公开(公告)号：US11370933B2

公开(公告)日：2022-06-28

申请号：US15766777

申请日：2016-10-14

申请人： TORAY FILMS EUROPE

发明人： Keltoum Ouzineb ,  Maria Cristina Penache ,  Laurent Derveaux

IPC分类号： C09D133/06 ,  C09D5/02 ,  C08J3/05 ,  C08J3/24 ,  C08J7/04 ,  C09D5/00 ,  C08J7/043 ,  C08J7/048 ,  C08J7/056 ,  B32B7/12 ,  B32B7/04 ,  B32B27/08 ,  B32B27/36 ,  B32B37/16 ,  B32B27/26 ,  B32B15/08 ,  C08K5/00 ,  C09J5/00 ,  C09J133/10 ,  C09J5/06 ,  C09J167/00 ,  C09J179/02 ,  C09J167/02 ,  C09J133/06 ,  C09J133/08 ,  C09J133/04 ,  C09J179/04 ,  C09J179/00 ,  C09J133/02 ,  C09J161/26 ,  C09J161/28 ,  C08L67/00 ,  C08L61/26 ,  C08L33/04 ,  C08L33/06 ,  C08L79/02 ,  C08L79/04 ,  C08L61/28 ,  C08L79/00 ,  C08L33/08 ,  C08L33/02 ,  C08L33/10 ,  C08L67/02

摘要： The aim of the invention is to provide polyester/primer/metallic coating composite films having good adherence of the metallic coating in dry and humid conditions. Said films also form a good gas barrier: oxygen permeability less than or equal to 0.8 cc/m2/d; water vapour permeability less than or equal to 0.3 g/m2/d. To this end, the invention concerns a composite film comprising a polyester substrate, at least one coating adhering on at least one of the faces of the substrate and at least one layer of primer for cross-linked adhesion between the substrate and the coating. Said primer comprises at least one acrylic and/or methacrylic polymer P1, at least one acrylic and/or methacrylic polymer P2 different from P1, at least one cross-linking agent, and, preferably, at least one polyester that is soluble or dispersible in water: —P1 having a gel content TG1>70% by dry weight with respect to P1; —P2 having a gel content TG2≤TG1 and ≤20% by dry weight, with respect to P2; —P1 having a surface-grafted free weak acid content≥0.8 in meq/g of polymer; —[P2]≤60% by weight on dry by weight in respect to P1+P2. The method for producing said film, the adhering primer, and the articles obtained using said film, also form part of the present invention.

公开(公告)号：US10767085B2

公开(公告)日：2020-09-08

申请号：US16406124

申请日：2019-05-08

申请人： KYOCERA Corporation

发明人： Masakazu Fujiwara ,  Hiroshi Fukukawa

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  C09J9/02 ,  C09J7/38 ,  H01L23/00 ,  H01B1/22 ,  C09J179/04 ,  H01L21/52 ,  C09J11/04

摘要： There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.

公开(公告)号：US10370325B2

公开(公告)日：2019-08-06

申请号：US15560708

申请日：2016-02-19

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Masayuki Katagiri ,  Tatsuya Shima ,  Keita Tokuzumi

IPC分类号： C07C261/02 ,  C08G14/12 ,  C08G59/20 ,  C08G61/02 ,  C08J5/04 ,  C08J5/24 ,  C08G65/18 ,  C09J161/06 ,  C09J163/00 ,  C08L61/04 ,  C08L61/34 ,  C08L63/00 ,  C08L65/00 ,  H01L23/14 ,  H01L23/29 ,  H01L23/31 ,  C09J11/06 ,  C08G73/06 ,  C09J179/04

摘要： The present invention provides a novel cyanate ester compound which has excellent solvent solubility and from which a hardened product having a low coefficiency of thermal expansion and excellent flame retardancy and heat resistance is obtained. The present invention is a cyanate ester compound obtained by cyanating a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin.

