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公开(公告)号：US06399897B1
公开(公告)日：2002-06-04
申请号：US09631683
申请日：2000-08-02
IPC分类号： H01R909
CPC分类号： H05K1/0271 , H01L23/49822 , H01L23/49838 , H01L2224/16 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H05K3/4647 , H05K2201/09781 , H01L2224/0401
摘要： A multi-layer wiring substrate includes a main substrate and a plurality of insulating films stacked on the main substrate. The plurality of insulating films have wiring patterns formed on wiring regions thereof and dummy wiring patterns formed on peripheral regions of the wiring regions. The wiring patterns include signal wiring patterns, power supply wiring patterns, and vias. The dummy wiring patterns correspond to the wiring patterns, respectively.
摘要翻译： 多层布线基板包括主基板和堆叠在主基板上的多个绝缘膜。 多个绝缘膜具有在其布线区域上形成的布线图案和形成在布线区域的周边区域上的虚拟布线图案。 布线图案包括信号布线图案，电源布线图形和通孔。 虚设布线图案分别对应于布线图案。
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2.发明授权公开(公告)号：US06465085B1
公开(公告)日：2002-10-15
申请号：US09699569
申请日：2000-10-31
申请人： Zhiyi Song , Kiyokazu Moriizumi , Takami Sasahara , Norikazu Ozaki , Manabu Watanabe , Misao Umematsu , Shunichi Kikuchi
发明人： Zhiyi Song , Kiyokazu Moriizumi , Takami Sasahara , Norikazu Ozaki , Manabu Watanabe , Misao Umematsu , Shunichi Kikuchi
IPC分类号： B32B300
CPC分类号： H05K3/4605 , H01L23/5383 , H01L23/5386 , H01L24/11 , H01L2224/16225 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H05K1/0306 , H05K3/225 , H05K3/243 , H05K3/388 , H05K3/4647 , H05K3/467 , H05K2201/09781 , H05K2203/025 , H05K2203/072 , H05K2203/0733 , Y10T428/24917 , Y10T428/24926 , H01L2924/00 , H01L2224/0401
摘要： A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.
摘要翻译： 通过聚酰亚胺绝缘层形成虚拟焊盘，以与形成在陶瓷基板的表面上的通孔连接焊盘相对设置。 当形成虚拟焊盘时，在通孔连接焊盘中出现的缺陷被填充有突起。 因此，防止缺陷对虚拟垫上方的层的影响。 此外，在通过在具有允许层间导电的通孔的基底基板上形成薄膜层而获得的薄膜布线基板的制造方法中，存在于通孔中的空隙缺陷填充有耐腐蚀性的导电材料 蚀刻剂，然后在基底基板上形成薄膜层。
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3.发明授权Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding 失效半导体器件包括通过倒装芯片接合安装的半导体裸芯片，以及通过倒装芯片焊接安装的用于半导体裸芯片的薄膜结构电容器的板构件公开(公告)号：US06891247B2
公开(公告)日：2005-05-10
申请号：US10177672
申请日：2002-06-24
申请人： Shunichi Kikuchi , Misao Umematsu
发明人： Shunichi Kikuchi , Misao Umematsu
CPC分类号： H01L23/642 , H01L23/481 , H01L23/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/17181 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/19104 , H01L2924/19105 , H01L2924/3011 , Y10S257/924 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device includes a semiconductor bare chip and an electrically-insulative board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back surface thereof. The semiconductor bare chip is mounted on a circuit board by flip-chip bonding. The board member includes a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and the grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back surface of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.
摘要翻译： 半导体器件包括半导体裸芯片和具有薄膜结构电容器的电绝缘板部件。 半导体裸芯片的背面具有电源端子和接地端子。 半导体裸芯片通过倒装芯片接合安装在电路板上。 板构件包括板和设置在板上的薄膜结构电容器。 电容器具有对应于其上的半导体裸芯片的电源端子和接地端子的端子。 提供电容器的电路板部件的一侧与半导体裸芯片的背面接合。 电容器的端子电连接到半导体裸芯片的电源端子和接地端子。
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公开(公告)号：US06303877B2
公开(公告)日：2001-10-16
申请号：US09109912
申请日：1998-07-02
IPC分类号： H01R909
CPC分类号： H05K1/115 , H01L23/49816 , H01L23/5384 , H01L2224/16225 , H01L2924/15322 , H05K1/113 , H05K3/467 , H05K2201/096 , H05K2201/0979
摘要： A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.
摘要翻译： 一种多层薄膜布线板，包括设置有多个布线层的基材和层叠在基材上的绝缘层，并且包括通过层叠布线层而形成的通孔，以便通过绝缘层提供。 通过在形成通孔的布线层之一中形成多个分支来提供多个分支通孔，多个分支通孔沿着基材的延伸方向放置。 多个分支通孔连接到放置在最接近基材的位置的多个布线层中的一个。
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公开(公告)号：US6054652A
公开(公告)日：2000-04-25
申请号：US942387
申请日：1997-10-10
IPC分类号： H05K3/34 , H01L23/12 , H01L23/498 , H01L23/538 , H05K1/00 , H05K1/11 , H05K3/46 , H01R12/04 , H01R12/32
CPC分类号： H01L23/5384 , H01L23/49811 , H05K1/112 , H01L2224/16225 , H01L2924/01079 , H01L2924/15312 , H01L2924/1532 , H05K1/0298 , H05K2201/09472 , H05K2201/09509 , H05K2201/10318 , H05K3/467
摘要： The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on the substrate base plate. A via structure is formed in the thin-film structure and connected to one of the conducting layers of the thin-layer structure. Pins are connected to the via structure, such that the bottom of the via structure is directly laminated on the substrate base plate, and the pins are secured onto the via structure.
