q1/38

CPC分类号： H02M7/003 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/91 ,  H01L24/95 ,  H01L25/072 ,  H01L2224/16245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/37644 ,  H01L2224/37655 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/0401

摘要： The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer. Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.

公开(公告)号：US08723306B2

公开(公告)日：2014-05-13

申请号：US13811722

申请日：2011-07-25

申请人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

发明人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  B60L1/003 ,  B60L3/003 ,  B60L7/14 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/525 ,  H01L21/56 ,  H01L21/565 ,  H01L23/473 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/37011 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation surfaces 7b and 8b and a surface 13b of a mold material (sealing material 13) adjacent to the exposed area produce an uneven step from which either one of the exposed area and the surface 13b adjacent to the exposed area projects. The step side surface formed between the convex surface and the concave surface of the uneven step has an inclined surface 7a or 13a so configured that an obtuse angle can be formed by the inclined surface and the convex surface and by the inclined surface and the concave surface for each.

摘要翻译： 电极引线框架7和8的散热表面7b和8b通过绝缘片10与热辐射部件301热接触，以将热量从功率半导体元件5散发到散热部件（厚部分301）。 辐射表面7b和8b的每个暴露区域和与暴露区域相邻的模具材料（密封材料13）的表面13b产生不均匀的步骤，露出区域和表面13b中的任一个与暴露的 区域项目。 在凹凸台面的凸面与凹面之间形成的台阶侧表面具有倾斜面7a，13a，该倾斜面7a，13a可以由倾斜面和凸面以及倾斜面和凹面形成钝角 为每一个。

公开(公告)号：US20060202324A1

公开(公告)日：2006-09-14

申请号：US11348248

申请日：2006-02-07

申请人： Keita Hashimoto ,  Tokihito Suwa ,  Sadashi Seto ,  Satoru Shigeta ,  Shinichi Fujino

发明人： Keita Hashimoto ,  Tokihito Suwa ,  Sadashi Seto ,  Satoru Shigeta ,  Shinichi Fujino

IPC分类号： H01L23/34

CPC分类号： H01L23/057 ,  H01L21/4882 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A semiconductor power module has insulative substrate which is configured with a metal wiring pattern formed on an upper first surface thereof, a metal conductor formed on a rear face, opposite the first surface and an insulative layer between the metal wiring pattern and the metal conductor. A semiconductor chip is joined to the metal wiring pattern formed on the first surface of the insulative substrate, using Pb-free solder with a low melting point. A heat sink is bonded to the metal conductor formed on the other surface of the insulative substrate, using a highly heat conductive adhesive having a thermal conductivity of 2 W/(mK) or more.

摘要翻译： 半导体功率模块具有绝缘性基板，其具有形成在其第一表面上的金属布线图案，形成在与第一表面相对的背面上的金属导体和金属布线图案与金属导体之间的绝缘层。 使用低熔点的无铅焊料将半导体芯片接合到形成在绝缘基板的第一表面上的金属布线图案。 使用热导率为2W /（m·K）以上的高导热性粘接剂将散热器接合在形成于绝缘基板的另一面的金属导体上。

公开(公告)号：US20130119525A1

公开(公告)日：2013-05-16

申请号：US13811722

申请日：2011-07-25

申请人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

发明人： Nobutake Tsuyuno ,  Hiroshi Hozoji ,  Toshiaki Ishii ,  Tokihito Suwa ,  Kinya Nakatsu ,  Takeshi Tokuyama ,  Junpei Kusukawa

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49568 ,  B60L1/003 ,  B60L3/003 ,  B60L7/14 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/525 ,  H01L21/56 ,  H01L21/565 ,  H01L23/473 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/37011 ,  H01L2224/4007 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation surfaces 7b and 8b and a surface 13b of a mold material (sealing material 13) adjacent to the exposed area produce an uneven step from which either one of the exposed area and the surface 13b adjacent to the exposed area projects. The step side surface formed between the convex surface and the concave surface of the uneven step has an inclined surface 7a or 13a so configured that an obtuse angle can be formed by the inclined surface and the convex surface and by the inclined surface and the concave surface for each.