公开(公告)号：US09994741B2

公开(公告)日：2018-06-12

申请号：US14967353

申请日：2015-12-13

申请人： James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

发明人： James L. Hedrick ,  Robert Dennis Miller ,  Deborah Ann Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

IPC分类号： C08K3/04 ,  C09J9/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  C09J11/04 ,  C09J11/06 ,  C09J179/08 ,  C09J179/04 ,  C09J183/04 ,  B82Y30/00 ,  B82Y40/00 ,  C08K7/24 ,  C08K5/5425 ,  C08K5/5465 ,  C08K5/548 ,  C08K5/544

CPC分类号： C09J9/00 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/041 ,  C08K5/5425 ,  C08K5/544 ,  C08K5/5465 ,  C08K5/548 ,  C08K7/24 ,  C08K2201/01 ,  C09J11/04 ,  C09J11/06 ,  C09J179/04 ,  C09J179/08 ,  C09J183/04 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/11831 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/1369 ,  H01L2224/16147 ,  H01L2224/27444 ,  H01L2224/27452 ,  H01L2224/27612 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/83895 ,  H01L2224/9202 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06544 ,  Y10S977/742 ,  Y10S977/833 ,  Y10S977/843 ,  H01L2924/01006 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

摘要： The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

公开(公告)号：US09296928B2

公开(公告)日：2016-03-29

申请号：US14235334

申请日：2011-07-28

申请人： Yun Kil Shin

发明人： Yun Kil Shin

IPC分类号： C09J133/02 ,  C09J161/06 ,  C09J163/00 ,  C09J179/04 ,  C09J179/08 ,  C08G59/18 ,  B32B7/12 ,  C09D133/02

CPC分类号： C09J133/02 ,  B32B7/12 ,  C08G59/186 ,  C08L61/06 ,  C08L63/00 ,  C08L79/04 ,  C08L79/085 ,  C09D133/02 ,  C09J161/06 ,  C09J163/00 ,  C09J179/04 ,  C09J179/085 ,  Y10T428/2982 ,  Y10T428/31515

摘要： A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.

摘要翻译： 具有低应力，在高温高湿环境下粘合性好的树脂组合物，可用于低应力，高湿度敏感度电子封装中的粘合剂应用。 优选地，柔性环氧酐加合物改性的固体双马来酰亚胺和固体苯并恶嗪树脂组合物，其可以在高温和高湿度条件下存活并保持良好的粘合强度并且最小化由硅模和基材之间的热膨胀失配系数引起的应力， 球栅阵列焊锡掩模或智能卡聚对苯二甲酸乙二醇酯或银或铜金属引线框架。

公开(公告)号：US20150218429A1

公开(公告)日：2015-08-06

申请号：US14419050

申请日：2013-09-24

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Dmitriy Salnikov ,  Ilya Gorodisher ,  Robert J. Webb

IPC分类号： C09J179/04 ,  C09D179/04

CPC分类号： C09J179/04 ,  C08G65/26 ,  C08G65/2612 ,  C08G65/2627 ,  C08G73/0233 ,  C08G73/06 ,  C08K5/357 ,  C08L51/04 ,  C08L79/02 ,  C08L79/04 ,  C09D179/04

摘要： A polymerizable composition comprising a benzoxazine compound and a catalyst is described. The polymerizable composition may be cured to produce compositions useful in coating, sealants, adhesive and many other applications.

摘要翻译： 描述了包含苯并恶嗪化合物和催化剂的可聚合组合物。 可聚合的组合物可以固化以产生可用于涂料，密封剂，粘合剂和许多其它应用的组合物。

公开(公告)号：US20120296038A1

公开(公告)日：2012-11-22

申请号：US13110504

申请日：2011-05-18

申请人： ANDREW J. ROURKE

发明人： ANDREW J. ROURKE

IPC分类号： C09J139/04 ,  C09J135/02 ,  C09J11/00 ,  C08F4/34 ,  C09J179/04 ,  C09J167/07

CPC分类号： C09J177/12 ,  B32B37/12 ,  C04B26/16 ,  C04B40/0666 ,  C04B2111/00637 ,  C04B2111/00715 ,  C08F222/1006 ,  C09J4/00 ,  C09J129/12 ,  C09J131/04 ,  F16B13/145

摘要： An anchoring adhesive includes effective amounts of an isocyanurate compound and a vinyl ester compound that react and cure to form a composition having high compressive strength, high tensile strength and low shrinkage. The anchoring adhesive can be used to firmly bond anchor pins to boreholes in concrete, steel, wood, and other substrates.

