公开(公告)号：US20090085227A1

公开(公告)日：2009-04-02

申请号：US11914581

申请日：2006-05-09

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani ,  Seiji Karashima ,  Koichi Hirano ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani ,  Seiji Karashima ,  Koichi Hirano ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L21/563 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83007 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/83888 ,  H01L2224/9201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/303 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10568 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body.

摘要翻译： 一种倒装芯片安装体，其中具有多个连接端子的电路基板和具有多个电极端子的电子部件（半导体芯片）彼此面对面地对准，其中树脂组合物由焊料粉末，树脂 并且夹在其间的对流添加剂，同时诸如间隔物的装置插入其间，以便在两个部件之间提供均匀的间隙，或者将电子部件（半导体芯片）放置在具有两个或 更多的突出部分，使得焊料粉末能够通过对流添加剂的沸腾而移动并且自聚集形成焊料层，从而电连接连接端子和电极端子; 以及这种安装体的安装方法。

公开(公告)号：US08063486B2

公开(公告)日：2011-11-22

申请号：US11748111

申请日：2007-05-14

申请人： Koichi Hirano ,  Tsukasa Shiraishi ,  Seiichi Nakatani ,  Tatsuo Ogawa

发明人： Koichi Hirano ,  Tsukasa Shiraishi ,  Seiichi Nakatani ,  Tatsuo Ogawa

IPC分类号： H01L23/48

CPC分类号： H05K1/0271 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/09 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/09109 ,  H01L2924/00 ,  H01L2224/05599

摘要： A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.

摘要翻译： 具有基材10和形成在基材10的至少一个主表面上的电极11的电路板1包括形成在电极11的内部和侧部中的至少一个中的易剥离部分12， 电极11和容易剥离部12之间的粘合强度小于电极11与基材10之间的粘合强度。可以提供具有高连接可靠性并能实现窄间距安装的电路板。

公开(公告)号：US20060087020A1

公开(公告)日：2006-04-27

申请号：US11254379

申请日：2005-10-20

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tsukasa Shiraishi ,  Yoshitake Hayashi

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tsukasa Shiraishi ,  Yoshitake Hayashi

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2224/0401

摘要： In a semiconductor device, circuit boards are connected electrically to each other by via-conductors that penetrate sheet members, semiconductor elements arranged between substrates are contained in element-containing portions formed on the sheet members, and a low-elastic material whose elastic modulus is lower than the elastic modulus of the thermosetting resin composition of the sheet members is filled in the space between the semiconductor elements contained in the element-containing portions and the substrates opposing surfaces opposite to the mounting surfaces of the semiconductor elements. Thereby, a semiconductor device resistant to warping and deformation and having a high mounting reliability is provided.

摘要翻译： 在半导体装置中，电路板通过贯穿片状部件的通孔导体相互电连接，设置在基板之间的半导体元件容纳在形成在片状部件上的元件容纳部中，弹性模量为 低于片状部件的热固性树脂组合物的弹性模量填充在包含在元件容纳部分中的半导体元件与与半导体元件的安装表面相对的相对表面的基板之间的空间中。 因此，提供了耐翘曲变形并且具有高安装可靠性的半导体器件。

公开(公告)号：US20080265437A1

公开(公告)日：2008-10-30

申请号：US11884613

申请日：2006-03-08

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Seiji Karashima ,  Seiichi Natkatani ,  Hiroki Yabe

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Seiji Karashima ,  Seiichi Natkatani ,  Hiroki Yabe

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17132 ,  H01L2224/17136 ,  H01L2224/17151 ,  H01L2224/17155 ,  H01L2224/17177 ,  H01L2224/17515 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32052 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83007 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83887 ,  H01L2224/83888 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/09781 ,  H05K2201/10977 ,  H05K2203/046 ,  Y02P70/613 ,  H01L2224/1713 ,  H01L2224/1715 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).

摘要翻译： 具有半导体芯片的高可靠性，高生产率的封装及其制造方法。 在包括半导体芯片（10）和安装基板（30）的封装（100）中，在与安装基板侧相对的半导体芯片（10）的表面（10a）上形成多个电极端子（12） 分别对应于多个电极端子（12）的连接端子（32）形成在安装基板（30）上，安装基板（30）和电极端子（12）之间的连接端子（32）是电气 在自组装中形成的焊料凸点（17）共同连接，在芯片表面（10a）或表面（10a）上形成未与电极端子（12）和连接端子（32）连接的电极图案（20） 35）对应于芯片表面（10a），并且焊料（19）积聚在电极图案（20）上。

公开(公告)号：US07649267B2

公开(公告)日：2010-01-19

申请号：US11884613

申请日：2006-03-08

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Seiji Karashima ,  Seiichi Natkatani ,  Hiroki Yabe

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Seiji Karashima ,  Seiichi Natkatani ,  Hiroki Yabe

IPC分类号： H01L29/41 ,  H01L21/00

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17132 ,  H01L2224/17136 ,  H01L2224/17151 ,  H01L2224/17155 ,  H01L2224/17177 ,  H01L2224/17515 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32052 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83007 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83887 ,  H01L2224/83888 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/09781 ,  H05K2201/10977 ,  H05K2203/046 ,  Y02P70/613 ,  H01L2224/1713 ,  H01L2224/1715 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).