摘要翻译： 电极引线框架7和8的散热表面7b和8b通过绝缘片10与热辐射部件301热接触，以将热量从功率半导体元件5散发到散热部件（厚部分301）。 辐射表面7b和8b的每个暴露区域和与暴露区域相邻的模具材料（密封材料13）的表面13b产生不均匀的步骤，露出区域和表面13b中的任一个与暴露的 区域项目。 在凹凸台面的凸面与凹面之间形成的台阶侧表面具有倾斜面7a，13a，该倾斜面7a，13a可以由倾斜面和凸面以及倾斜面和凹面形成钝角 为每一个。

公开(公告)号：US20050147839A1

公开(公告)日：2005-07-07

申请号：US11028582

申请日：2005-01-05

申请人： Tokihito Suwa ,  Satoru Shigeta ,  Shinji Shirakawa ,  Yoshitaka Ochiai

发明人： Tokihito Suwa ,  Satoru Shigeta ,  Shinji Shirakawa ,  Yoshitaka Ochiai

IPC分类号： H01L23/36 ,  B60W10/08 ,  H01L23/367 ,  H01L23/48 ,  H01L23/488 ,  H01L25/07 ,  H05K3/32 ,  B32B31/00

CPC分类号： B60K6/26 ,  B60K6/48 ,  B60W10/08 ,  H01L23/367 ,  H01L23/48 ,  H01L23/488 ,  H01L25/072 ,  H01L2224/05554 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H05K3/321 ,  H05K2201/0373 ,  H05K2201/1028 ,  Y02T10/6221 ,  Y10T428/12556 ,  H01L2924/00

摘要： In order to solve the issue mentioned above, the present invention is featured in electrically conductive adhesive sheet: wherein the substrate 1 which composes electrically, thermally, or electrically and thermally conducting paths in a direction along the plane of the sheet is formed of metallic foil having a coefficient of thermal expansion between the coefficient of thermal expansion of one of at least two bonded members and the coefficient of thermal expansion of another one of the bonded members. In accordance with the present invention adopting the composition mentioned above, a stress applied to the protrusion layer 2, which composes electrically, thermally, or both electrically and thermally conducting paths between the substrate 1 and the bonded members by difference in thermal expansion, can be moderated.

摘要翻译： 为了解决上述问题，本发明的特征在于导电性粘合片：其特征在于，沿着所述片材的平面的方向构成电，热或导电或导热的路径的基板1由金属箔 具有至少两个接合构件中的一个的热膨胀系数与另一个接合构件的热膨胀系数之间的热膨胀系数。 根据采用上述组合物的本发明，通过热膨胀差异，施加到基板1和结合部件之间的导电，热或导电路径的突起层2的应力可以是 主持人

公开(公告)号：US09277682B2

公开(公告)日：2016-03-01

申请号：US13807277

申请日：2011-06-29

申请人： Yujiro Kaneko ,  Tokihito Suwa

发明人： Yujiro Kaneko ,  Tokihito Suwa

IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L21/50 ,  H01L23/433 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18 ,  H01L23/00

CPC分类号： H05K7/209 ,  H01L21/50 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L24/34 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A power module includes a power unit equipped with plural power semiconductor devices, heat sinks, and a housing case. The power unit includes the power semiconductor devices, lead frames, and a sealing resin. The lead frames are coupled to the surfaces of each of the power semiconductor devices, and parts of the external surfaces of the upper and lower lead frames are bared out of the sealing resin. The housing case includes a housing base and a housing cover. The housing base, heat sink, power unit, heat sink, and housing cover are layered in that order. Assuming that S1 denotes the outline size of the housing base, S2 denotes the outline size of the housing cover, S3 denotes the size of the lead frame bared part of the power unit, the relationship of S1>S2>S3 is established. The housing cover is pressed and fixed to a receiving part of the housing base.

摘要翻译： 功率模块包括配备有多个功率半导体器件，散热器和壳体的功率单元。 功率单元包括功率半导体器件，引线框架和密封树脂。 引线框架耦合到每个功率半导体器件的表面，并且上引线框架和下引线框架的外表面的部分从密封树脂中露出。 壳体包括壳体基座和壳体盖。 壳体基座，散热器，动力单元，散热器和外壳盖按顺序分层。 假设S1表示壳体基座的外形尺寸，S2表示外壳盖的轮廓尺寸，S3表示功率单元的引线框架裸露部分的尺寸，建立S1> S2> S3的关系。 壳体盖被按压并固定到壳体基座的接收部分。

公开(公告)号：US09179581B2

公开(公告)日：2015-11-03

申请号：US13163950

申请日：2011-06-20

申请人： Tokihito Suwa ,  Yujiro Kaneko ,  Yusuke Takagi ,  Shinichi Fujino ,  Takahiro Shimura

发明人： Tokihito Suwa ,  Yujiro Kaneko ,  Yusuke Takagi ,  Shinichi Fujino ,  Takahiro Shimura

IPC分类号： H05K7/00 ,  H05K7/20 ,  H01L23/473 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC分类号： H05K5/0247 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/473 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/537 ,  H05K7/1432 ,  H05K7/20845 ,  H05K7/2089 ,  H05K7/20927 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099 ,  H01L2224/37599 ,  H01L2224/84

摘要： A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.

