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    Bonding LED Die to Lead Frame Strips
    3.
    发明申请
    Bonding LED Die to Lead Frame Strips 有权
    粘合LED芯片引导框架条

    公开(公告)号：US20160329473A1

    公开(公告)日：2016-11-10

    申请号：US14901705

    申请日：2014-06-18

    申请人： KONINKLIJKE PHILIPS N.V.

    发明人： Sze Kuang Lee ,  Paul Scott Martin ,  Albrecht Johannes Kraus ,  Chunheng Kang ,  Hui Ling Pan ,  Long Yin

    IPC分类号： H01L33/62 ,  H01L33/56 ,  H01L25/075

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.

    摘要翻译： 在一个实施例中，LED灯泡包括多个金属引线框架条，其包括至少第一条带，第二条带和第三条带。 第一LED管芯的底部电极电连接到第一条带的顶表面。 第二LED管芯的底部电极电连接到第二条带的顶表面。 第一LED芯片的顶部电极被引线接合到第二条带，并且第二LED管芯的顶部电极被引线接合到第三条带以将第一LED管芯和第二个LED管芯串联并联。 然后将条带弯曲以使LED管芯面向不同的方向，以在较小的空间中获得宽的发射图案。 然后将带封闭在具有电引线的导热灯泡中。

    THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME
    7.
    发明申请
    THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME 审中-公开
    具有嵌入式半导体器件和内置停止器的热增强半导体组件及其制造方法

    公开(公告)号：US20140048950A1

    公开(公告)日：2014-02-20

    申请号：US13753589

    申请日：2013-01-30

    申请人： BRIDGE SEMICONDUCTOR CORPORATION

    发明人： Charles W.C. LIN ,  Chia-Chung WANG

    IPC分类号： H01L23/34 ,  H01L21/50

    CPC分类号： H01L23/5389 ,  H01L23/3121 ,  H01L23/3185 ,  H01L23/367 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4848 ,  H01L2224/73267 ,  H01L2224/8314 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/48465 ,  H01L2924/00

    摘要： The present invention relates to a thermally enhanced semiconductor assembly and a method of making the same. In accordance with one preferred embodiment, the method includes: forming a stopper on a metal layer; mounting a semiconductor device on the metal layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the metal layer; forming a build-up circuitry that covers the stopper, the semiconductor device and the stiffener; providing a plated through-hole that provides an electrical connection between the build-up circuitry and the metal layer; and removing selected portions of the metal layer to form a thermal pad and a terminal. Accordingly, the thermal pad can provide excellent heat spreading, and the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry.

    摘要翻译： 本发明涉及一种热增强半导体组件及其制造方法。 根据一个优选实施例，该方法包括：在金属层上形成塞子; 使用所述止动件将半导体器件安装在所述金属层上作为所述半导体器件的布置引导件; 将加强件附接到所述金属层; 形成覆盖止动器，半导体器件和加强件的积聚电路; 提供电镀通孔，其在积聚电路和金属层之间提供电连接; 并且移除所述金属层的选定部分以形成热垫和端子。 因此，散热垫可以提供优异的散热，并且止动器可以准确地限制半导体器件的放置位置，并避免半导体器件与积聚电路之间的电连接故障。

    PACKAGE ASSEMBLY USING A CARRIER-FREE TECHNIQUE
    9.
    发明申请
    PACKAGE ASSEMBLY USING A CARRIER-FREE TECHNIQUE 审中-公开
    使用无载体技术的包装装配

    公开(公告)号：US20130344657A1

    公开(公告)日：2013-12-26

    申请号：US13769451

    申请日：2013-02-18

    申请人： NXP B. V.

    发明人： Chi-Feng Wu

    IPC分类号： H01L21/56 ,  H01L21/67

    CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L21/67242 ,  H01L23/3107 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  Y02P80/30 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： In an example embodiment, there is method for assembling semiconductor devices, the method comprises providing a temporary carrier having a plurality device die locations and a boundary edge. Surrounding the device die locations, electrical connection pads are applied. Device die in the plurality of device die locations are mounted; the device die have pad landings electrically coupled to active components with the device die. The pad landings of the device die are wire bonded to corresponding electrical connection pads. With the molding compound flowing to the boundary edge of the temporary carrier, the device die are encapsulated. In a particular example embodiment, the electrical connection pads may be ball bonds.

    摘要翻译： 在示例性实施例中，存在用于组装半导体器件的方法，该方法包括提供具有多个器件管芯位置和边界边缘的临时载体。 围绕器件管芯位置，应用电连接焊盘。 安装在多个器件管芯位置的器件管芯; 器件裸片具有与器件裸片电耦合到有源部件的焊盘平台。 器件裸片的焊盘接地线接合到相应的电连接焊盘。 当模塑料流到临时载体的边界边缘时，器件管芯被封装。 在特定示例性实施例中，电连接焊盘可以是球形焊接。