摘要翻译： 薄膜多层基板包括绝缘基板基板和包括多个导电层和形成在基板基板上的多个绝缘层的薄膜结构。 在薄膜结构中形成通孔结构并连接到薄层结构的导电层之一。 引脚连接到通孔结构，使得通孔结构的底部直接层压在基板基板上，并且引脚固定到通孔结构上。
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公开(公告)号：US07199718B2
公开(公告)日：2007-04-03
申请号：US11085491
申请日：2005-03-22
申请人： Shunichi Kikuchi , Masumi Suzuki , Michimasa Aoki
发明人： Shunichi Kikuchi , Masumi Suzuki , Michimasa Aoki
IPC分类号： G08B13/14
CPC分类号： G06K19/0773 , B31D1/028 , G06K19/07749 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/15153 , H01L2924/1517 , H01L2924/3025 , Y10T29/49117 , Y10T156/10 , Y10T156/1056 , Y10T156/1062 , H01L2224/0401
摘要： The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.
摘要翻译： 本发明提供了热扩散性优异的RFID标签。 RFID标签包括：基座，设置在基座上并形成通信天线的天线图案，与天线图形电连接并通过天线进行无线通信的电路芯片，与所述天线图案紧密接触地设置的盖 该基底以覆盖包括电路芯片的规定区域以外的天线图案，以及覆盖规定区域并与电路芯片热接触的绝缘热扩散材料。 绝缘热扩散材料的导热系数高于盖的热导率。
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公开(公告)号：US20060208094A1
公开(公告)日：2006-09-21
申请号：US11188346
申请日：2005-07-25
IPC分类号： G06K19/06
CPC分类号： G06K19/0775 , G06K19/07749 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/1134 , H01L2224/131 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： An RFID tag is provided which comprises: a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.
摘要翻译： 提供一种RFID标签，其包括：第一部分，其具有通过使用与金属填料混合的树脂材料的浆料形成在第一基部上的第一基座和通信天线; 以及设置在第一部分上的第二部分，其具有第二基底，设置在第二基底上并与第一部分上的天线电连接的金属贴片，以及通过凸块连接到金属贴片上的电路芯片，该电路 芯片通过天线执行无线电通信。
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公开(公告)号：US4783721A
公开(公告)日：1988-11-08
申请号：US79877
申请日：1987-07-30
申请人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
发明人： Haruhiko Yamamoto , Masahiro Suzuki , Yoshiaki Udagawa , Mitsuhiko Nakata , Koji Katsuyama , Izumi Ono , Shunichi Kikuchi
IPC分类号： G02F1/00 , G11B5/64 , G11B11/105 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4735 , G02F1/0036 , G11B11/10591 , G11B5/64 , H01L23/4332 , H01L2224/48091
摘要： A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
摘要翻译： 一种冷却系统，包括：冷却模块，其具有暴露于冷却剂流的传热板，并且朝向印刷电路板上的电路部件弹性偏置，用于将由所述部件散发的热传递到所述冷却剂;以及用于引导和 防止转印板的不正确对准，因为它们朝向电路部件弹性偏压。 冷却剂模块可以包括用于在转印板和电路部件之间建立热接触的焊料或低熔点金属。
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公开(公告)号：US07431218B2
公开(公告)日：2008-10-07
申请号：US11188346
申请日：2005-07-25
IPC分类号： G06K19/06
CPC分类号： G06K19/0775 , G06K19/07749 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/1134 , H01L2224/131 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： An RFID tag including a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.
摘要翻译： 一种RFID标签，包括：第一部分，其具有通过使用与金属填料混合的树脂材料的浆料形成在第一基底上的第一基底和通信天线; 以及设置在第一部分上的第二部分，其具有第二基底，设置在第二基底上并与第一部分上的天线电连接的金属贴片，以及通过凸块连接到金属贴片上的电路芯片，该电路 芯片通过天线执行无线电通信。
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10.发明授权Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device 有权具有吸热虚拟部件的印刷线路板装置以及印刷线路板装置的制造方法公开(公告)号：US06787711B2
公开(公告)日：2004-09-07
申请号：US10195547
申请日：2002-07-16
IPC分类号： H05K111
CPC分类号： H05K1/0209 , H05K1/0201 , H05K3/3494 , H05K2201/066 , H05K2201/09781 , H05K2201/10204 , H05K2203/1121 , H05K2203/304 , Y10T29/4913 , Y10T29/49144
摘要： A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.
摘要翻译： 印刷电路板装置包括安装在布线板上并构成印刷线路板装置中的电路的一部分的电路部分。 在电路部分的圆周上的布线板上设置有焊盘，并且焊盘与电路电隔离。 吸热虚拟部件安装在焊盘上，并且虚拟部件在回流焊接期间通过焊盘吸收来自电路部件的热量。
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