公开(公告)号：US07446419B1

公开(公告)日：2008-11-04

申请号：US11588012

申请日：2006-10-26

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L23/48

CPC classification number: H01L24/83 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/85 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/1308 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48511 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85207 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/05599 ,  H01L2924/01004

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line and includes stacked metal balls that are welded together.

Abstract translation: 半导体芯片组件包括：半导体芯片，其包括导电焊盘，包括布线线和金属柱的导电迹线，电连接布线线和焊盘的连接接头以及密封剂。 芯片和金属柱嵌入密封剂中，引导线横向延伸超过金属柱朝向芯片，并且金属柱焊接到路由线，并且包括焊接在一起的堆叠的金属球。

公开(公告)号：US07419851B2

公开(公告)日：2008-09-02

申请号：US11216783

申请日：2005-08-31

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/44

CPC classification number: H01L21/4853 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3512 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a metal containment wall and a solder layer in which the metal containment wall includes a cavity and the solder terminal contacts the metal containment wall in the cavity, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects the routing line and the pad, etching the metal base to reduce contact area between the metal base and the routing line and between the metal base and the metal containment wall, and providing a solder terminal that includes the solder layer.

Abstract translation: 制造半导体芯片组件的方法包括提供金属基底，布线线，金属容纳壁和焊料层，其中金属容纳壁包括空腔，并且焊接端子接触空腔中的金属容纳壁，机械地附接 形成连接所述布线线和所述衬垫的连接接头，蚀刻所述金属基底以减少所述金属基底与所述布线线之间以及所述金属基底与所述金属容纳壁之间的接触面积，以及 提供包括焊料层的焊接端子。

公开(公告)号：US07417314B1

公开(公告)日：2008-08-26

申请号：US11604626

申请日：2006-11-27

Applicant: Charles W. C. Lin ,  Cheng-Chung Chen ,  Cheng-Lien Chiang

Inventor： Charles W. C. Lin ,  Cheng-Chung Chen ,  Cheng-Lien Chiang

IPC: H01L23/48 ,  H01L23/28

CPC classification number: H01L23/3128 ,  H01L21/4832 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13008 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is adjacent to the bumped terminal and extends laterally beyond the bumped terminal and the filler, and the filler contacts the bumped terminal in a cavity that extends through the bumped terminal.

Abstract translation: 半导体芯片组件包括：半导体芯片，其包括导电焊盘，包括布线线，凸起端子和填充物的导电迹线，电连接布线线和焊盘的连接接头以及密封剂。 路由线与凸起端子相邻，并且横向延伸超过凸起的端子和填充物，并且填充物在延伸穿过凸起端子的空腔中与凸起的端子接触。

公开(公告)号：US07414319B2

公开(公告)日：2008-08-19

申请号：US11213398

申请日：2005-08-26

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L23/48

CPC classification number: H01L21/4853 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3512 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal containment wall and a solder terminal, and a connection joint that electrically connects the routing line and the pad. The metal containment wall includes a cavity, and the solder terminal contacts the metal containment wall in the cavity and is spaced from the routing line.

Abstract translation: 半导体芯片组件包括：半导体芯片，其包括导电焊盘，包括布线线的导电迹线，金属容纳壁和焊接端子;以及连接所述布线线和所述焊盘的连接接头。 金属容纳壁包括空腔，并且焊接端子接触空腔中的金属容纳壁并且与布线线路间隔开。

公开(公告)号：US07232707B1

公开(公告)日：2007-06-19

申请号：US11145210

申请日：2005-06-03

Applicant: Chia-Chung Wang ,  Charles W. C. Lin

Inventor： Chia-Chung Wang ,  Charles W. C. Lin

IPC: H01L21/44

CPC classification number: H05K3/3436 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05556 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3512 ,  H05K2201/09036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to the routing line, forming a connection joint that electrically connects the routing line and the pad, etching the metal base to form a metal pillar with a tip adjacent to the trench, and providing a contact terminal that includes the pillar etch mask and is a permanent part of the assembly.

Abstract translation: 制造半导体芯片组件的方法包括提供延伸到沟槽中的金属基底，布线线和柱蚀刻掩模，将半导体芯片机械地附接到布线线，形成连接接头，该连接接头将布线线和 蚀刻金属基底以形成具有与沟槽相邻的尖端的金属柱，并且提供包括柱蚀刻掩模的接触端子并且是组件的永久部分。

公开(公告)号：US07192803B1

公开(公告)日：2007-03-20

申请号：US10403736

申请日：2003-03-31

Applicant: Charles W. C. Lin ,  Cheng-Lien Chiang

Inventor： Charles W. C. Lin ,  Cheng-Lien Chiang

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/05624 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/48

Abstract: A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a routing line, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the routing line is disposed on a side of the insulative base that faces towards the chip, then etching the metal base, forming an interconnect in a via, and forming a connection joint in an opening, wherein the via extends through the insulative base, the opening extends through the insulative base, the interconnect extends through the insulative base and is electrically connected to the routing line, and the connection joint electrically connects the routing line and the pad. Preferably, the opening extends through an insulative adhesive that attaches the routing line to the chip.