摘要翻译： 具有半导体芯片的高可靠性，高生产率的封装及其制造方法。 在包括半导体芯片（10）和安装基板（30）的封装（100）中，在与安装基板侧相对的半导体芯片（10）的表面（10a）上形成有多个电极端子（12） 分别对应于多个电极端子（12）的连接端子（32）形成在安装基板（30）上，安装基板（30）上的连接端子（32）和电极端子（12）电连接 集体地通过自组装形成的焊料凸点（17），在芯片表面（10a）或表面（35）上形成未与电极端子（12）和连接端子（32）连接的电极图案（20） 对应于芯片表面（10a）的安装基板（30），并且焊料（19）积聚在电极图案（20）上。

公开(公告)号：US07963310B2

公开(公告)日：2011-06-21

申请号：US12940803

申请日：2010-11-05

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani

IPC分类号： B32B37/00

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。

公开(公告)号：US07850803B2

公开(公告)日：2010-12-14

申请号：US11783750

申请日：2007-04-11

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani

IPC分类号： B32B37/00

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。

公开(公告)号：US20080011402A1

公开(公告)日：2008-01-17

申请号：US11783750

申请日：2007-04-11

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani

IPC分类号： H01B13/00 ,  G10K11/36

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。

公开(公告)号：US20050163982A1

公开(公告)日：2005-07-28

申请号：US11039778

申请日：2005-01-24

申请人： Masahiro Ono ,  Tsukasa Shiraishi

发明人： Masahiro Ono ,  Tsukasa Shiraishi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  B32B3/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13386 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29347 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29318 ,  H01L2224/29444 ,  H01L2224/05599

摘要： The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

摘要翻译： 本发明旨在提供一种当将半导体器件封装在电路基板上时，防止半导体器件的特性劣化以及互连断裂的半导体封装结构。 在具有安装在电路基板上的半导体器件的封装结构中，半导体器件的突起电极被放置在电路基板的输入/输出端子电极上，并通过与导电粘合剂结合而电连接和机械连接，半导体器件 通过预先形成在电路基板的主体的表面上的树脂膜粘结固定在电路基板上。 与使用常规的各向异性导电膜等的结构相比，该结构不会损坏半导体功能部件和互连，并且允许以较低的负载进行安装。

公开(公告)号：US08822753B2

公开(公告)日：2014-09-02

申请号：US12990291

申请日：2009-03-23

申请人： Tsukasa Shiraishi ,  Yusuke Kawakami

发明人： Tsukasa Shiraishi ,  Yusuke Kawakami

IPC分类号： A61F13/15 ,  A61F13/20 ,  A61F13/42

CPC分类号： A61F13/42

摘要： An absorbent article that enables the presence of moisture, for example, derived from urination to be easily recognized. The absorbent article includes an outer sheet provided on a side that faces a wearer's skin, i.e., on its side facing a liquid-absorbent structure with moisture visualizing elements. The moisture visualizing elements are formed by coating the outer sheet with hot melt composition comprising pH indicator mixed with pressure-sensitive adhesive ingredient. Two or more stripes of the hot melt composition forming the moisture visualizing elements extend in a longitudinal direction at least across a crotch region. Between the moisture visualizing elements and the liquid-absorbent structure, there is provided a barrier sheet or barrier sheets extending in a transverse direction so as to intersect the moisture visualizing elements comprising two or more stripes of the hot melt composition.

摘要翻译： 使得能够容易地识别例如来自排尿的水分的存在的吸收制品。 吸收性物品包括设置在面向穿着者皮肤的一侧的外侧片，即其面向具有水分可视化元件的吸液结构的一侧。 水分可视化元件通过用包含与压敏粘合剂成分混合的pH指示剂的热熔组合物涂布外片而形成。 形成水分可视化元件的热熔组合物的两条或更多条至少在裆部区域沿纵向方向延伸。 在水分可视化元件和吸液结构之间，设置有横向延伸的阻挡片或阻挡片，以与包含两个或更多个热熔组合物条纹的水分可视化元件相交。