摘要翻译： 锚定粘合剂包括有效量的异氰脲酸酯化合物和乙烯基酯化合物，其反应并固化以形成具有高抗压强度，高拉伸强度和低收缩率的组合物。 锚固粘合剂可用于将锚定销牢固地粘合到混凝土，钢，木材和其他基材中的钻孔中。

公开(公告)号：US20050222330A1

公开(公告)日：2005-10-06

申请号：US10815442

申请日：2004-04-01

申请人： Tadashi Takano

发明人： Tadashi Takano

IPC分类号： C09J179/04 ,  C08F8/30 ,  C08F8/34 ,  C09J4/00 ,  C09J11/08 ,  C09J133/00 ,  C09J135/00 ,  C09J147/00 ,  C08L39/04

CPC分类号： C08F8/34 ,  C08F8/30

摘要： A method for improving the cohesive strength at elevated temperature of a die attach adhesive formulation of a liquid curable resin, initiator, and filler, comprises adding to the adhesive formulation an aromatic bismaleimide resin powder that does not dissolve in the curable resin.

摘要翻译： 一种提高液态可固化树脂，引发剂和填料的芯片附着粘合剂配方在高温下的内聚强度的方法包括向粘合剂制剂中加入不溶于可固化树脂的芳族双马来酰亚胺树脂粉末。

公开(公告)号：US06896931B2

公开(公告)日：2005-05-24

申请号：US10432556

申请日：2002-09-30

申请人： Masami Aizawa

发明人： Masami Aizawa

IPC分类号： B05D3/02 ,  B05D7/24 ,  B29C41/08 ,  B29K79/00 ,  B29L7/00 ,  C08G73/18 ,  C08J7/04 ,  C09D179/04 ,  C09J179/04

CPC分类号： C09J179/04 ,  B05D3/0254 ,  C08G73/18 ,  C09D179/04

摘要： There are provided a method for forming a polybenzimidazole coating on a surface of a substrate, and a method for forming a polybenzimidazole film. The method for forming a polybenzimidazole coating comprises the steps of: coating a solution containing a polybenzimidazole prepolymer onto a surface of a substrate; and heating the coated substrate to cyclize the prepolymer and thus to form a cured coating on the surface of the substrate. The method for forming a polybenzimidazole film comprises separating the cured coating, formed by the above method, from the substrate.

摘要翻译： 提供了在基材表面上形成聚苯并咪唑涂层的方法和形成聚苯并咪唑膜的方法。 形成聚苯并咪唑涂层的方法包括以下步骤：将含有聚苯并咪唑预聚物的溶液涂布在基材的表面上; 并加热涂覆的基材以环化预聚物，从而在基材的表面上形成固化的涂层。 形成聚苯并咪唑膜的方法包括将由上述方法形成的固化涂层与基材分离。

公开(公告)号：US5646241A

公开(公告)日：1997-07-08

申请号：US475006

申请日：1995-06-07

申请人： Stephen M. Dershem ,  Deborah L. Derfelt

发明人： Stephen M. Dershem ,  Deborah L. Derfelt

IPC分类号： C08G73/06 ,  C09J4/00 ,  C09J11/06 ,  C09J179/04 ,  C08G73/00 ,  C08K5/16

CPC分类号： C09J179/04 ,  C08G73/0655 ,  C09J11/06 ,  C09J4/00

摘要： In accordance with the present invention, there are provided adhesive formulations containing small amounts of bleed control agent, which render the invention compositions extremely resistant to resin bleed. Several different types of bleed control agents are contemplated for use in the practice of the present invention, e.g., cationic surfactants, tertiary amines, tertiary phosphines, amphoteric surfactants, polyfunctional compounds, and the like, as well as mixtures of any two or more thereof.

摘要翻译： 根据本发明，提供了含有少量渗血控制剂的粘合剂制剂，其使得本发明组合物对树脂流出物具有极高的抗性。 考虑用于实施本发明的几种不同类型的排泄控制剂，例如阳离子表面活性剂，叔胺，叔膦，两性表面活性剂，多官能化合物等，以及其任何两种或多种的混合物 。