Abstract translation: 制造半导体芯片组件的方法包括提供半导体芯片，金属基底，绝缘基底和布线线，其中所述芯片包括导电垫，所述金属基底设置在所述绝缘基底的远离所述绝缘基底的一侧。 芯片和布线线设置在面向芯片的绝缘基座的一侧，然后蚀刻金属基底，在通孔中形成互连，并在开口中形成连接接头，其中通孔延伸通过 绝缘基座，开口延伸穿过绝缘基座，互连件延伸穿过绝缘基座并电连接到布线线，并且连接接头电连接布线线和衬垫。 优选地，开口延伸穿过将路由线连接到芯片的绝缘粘合剂。

公开(公告)号：US07132741B1

公开(公告)日：2006-11-07

申请号：US10994836

申请日：2004-11-22

Applicant: Charles W. C. Lin ,  Cheng-Lien Chiang

Inventor： Charles W. C. Lin ,  Cheng-Lien Chiang

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/12

CPC classification number: H01L21/6835 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05556 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/82 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with and integral with the bumped terminal and extends laterally beyond the bumped terminal and the metal filler, and the metal filler contacts the bumped terminal in a cavity that extends through the bumped terminal.

Abstract translation: 半导体芯片组件包括：包括导电焊盘的导电迹线，包括布线线，凸起端子和金属填料的导电迹线，将布线线和焊盘电连接的连接接头和密封剂的半导体芯片。 路由线与凸起端子相邻并且与凸起端子成一体并且横向延伸超过凸起端子和金属填充物，并且金属填料在延伸穿过凸起端子的空腔中接触凸起端子。

公开(公告)号：US07009297B1

公开(公告)日：2006-03-07

申请号：US10922280

申请日：2004-08-19

Applicant: Cheng-Lien Chiang ,  Charles W. C. Lin

Inventor： Cheng-Lien Chiang ,  Charles W. C. Lin

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L21/4832 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16237 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48511 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01004

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal particle, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line extends laterally beyond the metal particle towards the chip, and the chip and the metal particle are embedded in the encapsulant and extend vertically beyond the routing line in the same direction.

Abstract translation: 半导体芯片组件包括：半导体芯片，其包括导电焊盘，包括布线线和金属颗粒的导电迹线，电连接布线线和焊盘的连接接头以及密封剂。 路由线横向延伸超过金属颗粒朝向芯片，并且芯片和金属颗粒嵌入密封剂中，并沿相同方向垂直延伸超过路由线。

公开(公告)号：US06740576B1

公开(公告)日：2004-05-25

申请号：US10165483

申请日：2002-06-06

Applicant: Charles W. C. Lin ,  Cheng-Lien Chiang

Inventor： Charles W. C. Lin ,  Cheng-Lien Chiang

IPC: H01L2144

CPC classification number: H01L23/5389 ,  H01L2224/04105 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/11474 ,  H01L2224/12 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/19 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H05K3/4046 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace and a metal base, wherein the conductive trace includes a routing line and a contact terminal, the routing line is disposed outside the metal base, the contact terminal extends from the routing line through the metal base, the contact terminal includes a plated metal that contacts and extends through the metal base, the plated metal forms a peripheral sidewall portion of the contact terminal, and the plated metal surrounds a central surface area without extending into the central surface area, then mechanically attaching the chip to the conductive trace, removing a portion of the metal base that contacts the plated metal, and forming a connection joint that contacts and electrically connects the conductive trace and the pad.

Abstract translation: 制造半导体芯片组件的方法包括提供包括导电焊盘，提供导电迹线和金属基底的半导体芯片，其中导电迹线包括布线线和接触端子，布线线设置在金属基底的外侧 接触端子从布线线延伸通过金属基底，接触端子包括接触并延伸通过金属基底的电镀金属，电镀金属形成接触端子的周边侧壁部分，电镀金属围绕中心 表面区域，而不延伸到中心表面区域，然后将芯片机械地附接到导电迹线，去除与电镀金属接触的金属基底的一部分，以及形成接触和电连接导电迹线和焊盘的连接接头。

公开(公告)号：US06699780B1

公开(公告)日：2004-03-02

申请号：US10302642

申请日：2002-11-23

Applicant: Cheng-Lien Chiang ,  Charles W. C. Lin

Inventor： Cheng-Lien Chiang ,  Charles W. C. Lin

IPC: H01L2144

CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/1134 ,  H01L2224/1148 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/3025 ,  H05K3/4046 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05124

Abstract: A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip with upper and lower surfaces, wherein the upper surface includes a conductive pad, providing a conductive trace, then disposing an insulative adhesive between the conductive trace and the chip, thereby mechanically attaching the conductive trace to the chip such that the conductive trace overlaps the pad, the adhesive contacts and is sandwiched between the conductive trace and the pad, and the conductive trace and the pad are electrically isolated from one another, then removing the adhesive between the conductive trace and the pad, and then forming a connection joint that contacts and electrically connects the conductive trace and the pad. Preferably, the adhesive is removed by laser ablation then plasma etching.

Abstract translation: 将导电迹线连接到半导体芯片的方法包括向半导体芯片提供上表面和下表面，其中上表面包括导电焊盘，提供导电迹线，然后在导电迹线和芯片之间设置绝缘粘合剂，从而 将导电迹线机械地附接到芯片，使得导电迹线与焊盘重叠，粘合剂接触并夹在导电迹线和焊盘之间，并且导电迹线和焊盘彼此电隔离，然后将粘合剂 导电迹线和焊盘，然后形成接触和电连接导电迹线和焊盘的连接接头。 优选地，通过激光烧蚀等离子体蚀刻去除粘合剂。