摘要翻译： 功率半导体装置包括构成逆变器电路的上臂和下臂的多个功率半导体元件，密封多个功率半导体元件的第一密封构件，正极侧端子和负极侧端子 并且从所述第一密封部件突出的第二密封部件，密封所述正极侧端子和所述负极侧端子的至少一部分的至少一部分的第二密封部件，其中， 容纳用第一密封构件密封的功率半导体元件。

公开(公告)号：US20140168901A1

公开(公告)日：2014-06-19

申请号：US14237975

申请日：2012-08-09

申请人： Eiichi Ide ,  Eiji Nishioka ,  Toshiaki Ishii ,  Junpei Kusukawa ,  Kinya Nakatsu ,  Tokihito Suwa

发明人： Eiichi Ide ,  Eiji Nishioka ,  Toshiaki Ishii ,  Junpei Kusukawa ,  Kinya Nakatsu ,  Tokihito Suwa

IPC分类号： H05K7/20

CPC分类号： H05K7/209 ,  B60L1/003 ,  B60L1/02 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L15/007 ,  B60L15/2036 ,  B60L2200/26 ,  B60L2200/42 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/12 ,  B60L2240/24 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2240/525 ,  B60L2250/16 ,  B60L2250/24 ,  B60L2250/26 ,  B60L2260/28 ,  H01L21/565 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49524 ,  H01L23/49575 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/29139 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/37157 ,  H01L2224/3716 ,  H01L2224/3718 ,  H01L2224/3754 ,  H01L2224/40137 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/203 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/003 ,  H05K7/20927 ,  Y02P90/60 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7077 ,  Y02T10/7241 ,  Y02T10/7275 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2224/45099

摘要： A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.

摘要翻译： 功率模块包括密封体，其中半导体芯片安装的导体板以暴露的导体板的散热表面的方式被树脂密封，散热构件被布置成面对散热表面 以及设置在密封体和散热构件之间的绝缘层。 绝缘层具有层叠体，其通过层叠浸渍树脂浸渍的陶瓷热喷涂膜和粘合树脂层而制成，其中混合具有良好导热性的填料，并且被设置成与散热构件接触 以及至少全部的散热面，以及设置在散热构件和密封体之间的间隙中以覆盖层叠体的整个周向端部的应力消除树脂部。

公开(公告)号：US07990085B2

公开(公告)日：2011-08-02

申请号：US12133088

申请日：2008-06-04

申请人： Kimihisa Furukawa ,  Satoru Kaneko ,  Tokihito Suwa ,  Yuuichirou Takamune ,  Satoru Ohno ,  Kenta Katsuhama ,  Katsuyo Tsushima

发明人： Kimihisa Furukawa ,  Satoru Kaneko ,  Tokihito Suwa ,  Yuuichirou Takamune ,  Satoru Ohno ,  Kenta Katsuhama ,  Katsuyo Tsushima

IPC分类号： H02P7/32 ,  H02P7/34

CPC分类号： B60L11/14 ,  B60K6/46 ,  B60L2210/20 ,  B60W10/08 ,  B60W20/00 ,  H02P9/10 ,  Y02T10/6217 ,  Y02T10/642 ,  Y02T10/70 ,  Y02T10/7077 ,  Y02T10/725

摘要： An object of the present invention is to provide a generator control unit having improved voltage response in a system which is not provided with a battery in a DC output unit.In order to control the DC voltage of the DC voltage output terminal in a state where an electric load is connected to the DC voltage output terminal of a power generation unit, a PWM signal generation unit 429 generates a field voltage to be applied to a field winding terminal of the power generation unit. A feedback control unit 422 calculates a field voltage command value to be given to the PWM signal generation unit 429. Further, the feedback control unit 422 includes a PT control unit 423 which calculates a voltage deviation between a DC voltage detection value and a DC voltage command value to generate the field voltage command value through a PI operation based on the voltage deviation. The feedback control unit 422 includes compensation units 424 and 425 which generate a field voltage command value after compensating the output of the PT control unit 423 for the voltage deviation based on input/output transfer characteristics of the generator from the field voltage to the DC voltage.

摘要翻译： 本发明的目的是提供一种在直流输出单元中没有设置电池的系统中具有改进的电压响应的发电机控制单元。 为了在电力负载连接到发电单元的直流电压输出端子的状态下控制直流电压输出端子的直流电压，PWM信号生成单元429产生施加到场的场电压 发电机组的绕组端子。 反馈控制单元422计算要提供给PWM信号生成单元429的场电压指令值。此外，反馈控制单元422包括PT控制单元423，其计算直流电压检测值和直流电压之间的电压偏差 指令值通过基于电压偏差的PI运算来产生励磁电压指令值。 反馈控制单元422包括补偿单元424和425，其补偿了基于发电机的输入/输出传递特性的电压偏差的PT控制单元423的输出，从场电压到直流电压之后产生场电压指令值 。