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1.发明授权Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei 有权使用导电颗粒作为核的倒装芯片安装工艺和凸块形成工艺公开(公告)号：US07726545B2
公开(公告)日：2010-06-01
申请号：US11886311
申请日：2006-03-13
申请人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
发明人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
CPC分类号： H05K3/3436 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/11524 , H01L2224/16 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/83886 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , Y10T29/49126 , H01L2224/13099 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.
摘要翻译： 根据本发明的倒装芯片安装工艺或凸块形成工艺的特征在于，导电颗粒固定在形成在电子部件上的电极上。 将包含焊料粉末，对流添加剂和树脂组分的组合物供应到电子部件的表面上，该表面设置有电极。 将所提供的组合物加热到使焊料粉末熔化的温度。 结果，对流添加剂沸腾或分解以产生气体。 所产生的气体在所提供的组合物内产生对流现象。 由于对流现象促使焊料粉末的移动，焊料粉末可以在组合物内自由移动。 导电颗粒用作焊料粉末的自组装和生长的核。 结果，允许熔融焊料粉末在导电颗粒附近自组装和生长，这导致连接或凸块的形成。
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2.发明申请Flip Clip Mounting Process And Bump-Forming Process Using Electrically-Conductive Particles 有权使用导电颗粒的翻转夹安装工艺和凸起成型工艺公开(公告)号：US20080165518A1
公开(公告)日：2008-07-10
申请号：US11886311
申请日：2006-03-13
申请人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
发明人： Takashi Ichiryu , Seiichi Nakatani , Seiji Karashima , Yoshihiro Tomita , Koichi Hirano , Toshio Fujii
IPC分类号： H01L23/498 , H05K3/36 , B23K1/20 , H01L21/60
CPC分类号： H05K3/3436 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/11524 , H01L2224/16 , H01L2224/73104 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/83886 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , Y10T29/49126 , H01L2224/13099 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.
摘要翻译： 根据本发明的倒装芯片安装工艺或凸块形成工艺的特征在于，导电颗粒固定在形成在电子部件上的电极上。 将包含焊料粉末，对流添加剂和树脂组分的组合物供应到电子部件的表面上，该表面设置有电极。 将所提供的组合物加热到使焊料粉末熔化的温度。 结果，对流添加剂沸腾或分解以产生气体。 所产生的气体在所提供的组合物内产生对流现象。 由于对流现象促使焊料粉末的移动，焊料粉末可以在组合物内自由移动。 导电颗粒用作焊料粉末的自组装和生长的核。 结果，允许熔融焊料粉末在导电颗粒附近自组装和生长，这导致连接或凸块的形成。
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公开(公告)号：US07927997B2
公开(公告)日：2011-04-19
申请号：US11579299
申请日：2006-03-07
IPC分类号： H01L21/445
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability.A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： 提供适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。 具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，并且在该状态下将半导体芯片20和电路板21浸入 浸渍浴40含有包含熔融的焊料颗粒的熔融树脂14一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。
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公开(公告)号：US20110162578A1
公开(公告)日：2011-07-07
申请号：US13046151
申请日：2011-03-11
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability.[Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： [问题]提供一种适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。
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公开(公告)号：US20070243664A1
公开(公告)日：2007-10-18
申请号：US11579299
申请日：2006-03-07
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： [问题]提供一种适用于下一代LSI的倒装安装并具有高生产率和高可靠性的倒装芯片安装方法和凸块形成方法。 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，并且半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。
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公开(公告)号：US08691683B2
公开(公告)日：2014-04-08
申请号：US13046151
申请日：2011-03-11
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , B23K35/0244 , H01L21/67144 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/75 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/75 , H01L2224/83192 , H01L2224/8321 , H01L2224/83815 , H01L2224/83886 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/18161 , H01L2924/30105 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10977 , H05K2203/1361 , Y02P70/613 , Y10T29/53178 , H01L2224/05599
摘要： [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.
摘要翻译： 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。
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公开(公告)号：US20050184381A1
公开(公告)日：2005-08-25
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R13/24 , H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/34 , H05K3/36 , H05K3/40 , H01R27/02 , H01L23/48 , H01R12/00 , H01R25/00 , H01R31/00 , H01R33/88 , H01R33/90 , H01R33/92 , H01R33/94
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.
摘要翻译： 提供了可以在没有通孔形成步骤的情况下制造的连接构件。 连接构件100包括绝缘基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面。
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公开(公告)号：US20090085227A1
公开(公告)日：2009-04-02
申请号：US11914581
申请日：2006-05-09
申请人： Tsukasa Shiraishi , Seiichi Nakatani , Seiji Karashima , Koichi Hirano , Takashi Kitae , Yoshihisa Yamashita , Takashi Ichiryu
发明人： Tsukasa Shiraishi , Seiichi Nakatani , Seiji Karashima , Koichi Hirano , Takashi Kitae , Yoshihisa Yamashita , Takashi Ichiryu
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L21/563 , H01L23/552 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/0603 , H01L2224/06505 , H01L2224/13099 , H01L2224/1403 , H01L2224/14505 , H01L2224/16225 , H01L2224/27013 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/83007 , H01L2224/83051 , H01L2224/83101 , H01L2224/83136 , H01L2224/83139 , H01L2224/83205 , H01L2224/83801 , H01L2224/83888 , H01L2224/9201 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , H05K3/303 , H05K3/323 , H05K3/3436 , H05K3/3484 , H05K2201/10568 , H05K2201/10977 , H05K2201/2036 , H05K2203/083 , H05K2203/087 , Y02P70/613 , H01L2924/00 , H01L2924/01047 , H01L2924/00014 , H01L2224/13111
摘要： A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body.
摘要翻译： 一种倒装芯片安装体，其中具有多个连接端子的电路基板和具有多个电极端子的电子部件（半导体芯片）彼此面对面地对准，其中树脂组合物由焊料粉末，树脂 并且夹在其间的对流添加剂，同时诸如间隔物的装置插入其间，以便在两个部件之间提供均匀的间隙，或者将电子部件（半导体芯片）放置在具有两个或 更多的突出部分，使得焊料粉末能够通过对流添加剂的沸腾而移动并且自聚集形成焊料层，从而电连接连接端子和电极端子; 以及这种安装体的安装方法。
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公开(公告)号：US20080047137A1
公开(公告)日：2008-02-28
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。
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公开(公告)号：US07258549B2
公开(公告)日：2007-08-21
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R12/00
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。
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